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ZHONGKEWEI Motor Driver ICs, HTSSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ATD8811TPH

ZHONGKEWEI · Motor Driver ICs · HTSSOP-16

ATD8811TPH from ZHONGKEWEI, in a HTSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	nSLEEP	input	Sleep-mode input: high enables normal operation, and low puts the chip into low-power sleep with the H-bridges off.
2	AOUT1	output	H-bridge A output 1, which connects to one coil of motor A.
3	AISEN	passive	H-bridge A current-sense pin, which connects to the sense resistor to ground; tie it directly to ground if current limiting is not used.
4	AOUT2	output	H-bridge A output 2, which connects to the other coil of motor A.
5	BOUT2	output	H-bridge B output 2, which connects to the other coil of motor B.
6	BISEN	passive	H-bridge B current-sense pin, which connects to the sense resistor to ground; tie it directly to ground if current limiting is not used.
7	BOUT1	output	H-bridge B output 1, which connects to one coil of motor B.
8	nFAULT	output	Fault output that goes low on over-temperature or over-current; it is open-drain and requires an external pull-up.
9	BIN1	input	H-bridge B input 1 logic input that controls BOUT1, with an internal pull-down.
10	BIN2	input	H-bridge B input 2 logic input that controls BOUT2, with an internal pull-down.
11	VCP	power_out	High-side gate-drive charge-pump storage pin, which requires a 0.01uF capacitor to VM.
12	VM	power_in	Motor supply pin, which requires filtering and at least 10uF to ground; the recommended supply range is 2.7V to 12V.
13	GND	power_in	Device ground; all ground pins and the exposed pad must be connected to system ground.
14	VINT	power_out	Internal regulator node, which requires a 2.2uF capacitor to ground.
15	AIN2	input	H-bridge A input 2 logic input that controls AOUT2, with an internal pull-down.
16	AIN1	input	H-bridge A input 1 logic input that controls AOUT1, with an internal pull-down.
17	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	ZHONGKEWEI
Package	HTSSOP-16
Category	Power Supply Chip
Pins	17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
负载电压 (load supply voltage)	VM	-0.3		15	V		5
最大输出电流	IOUT	-1.5		1.5	A		5
瞬间峰值电流	IPEAK	2.5			A	内部限制	5
逻辑输入电压	VIN	-0.3		7	V		5
Sense 电压	VSENSE	-0.3		0.5	V		5
工作温度	TA	-40		85	°C		5
最大结温	TJ(max)			150	°C		5
存储温度	Tstg	-55		150	°C		5
负载供电电压范围	VM	2.7		12	V		5
逻辑输入电压范围	VIN	0		5.25	V		5
单路 H 桥 RMS 输出电流	IOUT	0		1.2	A		5
VM 静态电流	IVM		2.2	3.5	mA	xIN1 = 0 V, xIN2 = 0 V	6
VM 休眠电流	IVMQ		0.2	10	uA		6
VM 欠压阈值	VUVLO		2.5	2.65	V	VM 下降	6
VM 欠压迟滞	VHYS		120		mV		6
VINT 电压	VVINT	3	3.23	3.4	V		6
逻辑输入低电平 nSLEEP	VIL			0.5	V	nSLEEP	6
逻辑输入低电平其他管脚	VIL			0.7	V	其他管脚	6
逻辑输入高电平 nSLEEP	VIH	2.2			V	nSLEEP	6
逻辑输入高电平其他管脚	VIH	2			V	其他管脚	6
逻辑输入迟滞	VHYS		0.24		V		6
输入内部下拉电阻 nSLEEP	RPD		500		kΩ	nSLEEP	6
输入内部下拉电阻其他管脚	RPD		150		kΩ	其他管脚	6
输入低电平电流	IIL			1	uA	VIN = 0 V	6
输入高电平电流 nSLEEP	IIH		6.6	13	uA	VIN = 3.3 V, nSLEEP	6
输入高电平电流其他管脚	IIH		22	33	uA	VIN = 3.3 V, 其他管脚	6
防消抖时间	tDEG		450		ns	nFAULT 输出 (开漏输出)	6
输出低电平	VOL			0.5	V	IO = 5 mA	6
关断漏电流	IOH			1	uA	VO = 3.3 V	6
H 桥高侧 FET 导通电阻	RDS(ON)		330	520	mΩ	VM = 5 V, I O = 1500 mA	6
H 桥高侧 FET 导通电阻	RDS(ON)		280	420	mΩ	VM = 12 V, I O =1500 mA	6
H 桥低侧 FET 导通电阻	RDS(ON)		320	500	mΩ	VM = 5 V, I O = 1500 mA	6
H 桥低侧 FET 导通电阻	RDS(ON)		270	400	mΩ	VM = 12 V, I O =1500 mA	6
关断漏电流	IOFF	-1		1	uA	VM = 5 V, VOUT = 0 V	7
电流控制 PWM 频率	fPWM		50		kHz	内部 PWM 频率	7
输出上升时间	tR		300		ns	16Ω to GND, 10% to 90%	7
输出下降时间	tF		150		ns	16Ω to GND, 10% to 90%	7
INx to OUTx 延迟	tPROP		0.5		us		7
死区时间	tDEAD	100	200	300	ns		7
过流保护阈值	IOCP	2.2		5	A		7
过流延迟时间	tDEG		2.8		us		7
过流保护重启时间	tOCP		1.8		ms		7
过温阈值结温	tTSD	150	160	170	℃		7
xISEN 采样电压	VTRIP	160	200	240	mV		7
blanking 时间	tBLANK		3.2		us		7
开启延迟时间	tWAKE		0.3	1	ms	nSLEEP 升高到 H 桥开启	7
热阻 silicon junction to ambient	θJA		35		°C/W		5

CAD (KiCad official)

Symbol: ATD8811TPH
Footprint: Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm
3D model: HTSSOP-16 (KiCad packages3D, STEP)
3D model files: atd8811tph-etched.step / atd8811tph-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); atd8811tph.step / atd8811tph.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: ZHONGKEWEI datasheet (16 pp, sha256 48a095d1b4f81698, retrieved 2026-11-02, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# ATD8811TPH

**ZHONGKEWEI** · Motor Driver ICs · HTSSOP-16

ATD8811TPH from ZHONGKEWEI, in a HTSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | nSLEEP | input | Sleep-mode input: high enables normal operation, and low puts the chip into low-power sleep with the H-bridges off. |
| 2 | AOUT1 | output | H-bridge A output 1, which connects to one coil of motor A. |
| 3 | AISEN | passive | H-bridge A current-sense pin, which connects to the sense resistor to ground; tie it directly to ground if current limiting is not used. |
| 4 | AOUT2 | output | H-bridge A output 2, which connects to the other coil of motor A. |
| 5 | BOUT2 | output | H-bridge B output 2, which connects to the other coil of motor B. |
| 6 | BISEN | passive | H-bridge B current-sense pin, which connects to the sense resistor to ground; tie it directly to ground if current limiting is not used. |
| 7 | BOUT1 | output | H-bridge B output 1, which connects to one coil of motor B. |
| 8 | nFAULT | output | Fault output that goes low on over-temperature or over-current; it is open-drain and requires an external pull-up. |
| 9 | BIN1 | input | H-bridge B input 1 logic input that controls BOUT1, with an internal pull-down. |
| 10 | BIN2 | input | H-bridge B input 2 logic input that controls BOUT2, with an internal pull-down. |
| 11 | VCP | power_out | High-side gate-drive charge-pump storage pin, which requires a 0.01uF capacitor to VM. |
| 12 | VM | power_in | Motor supply pin, which requires filtering and at least 10uF to ground; the recommended supply range is 2.7V to 12V. |
| 13 | GND | power_in | Device ground; all ground pins and the exposed pad must be connected to system ground. |
| 14 | VINT | power_out | Internal regulator node, which requires a 2.2uF capacitor to ground. |
| 15 | AIN2 | input | H-bridge A input 2 logic input that controls AOUT2, with an internal pull-down. |
| 16 | AIN1 | input | H-bridge A input 1 logic input that controls AOUT1, with an internal pull-down. |
| 17 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ZHONGKEWEI |
| Package | HTSSOP-16 |
| Category | Power Supply Chip |
| Pins | 17 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 负载电压 (load supply voltage) | VM | -0.3 |  | 15 | V |  | 5 |
| 最大输出电流 | IOUT | -1.5 |  | 1.5 | A |  | 5 |
| 瞬间峰值电流 | IPEAK | 2.5 |  |  | A | 内部限制 | 5 |
| 逻辑输入电压 | VIN | -0.3 |  | 7 | V |  | 5 |
| Sense 电压 | VSENSE | -0.3 |  | 0.5 | V |  | 5 |
| 工作温度 | TA | -40 |  | 85 | °C |  | 5 |
| 最大结温 | TJ(max) |  |  | 150 | °C |  | 5 |
| 存储温度 | Tstg | -55 |  | 150 | °C |  | 5 |
| 负载供电电压范围 | VM | 2.7 |  | 12 | V |  | 5 |
| 逻辑输入电压范围 | VIN | 0 |  | 5.25 | V |  | 5 |
| 单路 H 桥 RMS 输出电流 | IOUT | 0 |  | 1.2 | A |  | 5 |
| VM 静态电流 | IVM |  | 2.2 | 3.5 | mA | xIN1 = 0 V, xIN2 = 0 V | 6 |
| VM 休眠电流 | IVMQ |  | 0.2 | 10 | uA |  | 6 |
| VM 欠压阈值 | VUVLO |  | 2.5 | 2.65 | V | VM 下降 | 6 |
| VM 欠压迟滞 | VHYS |  | 120 |  | mV |  | 6 |
| VINT 电压 | VVINT | 3 | 3.23 | 3.4 | V |  | 6 |
| 逻辑输入低电平 nSLEEP | VIL |  |  | 0.5 | V | nSLEEP | 6 |
| 逻辑输入低电平 其他管脚 | VIL |  |  | 0.7 | V | 其他管脚 | 6 |
| 逻辑输入高电平 nSLEEP | VIH | 2.2 |  |  | V | nSLEEP | 6 |
| 逻辑输入高电平 其他管脚 | VIH | 2 |  |  | V | 其他管脚 | 6 |
| 逻辑输入迟滞 | VHYS |  | 0.24 |  | V |  | 6 |
| 输入内部下拉电阻 nSLEEP | RPD |  | 500 |  | kΩ | nSLEEP | 6 |
| 输入内部下拉电阻 其他管脚 | RPD |  | 150 |  | kΩ | 其他管脚 | 6 |
| 输入低电平电流 | IIL |  |  | 1 | uA | VIN = 0 V | 6 |
| 输入高电平电流 nSLEEP | IIH |  | 6.6 | 13 | uA | VIN = 3.3 V, nSLEEP | 6 |
| 输入高电平电流 其他管脚 | IIH |  | 22 | 33 | uA | VIN = 3.3 V, 其他管脚 | 6 |
| 防消抖时间 | tDEG |  | 450 |  | ns | nFAULT 输出 (开漏输出) | 6 |
| 输出低电平 | VOL |  |  | 0.5 | V | IO = 5 mA | 6 |
| 关断漏电流 | IOH |  |  | 1 | uA | VO = 3.3 V | 6 |
| H 桥高侧 FET 导通电阻 | RDS(ON) |  | 330 | 520 | mΩ | VM = 5 V, I O = 1500 mA | 6 |
| H 桥高侧 FET 导通电阻 | RDS(ON) |  | 280 | 420 | mΩ | VM = 12 V, I O =1500 mA | 6 |
| H 桥低侧 FET 导通电阻 | RDS(ON) |  | 320 | 500 | mΩ | VM = 5 V, I O = 1500 mA | 6 |
| H 桥低侧 FET 导通电阻 | RDS(ON) |  | 270 | 400 | mΩ | VM = 12 V, I O =1500 mA | 6 |
| 关断漏电流 | IOFF | -1 |  | 1 | uA | VM = 5 V, VOUT = 0 V | 7 |
| 电流控制 PWM 频率 | fPWM |  | 50 |  | kHz | 内部 PWM 频率 | 7 |
| 输出上升时间 | tR |  | 300 |  | ns | 16Ω to GND, 10% to 90% | 7 |
| 输出下降时间 | tF |  | 150 |  | ns | 16Ω to GND, 10% to 90% | 7 |
| INx to OUTx 延迟 | tPROP |  | 0.5 |  | us |  | 7 |
| 死区时间 | tDEAD | 100 | 200 | 300 | ns |  | 7 |
| 过流保护阈值 | IOCP | 2.2 |  | 5 | A |  | 7 |
| 过流延迟时间 | tDEG |  | 2.8 |  | us |  | 7 |
| 过流保护重启时间 | tOCP |  | 1.8 |  | ms |  | 7 |
| 过温阈值 结温 | tTSD | 150 | 160 | 170 | ℃ |  | 7 |
| xISEN 采样电压 | VTRIP | 160 | 200 | 240 | mV |  | 7 |
| blanking 时间 | tBLANK |  | 3.2 |  | us |  | 7 |
| 开启延迟时间 | tWAKE |  | 0.3 | 1 | ms | nSLEEP 升高到 H 桥开启 | 7 |
| 热阻 silicon junction to ambient | θJA |  | 35 |  | °C/W |  | 5 |

## CAD (KiCad official)

- Symbol: `ATD8811TPH`
- Footprint: `Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm`
- 3D model: HTSSOP-16 (KiCad packages3D, STEP)
- 3D model files: `atd8811tph-etched.step` / `atd8811tph-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `atd8811tph.step` / `atd8811tph.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ZHONGKEWEI datasheet](docs/atd8811tph-datasheet.pdf) (16 pp, sha256 `48a095d1b4f81698`, retrieved 2026-11-02, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/atd8811tph-datasheet.pdf)

ATD8811TPH

Verified ATD8811TPH

Verification log 1 record

ATD8811TPH

Pinout

Key specifications

Electrical characteristics

CAD (KiCad official)

Provenance