component
ATECC608C-SSHDA-T
Public Made by Adomby adom
Microchip Tech Security Verification / Encryption ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ATECC608C-SSHDA-T
Microchip Tech · Security Verification / Encryption ICs · SOIC-8
ATECC608C-SSHDA-T from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 2 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 3 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | Serial data line for the 1 MHz standard I2C interface. |
| 6 | SCL | input | Serial clock input for the 1 MHz standard I2C interface. |
| 7 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 8 | VCC | power_in | Power supply input; the datasheet specifies a 2.0 V to 5.5 V supply with 1.8 V to 5.5 V I/O levels. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature (absolute maximum) | -40 | 100 | °C | 10 | |||
| Storage Temperature | -65 | 150 | °C | 10 | |||
| Maximum Operating Voltage | 6 | V | 10 | ||||
| DC Output Current | 5 | mA | 10 | ||||
| Voltage on any pin | -0.5 | V | Upper limit printed as VCC + 0.5V | 10 | |||
| ESD Human Body Model (HBM) | 4 | kV | Printed as >4 kV | 10 | |||
| ESD Charge Device Model (CDM) | 1 | kV | Printed as >1 kV | 10 | |||
| Ambient Operating Temperature (Standard Industrial Range, H grade) | TA | -40 | 85 | °C | Standard Industrial Temperature Range | 13 | |
| Power Supply Voltage | VCC | 2 | 5.5 | V | 13 | ||
| Active Power Supply Current | ICC | 2 | 3 | mA | Waiting for I/O during I/O transfers or execution of non-ECC commands. Independent of Clock Divider value. | 13 | |
| Active Power Supply Current during ECC command | ICC | 14 | mA | During ECC command execution. Clock divider = 0x0 | 13 | ||
| Active Power Supply Current during ECC command | ICC | 6 | mA | During ECC command execution. Clock divider = 0x5 | 13 | ||
| Active Power Supply Current during ECC command | ICC | 3 | mA | During ECC command execution. Clock divider = 0xD | 13 | ||
| Sleep Current | ISLEEP | 30 | 150 | nA | When device is in Sleep mode, VCC ≤ 3.6V, VSDA and VSCL < 0.4V or > VCC, 0.4, TA ≤ +55°C | 13 | |
| Sleep Current | ISLEEP | 2 | µA | When device is in Sleep mode. Over full VCC range and -40°C to 85°C temperature range. | 13 | ||
| Output Low Voltage | VOL | 0.4 | V | When device is in Active mode, VCC = 2.5 to 5.5V | 14 | ||
| Output Low Current | IOL | 4 | mA | When device is in Active mode, VCC = 2.5 to 5.5V, VOL = 0.4V | 14 | ||
| Input Low Voltage | VIL | -0.5 | 0.5 | V | When device is active and TTLenable bit in Configuration memory is zero; otherwise, see above. | 14 | |
| Input High Voltage | VIH | 1.5 | V | When device is active and TTLenable bit in Configuration memory is zero; otherwise, see above. Upper limit printed as VCC + 0.5V | 14 | ||
| Write Endurance (each byte) | 400000 | Write Cycles | at +85°C | 10 | |||
| Data Retention | 15 | Years | at +70°C | 10 | |||
| Data Retention | 45 | Years | at +55°C | 10 | |||
| Power-Up Delay | tPU | 100 | µs | Minimum time between VCC > VCC min prior to start of tWLO. | 11 | ||
| Wake Low Duration | tWLO | 60 | µs | 11 | |||
| Initialization Time | tDVC_INIT | 400 | µs | Maximum time from rising edge of wake pulse until device is initialized. | 11 | ||
| Wake High Delay to Data Comm | tWHI | 1500 | µs | SDA recommended stable high for this entire duration unless polling is implemented. SelfTest not enabled at power-up. | 11 | ||
| Wake High Delay when SelfTest is Enabled | tWHIST | 20 | ms | SDA recommended stable high for this entire duration unless polling is implemented. | 11 | ||
| High-Side Glitch Filter at Active | tHIGNORE_A | 45 | ns | Pulses shorter than this in width will be ignored by the device, regardless of its state when active. | 11 | ||
| Low-Side Glitch Filter at Active | tLIGNORE_A | 45 | ns | Pulses shorter than this in width will be ignored by the device, regardless of its state when active. | 11 | ||
| Low-Side Glitch Filter at Sleep | tLIGNORE_S | 15 | µs | Pulses shorter than this in width will be ignored by the device when in Sleep mode. | 11 | ||
| Watchdog Time-out | tWATCHDOG | 0.7 | 1.3 | 1.7 | s | Time from wake until device is forced into Sleep mode if Config.ChipMode[2] is 0. | 11 |
| SCL Clock Frequency | fSCL | 0 | 1 | MHz | 13 | ||
| SCL High Time | tHIGH | 400 | ns | 13 | |||
| SCL Low Time | tLOW | 400 | ns | 13 | |||
| Start Setup Time | tSU.STA | 250 | ns | 13 | |||
| Start Hold Time | tHD.STA | 250 | ns | 13 | |||
| Stop Setup Time | tSU.STO | 250 | ns | 13 | |||
| Data In Setup Time | tSU.DAT | 100 | ns | 13 | |||
| Data In Hold Time | tHD.DAT | 0 | ns | 13 | |||
| Input Rise Time | tR | 300 | ns | 13 | |||
| Input Fall Time | tF | 100 | ns | 13 | |||
| Clock Low to Data Out Valid | tAA | 50 | 550 | ns | 13 | ||
| Data Out Hold Time | tDH | 50 | ns | 13 | |||
| SMBus Time-Out Delay | tTIMEOUT | 25 | 35 | ms | 13 | ||
| Time bus must be free before a new transmission can start | tBUF | 500 | ns | 13 | |||
| Theta JA (SOIC) | ƟJA | 166 | °C/W | SOIC (SS) | 14 |
CAD (KiCad official)
- Symbol:
ATECC608C-SSHDA-T - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
atecc608c-sshda-t-etched.step/atecc608c-sshda-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);atecc608c-sshda-t.step/atecc608c-sshda-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (33 pp, sha256
c88378258d593053, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ATECC608C-SSHDA-T
**Microchip Tech** · Security Verification / Encryption ICs · SOIC-8
ATECC608C-SSHDA-T from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 2 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 3 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | Serial data line for the 1 MHz standard I2C interface. |
| 6 | SCL | input | Serial clock input for the 1 MHz standard I2C interface. |
| 7 | NC | unconnected | No internal connection; leave this pin unconnected. |
| 8 | VCC | power_in | Power supply input; the datasheet specifies a 2.0 V to 5.5 V supply with 1.8 V to 5.5 V I/O levels. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature (absolute maximum) | | -40 | | 100 | °C | | 10 |
| Storage Temperature | | -65 | | 150 | °C | | 10 |
| Maximum Operating Voltage | | | | 6 | V | | 10 |
| DC Output Current | | | | 5 | mA | | 10 |
| Voltage on any pin | | -0.5 | | | V | Upper limit printed as VCC + 0.5V | 10 |
| ESD Human Body Model (HBM) | | 4 | | | kV | Printed as >4 kV | 10 |
| ESD Charge Device Model (CDM) | | 1 | | | kV | Printed as >1 kV | 10 |
| Ambient Operating Temperature (Standard Industrial Range, H grade) | TA | -40 | | 85 | °C | Standard Industrial Temperature Range | 13 |
| Power Supply Voltage | VCC | 2 | | 5.5 | V | | 13 |
| Active Power Supply Current | ICC | | 2 | 3 | mA | Waiting for I/O during I/O transfers or execution of non-ECC commands. Independent of Clock Divider value. | 13 |
| Active Power Supply Current during ECC command | ICC | | | 14 | mA | During ECC command execution. Clock divider = 0x0 | 13 |
| Active Power Supply Current during ECC command | ICC | | | 6 | mA | During ECC command execution. Clock divider = 0x5 | 13 |
| Active Power Supply Current during ECC command | ICC | | | 3 | mA | During ECC command execution. Clock divider = 0xD | 13 |
| Sleep Current | ISLEEP | | 30 | 150 | nA | When device is in Sleep mode, VCC ≤ 3.6V, VSDA and VSCL < 0.4V or > VCC, 0.4, TA ≤ +55°C | 13 |
| Sleep Current | ISLEEP | | | 2 | µA | When device is in Sleep mode. Over full VCC range and -40°C to 85°C temperature range. | 13 |
| Output Low Voltage | VOL | | | 0.4 | V | When device is in Active mode, VCC = 2.5 to 5.5V | 14 |
| Output Low Current | IOL | | | 4 | mA | When device is in Active mode, VCC = 2.5 to 5.5V, VOL = 0.4V | 14 |
| Input Low Voltage | VIL | -0.5 | | 0.5 | V | When device is active and TTLenable bit in Configuration memory is zero; otherwise, see above. | 14 |
| Input High Voltage | VIH | 1.5 | | | V | When device is active and TTLenable bit in Configuration memory is zero; otherwise, see above. Upper limit printed as VCC + 0.5V | 14 |
| Write Endurance (each byte) | | 400000 | | | Write Cycles | at +85°C | 10 |
| Data Retention | | 15 | | | Years | at +70°C | 10 |
| Data Retention | | 45 | | | Years | at +55°C | 10 |
| Power-Up Delay | tPU | 100 | | | µs | Minimum time between VCC > VCC min prior to start of tWLO. | 11 |
| Wake Low Duration | tWLO | 60 | | | µs | | 11 |
| Initialization Time | tDVC_INIT | | | 400 | µs | Maximum time from rising edge of wake pulse until device is initialized. | 11 |
| Wake High Delay to Data Comm | tWHI | 1500 | | | µs | SDA recommended stable high for this entire duration unless polling is implemented. SelfTest not enabled at power-up. | 11 |
| Wake High Delay when SelfTest is Enabled | tWHIST | 20 | | | ms | SDA recommended stable high for this entire duration unless polling is implemented. | 11 |
| High-Side Glitch Filter at Active | tHIGNORE_A | 45 | | | ns | Pulses shorter than this in width will be ignored by the device, regardless of its state when active. | 11 |
| Low-Side Glitch Filter at Active | tLIGNORE_A | 45 | | | ns | Pulses shorter than this in width will be ignored by the device, regardless of its state when active. | 11 |
| Low-Side Glitch Filter at Sleep | tLIGNORE_S | 15 | | | µs | Pulses shorter than this in width will be ignored by the device when in Sleep mode. | 11 |
| Watchdog Time-out | tWATCHDOG | 0.7 | 1.3 | 1.7 | s | Time from wake until device is forced into Sleep mode if Config.ChipMode[2] is 0. | 11 |
| SCL Clock Frequency | fSCL | 0 | | 1 | MHz | | 13 |
| SCL High Time | tHIGH | 400 | | | ns | | 13 |
| SCL Low Time | tLOW | 400 | | | ns | | 13 |
| Start Setup Time | tSU.STA | 250 | | | ns | | 13 |
| Start Hold Time | tHD.STA | 250 | | | ns | | 13 |
| Stop Setup Time | tSU.STO | 250 | | | ns | | 13 |
| Data In Setup Time | tSU.DAT | 100 | | | ns | | 13 |
| Data In Hold Time | tHD.DAT | 0 | | | ns | | 13 |
| Input Rise Time | tR | | | 300 | ns | | 13 |
| Input Fall Time | tF | | | 100 | ns | | 13 |
| Clock Low to Data Out Valid | tAA | 50 | | 550 | ns | | 13 |
| Data Out Hold Time | tDH | 50 | | | ns | | 13 |
| SMBus Time-Out Delay | tTIMEOUT | 25 | | 35 | ms | | 13 |
| Time bus must be free before a new transmission can start | tBUF | 500 | | | ns | | 13 |
| Theta JA (SOIC) | ƟJA | | 166 | | °C/W | SOIC (SS) | 14 |
## CAD (KiCad official)
- Symbol: `ATECC608C-SSHDA-T`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `atecc608c-sshda-t-etched.step` / `atecc608c-sshda-t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `atecc608c-sshda-t.step` / `atecc608c-sshda-t.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8676391196840562688) (33 pp, sha256 `c88378258d593053`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/atecc608c-sshda-t-datasheet.pdf)