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ATSAM3N1AB-AU
Public Made by Adomby adom
Microchip Tech Pre-ordered MCUs, LQFP-48(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ATSAM3N1AB-AU
Microchip Tech · Pre-ordered MCUs · LQFP-48(7x7)
ATSAM3N1AB-AU from Microchip Tech, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ADVREF | power_in | ADC reference voltage input; conversions extend from 0 V to ADVREF, which may equal the analog supply, and an external decoupling capacitor is required for noise filtering. |
| 2 | GND | power_in | Ground connection. |
| 3 | PB0/AD4 | bidirectional | PIO line PB0 multiplexed with ADC analog input AD4 (ADC input range 0 V to ADVREF). |
| 4 | PB1/AD5 | bidirectional | PIO line PB1 multiplexed with ADC analog input AD5 (ADC input range 0 V to ADVREF). |
| 5 | PB2/AD6 | bidirectional | PIO line PB2 multiplexed with ADC analog input AD6 and UART1 receive URXD1. |
| 6 | PB3/AD7 | bidirectional | PIO line PB3 multiplexed with ADC analog input AD7 and UART1 transmit UTXD1. |
| 7 | VDDIN | power_in | Supply for the voltage regulator, ADC and DAC; the voltage regulator operates from 1.8 V to 3.6 V. |
| 8 | VDDOUT | power_out | Output of the on-chip voltage regulator that powers VDDCORE when the internal regulator is used; its voltage limits are in Section 5.3, which is not in the extracted text. |
| 9 | PA17/PGMD5/AD0 | bidirectional | PIO line PA17 multiplexed with Fast Flash programming data PGMD5 and ADC analog input AD0. |
| 10 | PA18/PGMD6/AD1 | bidirectional | PIO line PA18 multiplexed with Fast Flash programming data PGMD6 and ADC analog input AD1. |
| 11 | PA19/PGMD7/AD2 | bidirectional | PIO line PA19 multiplexed with Fast Flash programming data PGMD7 and ADC analog input AD2 (wake-up WKUP9). |
| 12 | PA20/AD3 | bidirectional | PIO line PA20 multiplexed with ADC analog input AD3 (wake-up WKUP10). |
| 13 | VDDIO | power_in | Supply for peripheral I/O lines, backup part, 32 kHz crystal oscillator and oscillator pads, 1.62 V to 3.6 V; it must always be higher than or equal to VDDCORE. |
| 14 | PA16/PGMD4 | bidirectional | PIO line PA16 multiplexed with Fast Flash programming data PGMD4. |
| 15 | PA15/PGMD3 | bidirectional | PIO line PA15 multiplexed with Fast Flash programming data PGMD3. |
| 16 | PA14/PGMD2 | bidirectional | PIO line PA14 multiplexed with Fast Flash programming data PGMD2 and SPI clock SPCK. |
| 17 | PA13/PGMD1 | bidirectional | PIO line PA13 multiplexed with Fast Flash programming data PGMD1 and SPI MOSI. |
| 18 | VDDCORE | power_in | Core supply powering the processor, embedded memories and peripherals, 1.62 V to 1.95 V. |
| 19 | PA12/PGMD0 | bidirectional | PIO line PA12 multiplexed with Fast Flash programming data PGMD0 and SPI MISO. |
| 20 | PA11/PGMM3 | bidirectional | PIO line PA11 multiplexed with programming mode input PGMM3 and SPI NPCS0. |
| 21 | PA10/PGMM2 | bidirectional | PIO line PA10 multiplexed with programming mode input PGMM2, UART0 transmit UTXD0 and SPI NPCS2. |
| 22 | PA9/PGMM1 | bidirectional | PIO line PA9 multiplexed with programming mode input PGMM1, UART0 receive URXD0 and SPI NPCS1. |
| 23 | PA8/XOUT32/PGMM0 | bidirectional | PIO line PA8 multiplexed with programming mode input PGMM0, 32 kHz crystal output XOUT32 and ADC trigger ADTRG. |
| 24 | PA7/XIN32/PGMNVALID | bidirectional | PIO line PA7 multiplexed with 32 kHz crystal input XIN32 and the programming data-direction output PGMNVALID (active low). |
| 25 | TDI/PB4 | bidirectional | JTAG test data input TDI multiplexed with PIO line PB4 (also TWI1 data TWD1). |
| 26 | PA6/PGMNOE | bidirectional | PIO line PA6 multiplexed with programming read input PGMNOE (active low). |
| 27 | PA5/PGMRDY | bidirectional | PIO line PA5 multiplexed with programming ready output PGMRDY (active high). |
| 28 | PA4/PGMNCMD | bidirectional | PIO line PA4 multiplexed with programming command input PGMNCMD (active low) and TWI0 clock TWCK0. |
| 29 | NRST | bidirectional | Microcontroller reset, active low, operating as an input or output. |
| 30 | TST | input | Test select: low at power-up selects normal operation and high selects test or FFPI mode; it has an internal pull-down of about 15 kΩ and may be left unconnected for normal operation. |
| 31 | PA3 | bidirectional | PIO line PA3 multiplexed with TWI0 data TWD0 and SPI NPCS3. |
| 32 | PA2/PGMEN2 | bidirectional | PIO line PA2 multiplexed with programming enable input PGMEN2. |
| 33 | VDDIO | power_in | Supply for peripheral I/O lines, 1.62 V to 3.6 V; it must always be higher than or equal to VDDCORE. |
| 34 | GND | power_in | Ground connection. |
| 35 | PA1/PGMEN1 | bidirectional | PIO line PA1 multiplexed with programming enable input PGMEN1 and TC0 output TIOB0. |
| 36 | PA0/PGMEN0 | bidirectional | PIO line PA0 multiplexed with programming enable input PGMEN0 and TC0 signal TIOA0. |
| 37 | TDO/TRACESWO/PB5 | output | JTAG test data output TDO, multiplexed with serial-wire trace output TRACESWO and PIO line PB5; outside debug mode it is in input mode, so its internal pull-up must be enabled to avoid floating-input current. |
| 38 | JTAGSEL | input | JTAG selection input (active high): with TST low at power-up, a high level enables IEEE 1149.1 boundary scan, and a chip reset is required after it is changed. |
| 39 | TMS/SWDIO/PB6 | bidirectional | Test mode select TMS for JTAG or serial-wire data SWDIO, multiplexed with PIO line PB6. |
| 40 | TCK/SWCLK/PB7 | input | Test clock TCK for JTAG or serial-wire clock SWCLK, multiplexed with PIO line PB7. |
| 41 | VDDCORE | power_in | Core supply powering the processor, embedded memories and peripherals, 1.62 V to 1.95 V. |
| 42 | ERASE/PB12 | bidirectional | PIO line PB12 multiplexed with the ERASE pin, whose function is described in Section 6.5 (not in the extracted text). |
| 43 | PB10 | bidirectional | PIO line PB10 whose Schmitt trigger can be disabled through the PIO registers. |
| 44 | PB11 | bidirectional | PIO line PB11 whose Schmitt trigger can be disabled through the PIO registers. |
| 45 | XOUT/PB8 | bidirectional | Main oscillator output XOUT for a 3 to 20 MHz crystal, multiplexed with PIO line PB8. |
| 46 | XIN/P/PB9/GMCK | input | Main oscillator input XIN for a 3 to 20 MHz crystal, multiplexed with PIO line PB9 and the programming clock PGMCK. |
| 47 | VDDIO | power_in | Supply for peripheral I/O lines, 1.62 V to 3.6 V; it must always be higher than or equal to VDDCORE. |
| 48 | VDDPLL | power_in | Supply for the PLL, the Fast RC oscillator and the 3 to 20 MHz oscillators, 1.62 V to 1.95 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | LQFP-48(7x7) |
| Category | Embedded Processors & Controllers |
| Pins | 48 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VDDCORE core supply voltage | VDDCORE | 1.62 | 1.95 | V | 16 | ||
| VDDIO I/O supply voltage | VDDIO | 1.62 | 3.6 | V | 16 | ||
| VDDIN voltage regulator supply voltage | VDDIN | 1.8 | 3.6 | V | Voltage Regulator | 16 | |
| VDDPLL PLL and oscillator supply voltage | VDDPLL | 1.62 | 1.95 | V | 16 | ||
| Main supply for ADC and DAC usable | 3 | V | With Main Supply >= 3 V all peripherals usable; below 3 V ADC and DAC not usable | 18 | |||
| VDDIO minimum operating voltage before VDDCORE reaches VDDCORE(min) at power-up | VDDIO | 1.62 | V | Power-up sequencing | 16 | ||
| VDDIO rising slope when VDDCORE rises with VDDIO | 5 | V/ms | VDDCORE rising at the same time as VDDIO | 16 | |||
| VDDIO level at power-up before VDDIN reaches 1.0 V | VDDIO | 0.6 | V | At power-up, before VDDIN reaches 1.0 V | 17 | ||
| VDDIO relative to VDDIN at startup | VDDIO | 0.5 | V | VDDIO at or below VDDIN voltage + 0.5 V | 17 | ||
| Voltage regulator static current in Normal mode | 700 | µA | Normal mode, static current | 17 | |||
| Voltage regulator quiescent current in Wait mode | 7 | µA | Wait mode | 17 | |||
| Voltage regulator current consumption in Backup mode | 1 | µA | Backup mode; VDDOUT driven internally to GND | 17 | |||
| Voltage regulator default output voltage | VDDOUT | 1.8 | V | Default output voltage | 17 | ||
| Voltage regulator start-up time to Normal mode | 100 | µs | Start-up to Normal mode | 17 | |||
| Backup mode total consumption | 3 | µA | Backup mode, total current consumption | 21 | |||
| Backup mode wake-up time | 0.1 | ms | Wake-up from Backup mode | 21 | |||
| Wait mode current consumption | 5 | µA | 5 µA on VDDCORE; 15 µA total with internal voltage regulator; 8 µA total without internal voltage regulator (Wait mode) | 21 | |||
| Wait mode wake-up time | 10 | µs | Wake-up from Wait mode | 21 | |||
| Supply monitor threshold on VDDIO | 1.9 | 3.4 | V | Programmable in 100 mV steps (SMTH) | 253 | ||
| Fast RC low-power oscillator frequency (Slow Clock RC) | 22 | 42 | kHz | 22-42 kHz Low Power RC Oscillator | 249 | ||
| Slow clock crystal frequency | 32.768 | kHz | 32 kHz crystal oscillator, typical Slow Clock | 243 | |||
| 3 to 20 MHz crystal oscillator frequency range | 3 | 20 | MHz | 3 to 20 MHz oscillator | 16 | ||
| SPI clock pad maximum frequency | 45 | MHz | High speed pads, SPI clock lines | 22 | |||
| Other I/O line maximum frequency | 35 | MHz | High speed pads, other lines than SPI clock | 22 | |||
| I/O pull-up and pull-down resistance | 100 | kΩ | Typical value for all I/Os | 22 | |||
| NRST pull-up resistance to VDDIO | 100 | kΩ | Permanent pull-up to VDDIO | 24 | |||
| ERASE pin pull-down resistance | 100 | kΩ | Pull-down to GND | 24 | |||
| JTAGSEL pin pull-down resistance | 15 | kΩ | Permanent pull-down to GND | 23 | |||
| TST pin pull-down resistance | 15 | kΩ | Permanent pull-down to GND | 23 | |||
| ERASE pin high time for Flash erase | 220 | ms | ERASE tied high for Flash erase operation | 24 | |||
| ERASE pin high time ignored | 100 | ms | ERASE tied high for less than this time is not taken into account | 24 | |||
| External reset length minimum (ERSTL) | 60 | µs | External reset programmable between 60 µs and 2 s | 215 | |||
| External reset length maximum (ERSTL) | 2 | s | External reset programmable between 60 µs and 2 s | 215 | |||
| Operating temperature range (Industrial, AU package) | -40 | 85 | °C | Industrial grade, ordering code ATSAM3N1AB-AU | 752 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | TBH [PC, R1, LSL #1] ; R1 is the index, PC is used as base of the | 129 |
CAD (KiCad official)
- Symbol:
ATSAM3N1AB-AU - Footprint:
Package_QFP:LQFP-48_7x7mm_P0.5mm - 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
- 3D model files:
atsam3n1ab-au-etched.step/atsam3n1ab-au-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);atsam3n1ab-au.step/atsam3n1ab-au.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (766 pp, sha256
6e0c0e7028df8bf3, retrieved 2026-11-13, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ATSAM3N1AB-AU
**Microchip Tech** · Pre-ordered MCUs · LQFP-48(7x7)
ATSAM3N1AB-AU from Microchip Tech, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ADVREF | power_in | ADC reference voltage input; conversions extend from 0 V to ADVREF, which may equal the analog supply, and an external decoupling capacitor is required for noise filtering. |
| 2 | GND | power_in | Ground connection. |
| 3 | PB0/AD4 | bidirectional | PIO line PB0 multiplexed with ADC analog input AD4 (ADC input range 0 V to ADVREF). |
| 4 | PB1/AD5 | bidirectional | PIO line PB1 multiplexed with ADC analog input AD5 (ADC input range 0 V to ADVREF). |
| 5 | PB2/AD6 | bidirectional | PIO line PB2 multiplexed with ADC analog input AD6 and UART1 receive URXD1. |
| 6 | PB3/AD7 | bidirectional | PIO line PB3 multiplexed with ADC analog input AD7 and UART1 transmit UTXD1. |
| 7 | VDDIN | power_in | Supply for the voltage regulator, ADC and DAC; the voltage regulator operates from 1.8 V to 3.6 V. |
| 8 | VDDOUT | power_out | Output of the on-chip voltage regulator that powers VDDCORE when the internal regulator is used; its voltage limits are in Section 5.3, which is not in the extracted text. |
| 9 | PA17/PGMD5/AD0 | bidirectional | PIO line PA17 multiplexed with Fast Flash programming data PGMD5 and ADC analog input AD0. |
| 10 | PA18/PGMD6/AD1 | bidirectional | PIO line PA18 multiplexed with Fast Flash programming data PGMD6 and ADC analog input AD1. |
| 11 | PA19/PGMD7/AD2 | bidirectional | PIO line PA19 multiplexed with Fast Flash programming data PGMD7 and ADC analog input AD2 (wake-up WKUP9). |
| 12 | PA20/AD3 | bidirectional | PIO line PA20 multiplexed with ADC analog input AD3 (wake-up WKUP10). |
| 13 | VDDIO | power_in | Supply for peripheral I/O lines, backup part, 32 kHz crystal oscillator and oscillator pads, 1.62 V to 3.6 V; it must always be higher than or equal to VDDCORE. |
| 14 | PA16/PGMD4 | bidirectional | PIO line PA16 multiplexed with Fast Flash programming data PGMD4. |
| 15 | PA15/PGMD3 | bidirectional | PIO line PA15 multiplexed with Fast Flash programming data PGMD3. |
| 16 | PA14/PGMD2 | bidirectional | PIO line PA14 multiplexed with Fast Flash programming data PGMD2 and SPI clock SPCK. |
| 17 | PA13/PGMD1 | bidirectional | PIO line PA13 multiplexed with Fast Flash programming data PGMD1 and SPI MOSI. |
| 18 | VDDCORE | power_in | Core supply powering the processor, embedded memories and peripherals, 1.62 V to 1.95 V. |
| 19 | PA12/PGMD0 | bidirectional | PIO line PA12 multiplexed with Fast Flash programming data PGMD0 and SPI MISO. |
| 20 | PA11/PGMM3 | bidirectional | PIO line PA11 multiplexed with programming mode input PGMM3 and SPI NPCS0. |
| 21 | PA10/PGMM2 | bidirectional | PIO line PA10 multiplexed with programming mode input PGMM2, UART0 transmit UTXD0 and SPI NPCS2. |
| 22 | PA9/PGMM1 | bidirectional | PIO line PA9 multiplexed with programming mode input PGMM1, UART0 receive URXD0 and SPI NPCS1. |
| 23 | PA8/XOUT32/PGMM0 | bidirectional | PIO line PA8 multiplexed with programming mode input PGMM0, 32 kHz crystal output XOUT32 and ADC trigger ADTRG. |
| 24 | PA7/XIN32/PGMNVALID | bidirectional | PIO line PA7 multiplexed with 32 kHz crystal input XIN32 and the programming data-direction output PGMNVALID (active low). |
| 25 | TDI/PB4 | bidirectional | JTAG test data input TDI multiplexed with PIO line PB4 (also TWI1 data TWD1). |
| 26 | PA6/PGMNOE | bidirectional | PIO line PA6 multiplexed with programming read input PGMNOE (active low). |
| 27 | PA5/PGMRDY | bidirectional | PIO line PA5 multiplexed with programming ready output PGMRDY (active high). |
| 28 | PA4/PGMNCMD | bidirectional | PIO line PA4 multiplexed with programming command input PGMNCMD (active low) and TWI0 clock TWCK0. |
| 29 | NRST | bidirectional | Microcontroller reset, active low, operating as an input or output. |
| 30 | TST | input | Test select: low at power-up selects normal operation and high selects test or FFPI mode; it has an internal pull-down of about 15 kΩ and may be left unconnected for normal operation. |
| 31 | PA3 | bidirectional | PIO line PA3 multiplexed with TWI0 data TWD0 and SPI NPCS3. |
| 32 | PA2/PGMEN2 | bidirectional | PIO line PA2 multiplexed with programming enable input PGMEN2. |
| 33 | VDDIO | power_in | Supply for peripheral I/O lines, 1.62 V to 3.6 V; it must always be higher than or equal to VDDCORE. |
| 34 | GND | power_in | Ground connection. |
| 35 | PA1/PGMEN1 | bidirectional | PIO line PA1 multiplexed with programming enable input PGMEN1 and TC0 output TIOB0. |
| 36 | PA0/PGMEN0 | bidirectional | PIO line PA0 multiplexed with programming enable input PGMEN0 and TC0 signal TIOA0. |
| 37 | TDO/TRACESWO/PB5 | output | JTAG test data output TDO, multiplexed with serial-wire trace output TRACESWO and PIO line PB5; outside debug mode it is in input mode, so its internal pull-up must be enabled to avoid floating-input current. |
| 38 | JTAGSEL | input | JTAG selection input (active high): with TST low at power-up, a high level enables IEEE 1149.1 boundary scan, and a chip reset is required after it is changed. |
| 39 | TMS/SWDIO/PB6 | bidirectional | Test mode select TMS for JTAG or serial-wire data SWDIO, multiplexed with PIO line PB6. |
| 40 | TCK/SWCLK/PB7 | input | Test clock TCK for JTAG or serial-wire clock SWCLK, multiplexed with PIO line PB7. |
| 41 | VDDCORE | power_in | Core supply powering the processor, embedded memories and peripherals, 1.62 V to 1.95 V. |
| 42 | ERASE/PB12 | bidirectional | PIO line PB12 multiplexed with the ERASE pin, whose function is described in Section 6.5 (not in the extracted text). |
| 43 | PB10 | bidirectional | PIO line PB10 whose Schmitt trigger can be disabled through the PIO registers. |
| 44 | PB11 | bidirectional | PIO line PB11 whose Schmitt trigger can be disabled through the PIO registers. |
| 45 | XOUT/PB8 | bidirectional | Main oscillator output XOUT for a 3 to 20 MHz crystal, multiplexed with PIO line PB8. |
| 46 | XIN/P/PB9/GMCK | input | Main oscillator input XIN for a 3 to 20 MHz crystal, multiplexed with PIO line PB9 and the programming clock PGMCK. |
| 47 | VDDIO | power_in | Supply for peripheral I/O lines, 1.62 V to 3.6 V; it must always be higher than or equal to VDDCORE. |
| 48 | VDDPLL | power_in | Supply for the PLL, the Fast RC oscillator and the 3 to 20 MHz oscillators, 1.62 V to 1.95 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | LQFP-48(7x7) |
| Category | Embedded Processors & Controllers |
| Pins | 48 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VDDCORE core supply voltage | VDDCORE | 1.62 | | 1.95 | V | | 16 |
| VDDIO I/O supply voltage | VDDIO | 1.62 | | 3.6 | V | | 16 |
| VDDIN voltage regulator supply voltage | VDDIN | 1.8 | | 3.6 | V | Voltage Regulator | 16 |
| VDDPLL PLL and oscillator supply voltage | VDDPLL | 1.62 | | 1.95 | V | | 16 |
| Main supply for ADC and DAC usable | | 3 | | | V | With Main Supply >= 3 V all peripherals usable; below 3 V ADC and DAC not usable | 18 |
| VDDIO minimum operating voltage before VDDCORE reaches VDDCORE(min) at power-up | VDDIO | 1.62 | | | V | Power-up sequencing | 16 |
| VDDIO rising slope when VDDCORE rises with VDDIO | | 5 | | | V/ms | VDDCORE rising at the same time as VDDIO | 16 |
| VDDIO level at power-up before VDDIN reaches 1.0 V | VDDIO | 0.6 | | | V | At power-up, before VDDIN reaches 1.0 V | 17 |
| VDDIO relative to VDDIN at startup | VDDIO | | | 0.5 | V | VDDIO at or below VDDIN voltage + 0.5 V | 17 |
| Voltage regulator static current in Normal mode | | | | 700 | µA | Normal mode, static current | 17 |
| Voltage regulator quiescent current in Wait mode | | | 7 | | µA | Wait mode | 17 |
| Voltage regulator current consumption in Backup mode | | | | 1 | µA | Backup mode; VDDOUT driven internally to GND | 17 |
| Voltage regulator default output voltage | VDDOUT | | 1.8 | | V | Default output voltage | 17 |
| Voltage regulator start-up time to Normal mode | | | | 100 | µs | Start-up to Normal mode | 17 |
| Backup mode total consumption | | | 3 | | µA | Backup mode, total current consumption | 21 |
| Backup mode wake-up time | | | | 0.1 | ms | Wake-up from Backup mode | 21 |
| Wait mode current consumption | | | 5 | | µA | 5 µA on VDDCORE; 15 µA total with internal voltage regulator; 8 µA total without internal voltage regulator (Wait mode) | 21 |
| Wait mode wake-up time | | | | 10 | µs | Wake-up from Wait mode | 21 |
| Supply monitor threshold on VDDIO | | 1.9 | | 3.4 | V | Programmable in 100 mV steps (SMTH) | 253 |
| Fast RC low-power oscillator frequency (Slow Clock RC) | | 22 | | 42 | kHz | 22-42 kHz Low Power RC Oscillator | 249 |
| Slow clock crystal frequency | | | 32.768 | | kHz | 32 kHz crystal oscillator, typical Slow Clock | 243 |
| 3 to 20 MHz crystal oscillator frequency range | | 3 | | 20 | MHz | 3 to 20 MHz oscillator | 16 |
| SPI clock pad maximum frequency | | | | 45 | MHz | High speed pads, SPI clock lines | 22 |
| Other I/O line maximum frequency | | | | 35 | MHz | High speed pads, other lines than SPI clock | 22 |
| I/O pull-up and pull-down resistance | | | 100 | | kΩ | Typical value for all I/Os | 22 |
| NRST pull-up resistance to VDDIO | | | 100 | | kΩ | Permanent pull-up to VDDIO | 24 |
| ERASE pin pull-down resistance | | | 100 | | kΩ | Pull-down to GND | 24 |
| JTAGSEL pin pull-down resistance | | | 15 | | kΩ | Permanent pull-down to GND | 23 |
| TST pin pull-down resistance | | | 15 | | kΩ | Permanent pull-down to GND | 23 |
| ERASE pin high time for Flash erase | | 220 | | | ms | ERASE tied high for Flash erase operation | 24 |
| ERASE pin high time ignored | | | | 100 | ms | ERASE tied high for less than this time is not taken into account | 24 |
| External reset length minimum (ERSTL) | | 60 | | | µs | External reset programmable between 60 µs and 2 s | 215 |
| External reset length maximum (ERSTL) | | | | 2 | s | External reset programmable between 60 µs and 2 s | 215 |
| Operating temperature range (Industrial, AU package) | | -40 | | 85 | °C | Industrial grade, ordering code ATSAM3N1AB-AU | 752 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | | TBH [PC, R1, LSL #1] ; R1 is the index, PC is used as base of the | 129 |
## CAD (KiCad official)
- Symbol: `ATSAM3N1AB-AU`
- Footprint: `Package_QFP:LQFP-48_7x7mm_P0.5mm`
- 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
- 3D model files: `atsam3n1ab-au-etched.step` / `atsam3n1ab-au-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `atsam3n1ab-au.step` / `atsam3n1ab-au.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](docs/atsam3n1ab-au-datasheet.pdf) (766 pp, sha256 `6e0c0e7028df8bf3`, retrieved 2026-11-13, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/atsam3n1ab-au-datasheet.pdf)