# AT93C66N

**HGSEMI** · EEPROM · DIP-8

AT93C66N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip Select; must be pulled high before issuing a command, and pulled low for a minimum of 250 ns (tCS) before Ready/Busy polling. |
| 2 | SK | input | Serial Data Clock used with DI to clock instructions and data, up to 2 MHz at 4.5V to 5.5V. |
| 3 | DI | input | Serial Data Input for the start bit, op code, address and data bits. |
| 4 | DO | tri_state | Serial Data Output for read data and Ready/Busy status, going high impedance when CS is low. |
| 5 | GND | power_in | Ground. |
| 6 | ORG | input | Internal Organization select: connected to Vcc selects x16 mode, grounded selects x8 mode. |
| 7 | NC | unconnected | No Connect. |
| 8 | Vcc | power_in | Power Supply, 1.8V to 5.5V operating range. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Memory |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature |  | -40 |  | 85 | °C |  | 3 |
| Storage Temperature |  | -65 |  | 150 | °C |  | 3 |
| Voltage on Any Pin with Respect to Ground |  | -1 |  |  | V |  | 3 |
| Maximum Operating Voltage |  |  |  | 6.25 | V |  | 3 |
| DC Output Current |  |  |  | 5 | mA |  | 3 |
| Lead Temperature (Soldering) |  |  |  | 260 | °C | Soldering, 10 seconds | 3 |
| Output Capacitance (DO) | COUT |  |  | 5 | pF | TA = 25°C, f = 1.0 MHz, Vcc = +5.0V; VOUT = 0V | 4 |
| Input Capacitance (CK, SK, DI) | CIN |  |  | 5 | pF | TA = 25°C, f = 1.0 MHz, Vcc = +5.0V; VIN = 0V | 4 |
| Supply Voltage | VCC1 | 1.8 |  | 5.5 | V | TAMB = -40°C to +85°C | 4 |
| Supply Voltage | VCC2 | 2.7 |  | 5.5 | V | TAMB = -40°C to +85°C | 4 |
| Supply Voltage | VCC3 | 4.5 |  | 5.5 | V | TAMB = -40°C to +85°C | 4 |
| Supply Current READ | ICC |  | 0.5 | 2 | mA | VCC=5.0V READ at 1 MHz | 4 |
| Supply Current WRITE | ICC |  | 0.5 | 2 | mA | VCC=5.0V WRITE at 1 MHz | 4 |
| Standby Current | ISB1 |  | 0 | 0.1 | μA | VCC=1.8V CS=0V | 4 |
| Standby Current | ISB2 |  | 6 | 10 | μA | VCC=2.7V CS=0V | 4 |
| Standby Current | ISB3 |  | 17 | 3 | μA | VCC=5.0V CS=0V | 4 |
| Input Leakage Current | ILI |  | 0.1 | 3 | μA | VIN=0V to VCC | 4 |
| Output Leakage Current | ILO |  | 0.1 | 3 | μA | VIN=0V to VCC | 4 |
| Input Low Level | VIL1 | -0.6 |  | 0.8 | V | 2.7V<VCC<5.5V | 4 |
| Input High Level | VIH1 | 2 |  |  | V | 2.7V<VCC<5.5V | 4 |
| Input Low Level | VIL2 | -0.6 |  |  | V | 1.8V<VCC<2.7V | 4 |
| Output Low Level | VOL1 |  |  | 0.4 | V | 2.7V<VCC<5.5V; IOL=2.1mA IOH=-0.4mA | 4 |
| Output High Level | VOH1 | 2.4 |  |  | V | 2.7V<VCC<5.5V; IOL=2.1mA IOH=-0.4mA | 4 |
| Output Low Level | VOL2 |  |  | 0.2 | V | 1.8V<VCC<0.7V; IOL=0.15mA IOH=-100μA | 4 |
| Clock Frequency, SK | fSK | 0 |  | 2 | MHz | 4.5V < VCC < 5.5V | 5 |
| Clock Frequency, SK | fSK | 0 |  | 1 | MHz | 2.7V < VCC < 5.5V | 5 |
| Clock Frequency, SK | fSK | 0 |  | 0.25 | MHz | 1.8V < VCC < 5.5V | 5 |
| SK High Time | tSKH | 250 |  |  | ns | 4.5V < VCC < 5.5V | 5 |
| SK High Time | tSKH | 1000 |  |  | ns | 1.8V < VCC < 5.5V | 5 |
| SK Low Time | tSKL | 250 |  |  | ns | 4.5V < VCC < 5.5V | 5 |
| SK Low Time | tSKL | 1000 |  |  | ns | 1.8V < VCC < 5.5V | 5 |
| Minimum CS Low Time | tCS | 250 |  |  | ns | 4.5V < VCC < 5.5V | 5 |
| Minimum CS Low Time | tCS | 1000 |  |  | ns | 1.8V < VCC < 5.5V | 5 |
| CS Setup Time Relative to SK | tCSS | 50 |  |  | ns | 4.5V < VCC < 5.5V | 5 |
| CS Setup Time Relative to SK | tCSS | 200 |  |  | ns | 1.8V < VCC < 5.5V | 5 |
| DI Setup Time Relative to SK | tDIS | 100 |  |  | ns | 4.5V < VCC < 5.5V | 5 |
| DI Setup Time Relative to SK | tDIS | 400 |  |  | ns | 1.8V < VCC < 5.5V | 5 |
| CS Hold Time Relative to SK | tCSH | 0 |  |  | ns | Relative to SK | 5 |
| DI Hold Time Relative to SK | tDIH | 100 |  |  | ns | 4.5V < VCC < 5.5V | 5 |
| DI Hold Time Relative to SK | tDIH | 400 |  |  | ns | 1.8V < VCC < 5.5V | 5 |
| Output Delay to "1" | tPD1 |  |  | 250 | ns | AC Test, 4.5V < VCC < 5.5V | 5 |
| Output Delay to "1" | tPD1 |  |  | 1000 | ns | AC Test, 1.8V < VCC < 5.5V | 5 |
| Output Delay to "0" | tPD0 |  |  | 250 | ns | AC Test, 4.5V < VCC < 5.5V | 5 |
| Output Delay to "0" | tPD0 |  |  | 1000 | ns | AC Test, 1.8V < VCC < 5.5V | 5 |
| CS to Status Valid | tSV |  |  | 250 | ns | AC Test, 4.5V < VCC < 5.5V | 5 |
| CS to Status Valid | tSV |  |  | 1000 | ns | AC Test, 1.8V < VCC < 5.5V | 5 |
| CS to DO in High Impedance | tDF |  |  | 100 | ns | AC Test, CS = VIL, 4.5V < VCC < 5.5V | 5 |
| CS to DO in High Impedance | tDF |  |  | 400 | ns | AC Test, CS = VIL, 1.8V < VCC < 5.5V | 5 |
| Write Cycle Time | tWP |  | 3 | 10 | ms | 4.5V < VCC < 5.5V | 5 |

## CAD (KiCad official)

- Symbol: `AT93C66N`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `at93c66n-etched.step` / `at93c66n-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `at93c66n.step` / `at93c66n.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756372573011615744) (15 pp, sha256 `2c0eab4bbc7b6f6e`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/at93c66n-datasheet.pdf)