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ATAES132A-SHER-B
Public Made by Adomby adom
Microchip Tech EEPROM, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownATAES132A-SHER-B
Microchip Tech · EEPROM · SOIC-8
ATAES132A-SHER-B from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Active-low SPI chip select input; must be held at VCC for the sleep and standby current measurements in SPI mode. |
| 2 | SO | output | Serial data output; in I2C mode with Auth signaling enabled it functions as the AuthO output. |
| 3 | NC | unconnected | No connect. |
| 4 | VSS | power_in | Ground. |
| 5 | SI/SDA | bidirectional | Serial data input in SPI mode and serial data (SDA) line in I2C mode. |
| 6 | SCK | input | Serial clock input, up to 10MHz in SPI mode and 1MHz in I2C mode. |
| 7 | NC | unconnected | No connect. |
| 8 | VCC | power_in | Supply voltage, 2.5V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature | -40 | 85 | °C | 4 | |||
| Storage Temperature | -65 | 150 | °C | 4 | |||
| Maximum Operating Voltage | 6 | V | 4 | ||||
| DC Output Current | 5 | mA | 4 | ||||
| Voltage on any pin | -0.7 | V | 4 | ||||
| HBM ESD | 3 | kV | 4 | ||||
| Supply Voltage | VCC | 2.5 | 5.5 | V | 5 | ||
| Supply Current (VCC = 3.3V at fmax) | ICC1 | 6 | mA | VCC = 3.3V at fmax; SO = Open; Read, Write, or AES operation | 5 | ||
| Supply Current (VCC = 5.5V at fmax) | ICC2 | 10 | mA | VCC = 5.5V at fmax; SO = Open; Read, Write, or AES operation | 5 | ||
| Idle Current | ICC3 | 600 | 800 | µA | VCC = 3.3V or 5.5V at fmax; SO = Open; Waiting for a command | 5 | |
| Sleep Current (VCC = 3.3V) | ISL1 | 0.1 | 0.25 | µA | VCC = 3.3V; = VCC, Sleep State | 5 | |
| Sleep Current (VCC = 5.5V) | ISL2 | 0.25 | 0.5 | µA | VCC = 5.5V; = VCC, Sleep State | 5 | |
| Standby Current (VCC = 3.3V) | ISB1 | 15 | 30 | µA | VCC = 3.3V; = VCC, Standby State | 5 | |
| Standby Current (VCC = 5.5V) | ISB2 | 20 | 40 | µA | VCC = 5.5V; = VCC, Standby State | 5 | |
| Input Current | ILI | -3 | 3 | µA | VIN = 0V or VCC | 6 | |
| Output Leakage | ILO | -3 | 3 | µA | VOUT = 0V or VCC | 6 | |
| Input Low-Voltage | VIL | -0.5 | V | 6 | |||
| Output Low-Voltage, Except SI/SDA in I2C Mode | VOL1 | 0 | 0.4 | V | IOL = 3.0mA | 6 | |
| Output Low-Voltage, SI/SDA Pin in the I2C Mode Only | VOL2 | 0 | 0.4 | V | IOL = 3.0mA | 6 | |
| User Zone Write Cycle Time | tWC1 | 6 | 9 | ms | 7 | ||
| Key Zone Write Cycle Time | tWC2 | 12 | 16 | ms | 7 | ||
| Power-Up Time, Status | tPU.STATUS | 500 | 600 | µs | 7 | ||
| Power-Up Ready Time | tPU.RDY | 1200 | 1500 | µs | 7 | ||
| Sleep Time, Entering the Standby State | tSB | 65 | 100 | µs | 7 | ||
| Sleep Time, Entering the Sleep State | tSL | 55 | 90 | µs | 7 | ||
| Wake-Up Status Time, Standby State | tWupSB.STATUS | 50 | 100 | µs | 7 | ||
| Wake-Up Ready Time, Standby State | tWupSB.RDY | 200 | 240 | µs | 7 | ||
| Wake-Up Status, Sleep State | tWupSL.STATUS | 500 | 600 | µs | 7 | ||
| Wake-Up Ready Time, Sleep State | tWupSL.RDY | 1200 | 1500 | µs | 7 | ||
| SCK Clock Frequency (I2C) | fSCK | 1 | MHz | 8 | |||
| SCK Clock Duty Cycle | 30 | 70 | percent | 8 | |||
| SCK High Time | tHIGH | 400 | ns | 8 | |||
| SCK Low Time | tLOW | 400 | ns | 8 | |||
| Start Setup Time | tSU.STA | 250 | ns | 8 | |||
| Start Hold Time | tHD.STA | 250 | ns | 8 | |||
| Stop Setup Time | tSU.STO | 250 | ns | 8 | |||
| Data in Setup Time | tSU.DAT | 100 | ns | 8 | |||
| Data in Hold Time | tHD.DAT | 0 | ns | 8 | |||
| Input Rise Time | tR | 300 | ns | 8 | |||
| Input Fall Time | tF | 100 | ns | 8 | |||
| Clock Low to Data Out Valid | tAA | 50 | 550 | ns | 8 | ||
| Data Out Hold Time | tDH | 50 | ns | 8 | |||
| Bus Free Time before new transmission | tBUF | 500 | ns | 8 | |||
| Write Endurance (each byte) | 100000 | Write Cycles | 4 | ||||
| Data Retention (at 55°C) | 10 | Years | at 55°C | 4 | |||
| Data Retention (at 35°C) | 30 | 50 | Years | at 35°C | 4 |
CAD (KiCad official)
- Symbol:
ATAES132A-SHER-B - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ataes132a-sher-b-etched.step/ataes132a-sher-b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ataes132a-sher-b.step/ataes132a-sher-b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (14 pp, sha256
583b1563d6477e8e, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).