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AT28HC64B-70SU
Public Made by Adomby adom
Microchip Tech Pre-ordered MCUs, SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAT28HC64B-70SU
Microchip Tech · Pre-ordered MCUs · SOIC-28-300mil
AT28HC64B-70SU from Microchip Tech, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect; this pin has no internal connection and is left unconnected. |
| 2 | A12 | input | Address input A12 selects the memory location, and A6 to A12 must hold the same page address during a page write. |
| 3 | A7 | input | Address input A7 selects the memory location, and A6 to A12 must hold the same page address during a page write. |
| 4 | A6 | input | Address input A6 selects the memory location, and A6 to A12 must hold the same page address during a page write. |
| 5 | A5 | input | Address input A5 selects the memory location, and A0 to A5 specify which bytes within the page are written. |
| 6 | A4 | input | Address input A4 selects the memory location, and A0 to A5 specify which bytes within the page are written. |
| 7 | A3 | input | Address input A3 selects the memory location, and A0 to A5 specify which bytes within the page are written. |
| 8 | A2 | input | Address input A2 selects the memory location, and A0 to A5 specify which bytes within the page are written. |
| 9 | A1 | input | Address input A1 selects the memory location, and A0 to A5 specify which bytes within the page are written. |
| 10 | A0 | input | Address input A0 selects the memory location, and A0 to A5 specify which bytes within the page are written. |
| 11 | I/O0 | bidirectional | Data input/output bit 0; outputs are high-impedance when CE or OE is high. |
| 12 | I/O1 | bidirectional | Data input/output bit 1; outputs are high-impedance when CE or OE is high. |
| 13 | I/O2 | bidirectional | Data input/output bit 2; outputs are high-impedance when CE or OE is high. |
| 14 | GND | power_in | Ground reference for the device. |
| 15 | I/O3 | bidirectional | Data input/output bit 3; outputs are high-impedance when CE or OE is high. |
| 16 | I/O4 | bidirectional | Data input/output bit 4; outputs are high-impedance when CE or OE is high. |
| 17 | I/O5 | bidirectional | Data input/output bit 5; outputs are high-impedance when CE or OE is high. |
| 18 | I/O6 | bidirectional | Data input/output bit 6; it toggles during a write cycle and is used for Toggle Bit end-of-write detection. |
| 19 | I/O7 | bidirectional | Data input/output bit 7; during a write it presents the complement of the written data for DATA Polling. |
| 20 | CE | input | Chip enable; with OE low and WE high, CE low selects the device for read, and CE high deselects it and puts outputs in high-impedance. |
| 21 | A10 | input | Address input A10 selects the memory location. |
| 22 | OE | input | Output enable; with CE low and WE high, the addressed data is driven onto I/O0 to I/O7. |
| 23 | A11 | input | Address input A11 selects the memory location, and A6 to A12 must hold the same page address during a page write. |
| 24 | A9 | input | Address input A9; raising it to 12 V ±0.5 V enables access to the 64-byte device identification block at 1FC0H to 1FFFH. |
| 25 | A8 | input | Address input A8 selects the memory location, and A6 to A12 must hold the same page address during a page write. |
| 26 | NC | unconnected | No connect; this pin has no internal connection and is left unconnected. |
| 27 | WE | input | Write enable; a low pulse on WE with CE low initiates a write cycle. |
| 28 | VCC | power_in | Single 5 V ±10% power supply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-28-300mil |
| Category | Embedded Processors & Controllers |
| Pins | 28 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature (Case) | -40 | 85 | °C | 5 | |||
| VCC Power Supply | VCC | 5 | V | 5 V ±10% | 5 | ||
| Temperature Under Bias | -55 | 125 | °C | 5 | |||
| Storage Temperature | -65 | 150 | °C | 5 | |||
| All Input Voltages (including NC Pins) with Respect to Ground | -0.6 | 6.25 | V | 5 | |||
| All Output Voltages with Respect to Ground | -0.6 | V | max VCC + 0.6 V | 5 | |||
| Voltage on OE and A9 with Respect to Ground | -0.6 | 13.5 | V | 5 | |||
| Input Load Current | ILI | 10 | µA | VIN = 0 V to VCC + 1 V | 5 | ||
| Output Leakage Current | ILO | 10 | µA | VI/O = 0 V to VCC | 5 | ||
| VCC Standby Current CMOS | ISB1 | 100 | µA | CE = VCC - 0.3 V to VCC + 1 V | 5 | ||
| VCC Standby Current TTL | ISB2 | 2 | mA | CE = 2.0 V to VCC + 1 V | 5 | ||
| VCC Active Current | ICC | 40 | mA | f = 5 MHz; IOUT = 0 mA | 5 | ||
| Input Low Voltage | VIL | 0.8 | V | 5 | |||
| Input High Voltage | VIH | 2 | V | 5 | |||
| Output Low Voltage | VOL | 0.4 | V | IOL = 2.1 mA | 5 | ||
| Output High Voltage | VOH | 2.4 | V | IOH = -400 µA | 5 | ||
| Address to Output Delay | tACC | 70 | ns | 6 | |||
| CE to Output Delay | tCE | 70 | ns | 6 | |||
| OE to Output Delay | tOE | 0 | 35 | ns | 6 | ||
| OE to Output Float | tDF | 0 | 35 | ns | CL = 5 pF | 6 | |
| Output Hold | tOH | 0 | ns | 6 | |||
| Pin Capacitance CIN | CIN | 4 | 6 | pF | f = 1 MHz, T = 25°C; VIN = 0 V | 7 | |
| Pin Capacitance COUT | COUT | 8 | 12 | pF | f = 1 MHz, T = 25°C; VOUT = 0 V | 7 | |
| Address, OE Setup Time | tAS, tOES | 0 | ns | 8 | |||
| Address Hold Time | tAH | 50 | ns | 8 | |||
| Chip Select Setup Time | tCS | 0 | ns | 8 | |||
| Chip Select Hold Time | tCH | 0 | ns | 8 | |||
| Write Pulse Width (WE or CE) | tWP | 100 | ns | 8 | |||
| Data Setup Time | tDS | 50 | ns | 8 | |||
| Data, OE Hold Time | tDH, tOEH | 0 | ns | 8 | |||
| Write Cycle Time | tWC | 10 | ms | 9 | |||
| Address Setup Time | tAS | 0 | ns | 9 | |||
| Data Setup Time | tDS | 50 | ns | 9 | |||
| Data Hold Time | tDH | 0 | ns | 9 | |||
| Write Pulse Width | tWP | 100 | ns | 9 | |||
| Byte Load Cycle Time | tBLC | 150 | µs | 9 | |||
| Write Pulse Width High | tWPH | 50 | ns | 9 | |||
| Data Polling Data Hold Time | tDH | 0 | ns | 11 | |||
| Data Polling OE Hold Time | tOEH | 0 | ns | 11 | |||
| Data Polling Write Recovery Time | tWR | 0 | ns | 11 | |||
| Toggle Bit Data Hold Time | tDH | 10 | ns | 11 | |||
| Toggle Bit OE Hold Time | tOEH | 10 | ns | 11 | |||
| Toggle Bit OE High Pulse | tOEHP | 150 | ns | 11 | |||
| Toggle Bit Write Recovery Time | tWR | 0 | ns | 11 |
CAD (KiCad official)
- Symbol:
AT28HC64B-70SU - Footprint:
Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm - 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
- 3D model files:
at28hc64b-70su-etched.step/at28hc64b-70su-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at28hc64b-70su.step/at28hc64b-70su.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (17 pp, sha256
4d1c81d44d8fce71, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).