# AT93C86A-10SU-2.7

**Microchip Tech** · Pre-ordered Chips · SOIC-8

AT93C86A-10SU-2.7 from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip Select; the device is selected when CS is high, otherwise DI data is not accepted and DO stays high-impedance. |
| 2 | SK | input | Serial Data Clock; synchronizes communication, with DI latched and DO clocked out on the rising edge of SK. |
| 3 | DI | input | Serial Data Input; receives instructions, addresses and data, latched on the rising edge of SK. |
| 4 | DO | tri_state | Serial Data Output; shifts data out after the rising edge of SK during reads, outputs Ready/Busy status after an erase or write, and is high-impedance when the device is not selected. |
| 5 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 6 | ORG | input | Internal Organization select; tied to VCC selects x16, tied to VSS selects x8, and left unconnected selects x16 via the internal pull-up resistor. |
| 7 | NC | unconnected | No Connect. |
| 8 | VCC | power_in | Device Power Supply; 2.7V to 5.5V for the -2.7 option, and operation at invalid VCC voltages may produce spurious results. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (2.7V option) | VCC2 | 2.7 |  | 5.5 | V |  | 8 |
| Supply Current Read | ICC1 |  | 0.5 | 2 | mA | VCC = 5.0V, Read at 1 MHz | 8 |
| Supply Current Write | ICC2 |  | 0.5 | 2 | mA | VCC = 5.0V, Write at 1 MHz | 8 |
| Standby Current (2.7V Option) | ISB2 |  | 6 | 10 | μA | VCC = 2.7V, CS = 0V | 8 |
| Input Leakage Current | IIL |  | 0.1 | 3 | μA | VIN = 0 to VCC | 8 |
| Output Leakage Current | ILO |  | 0.1 | 3 | μA | VIN = 0 to VCC | 8 |
| Input Low-Voltage | VIL1 | -0.6 |  | 0.8 | V | 2.7V ≤ VCC ≤ 5.5V (Note 2) | 9 |
| Input High-Voltage | VIH1 | 2 |  |  | V | 2.7V ≤ VCC ≤ 5.5V (Note 2); max VCC + 1 | 9 |
| Output Low-Voltage | VOL1 |  |  | 0.4 | V | 2.7V ≤ VCC ≤ 5.5V, IOL = 2.1 mA | 9 |
| Output High-Voltage | VOH1 | 2.4 |  |  | V | 2.7V ≤ VCC ≤ 5.5V, IOH = -0.4 mA | 9 |
| Clock Frequency, SK | fSK | 0 |  | 1 | MHz | 2.7V ≤ VCC ≤ 5.5V | 9 |
| Clock Frequency, SK | fSK | 0 |  | 2 | MHz | 4.5V ≤ VCC ≤ 5.5V | 9 |
| High Time, SK | tSKH | 250 |  |  | ns | 2.7V ≤ VCC ≤ 5.5V | 9 |
| Low Time, SK | tSKL | 250 |  |  | ns | 2.7V ≤ VCC ≤ 5.5V | 9 |
| Minimum CS Low Time | tCS | 250 |  |  | ns | 2.7V ≤ VCC ≤ 5.5V | 9 |
| CS Setup Time | tCSS | 50 |  |  | ns | 2.7V ≤ VCC ≤ 5.5V, Relative to SK | 9 |
| DI Setup Time | tDIS | 100 |  |  | ns | 2.7V ≤ VCC ≤ 5.5V, Relative to SK | 9 |
| CS Hold Time | tCSH | 0 |  |  | ns | Relative to SK | 9 |
| DI Hold Time | tDIH | 100 |  |  | ns | 2.7V ≤ VCC ≤ 5.5V, Relative to SK | 10 |
| Output Delay to 1 | tPD1 |  |  | 250 | ns | 2.7V ≤ VCC ≤ 5.5V | 10 |
| Output Delay to 0 | tPD0 |  |  | 250 | ns | 2.7V ≤ VCC ≤ 5.5V | 10 |
| CS to Status Valid | tSV |  |  | 250 | ns | 2.7V ≤ VCC ≤ 5.5V | 10 |
| CS to DO in High-impedance | tDF |  |  | 150 | ns | 2.7V ≤ VCC ≤ 5.5V, CS = VIL | 10 |
| Write Cycle Time | tWP | 0.1 | 3 | 10 | ms | 1.8V ≤ VCC ≤ 5.5V | 10 |
| Time required after VCC is stable before device accepts commands | tPUP | 100 |  |  | µs |  | 11 |
| Power-on Reset Threshold Voltage | VPOR |  |  | 1.5 | V |  | 11 |
| Minimum time at VCC = 0V between power cycles | tPOFF | 500 |  |  | ms |  | 11 |
| Output Capacitance (DO) | COUT |  |  | 5 | pF | VOUT = 0V | 11 |
| Input Capacitance (CS, SK, DI, ORG) | CIN |  |  | 5 | pF | VIN = 0V | 11 |
| Write Endurance |  | 1e+06 |  |  | Write Cycles | TA = 25°C, VCC = 5.0V | 11 |
| Data Retention |  | 100 |  |  | Years | TA = 55°C | 11 |
| Operating Temperature (Case) |  | -40 |  | 85 | °C | Industrial Temperature Range | 8 |
| Temperature under bias |  | -55 |  | 125 | °C |  | 8 |
| Storage temperature |  | -65 |  | 150 | °C |  | 8 |
| VCC | VCC |  |  | 6.25 | V |  | 8 |
| Voltage on any pin with respect to ground |  | -1 |  | 7 | V |  | 8 |
| DC output current |  |  |  | 5 | mA |  | 8 |
| ESD protection |  |  |  | 2 | kV |  | 8 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc. | 18 |

## CAD (KiCad official)

- Symbol: `AT93C86A-10SU-2.7`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `at93c86a-10su-2-7-etched.step` / `at93c86a-10su-2-7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `at93c86a-10su-2-7.step` / `at93c86a-10su-2-7.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microchip Tech datasheet](docs/at93c86a-10su-2-7-datasheet.pdf) (33 pp, sha256 `7f248e18416705c4`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/at93c86a-10su-2-7-datasheet.pdf)