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AT28C64B-15PU
Public Made by Adomby adom
Microchip Tech EEPROM, DIP-28-600mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAT28C64B-15PU
Microchip Tech · EEPROM · DIP-28-600mil
AT28C64B-15PU from Microchip Tech, in a DIP-28-600mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect pin on the 28-lead PDIP; it has no internal connection. |
| 2 | A12 | input | Address input; A6 to A12 select the page, and all bytes of a page write must share the same A6 to A12 state on each WE high-to-low transition. |
| 3 | A7 | input | Address input; part of the A6 to A12 page address that must remain constant during a page write. |
| 4 | A6 | input | Address input; part of the A6 to A12 page address that must remain constant during a page write. |
| 5 | A5 | input | Address input; A0 to A5 select which byte within the 64-byte page is written. |
| 6 | A4 | input | Address input; A0 to A5 select which byte within the 64-byte page is written. |
| 7 | A3 | input | Address input; A0 to A5 select which byte within the 64-byte page is written. |
| 8 | A2 | input | Address input; A0 to A5 select which byte within the 64-byte page is written. |
| 9 | A1 | input | Address input; A0 to A5 select which byte within the 64-byte page is written. |
| 10 | A0 | input | Address input; A0 to A5 select which byte within the 64-byte page is written. |
| 11 | I/O0 | bidirectional | Data input/output; outputs go to high impedance when CE or OE is high. |
| 12 | I/O1 | bidirectional | Data input/output; outputs go to high impedance when CE or OE is high. |
| 13 | I/O2 | bidirectional | Data input/output; outputs go to high impedance when CE or OE is high. |
| 14 | GND | power_in | Ground reference for the device. |
| 15 | I/O3 | bidirectional | Data input/output; outputs go to high impedance when CE or OE is high. |
| 16 | I/O4 | bidirectional | Data input/output; outputs go to high impedance when CE or OE is high. |
| 17 | I/O5 | bidirectional | Data input/output; outputs go to high impedance when CE or OE is high. |
| 18 | I/O6 | bidirectional | Data input/output; I/O6 toggles during a write cycle and stops when the write completes (toggle bit). |
| 19 | I/O7 | bidirectional | Data input/output; the complement of written data appears here during a write cycle (DATA Polling) and true data once the write completes. |
| 20 | CE | input | Chip enable; CE must be low with OE low and WE high to read, and a high level puts the device in standby with CMOS standby current below 100 µA. |
| 21 | A10 | input | Address input; A10 is one of the memory address bits. |
| 22 | OE | input | Output enable; with CE low and WE high, OE low asserts the addressed data on the outputs, and OE high holds the outputs in high impedance. |
| 23 | A11 | input | Address input; part of the A6 to A12 page address that must remain constant during a page write. |
| 24 | A9 | input | Address input; raising A9 to 12.0 V ±0.5 V with addresses 1FC0H to 1FFFH accesses the 64-byte device identification EEPROM, and absolute maximum on A9 is -0.6 V to +13.5 V. |
| 25 | A8 | input | Address input; part of the A6 to A12 page address that must remain constant during a page write. |
| 26 | NC | unconnected | No connect pin on the 28-lead PDIP; it has no internal connection. |
| 27 | WE | input | Write enable; a low pulse on WE with CE low and OE high starts a write cycle, and pulses shorter than 15 ns (typical) are filtered out. |
| 28 | VCC | power_in | Power supply, 5 V ±10% per the DC and AC operating range. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | DIP-28-600mil |
| Category | Memory |
| Pins | 28 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature (Case) | -40 | 85 | °C | 5 | |||
| VCC Power Supply | VCC | 5 | V | 5 | |||
| VCC Power Supply tolerance (5V ±10%) | VCC | -10 | 10 | % | 5 | ||
| VCC Active Current | ICC | 40 | mA | f = 5 MHz; IOUT = 0 mA | 5 | ||
| VCC Standby Current CMOS | ISB1 | 100 | µA | CE = VCC - 0.3V to VCC + 1V | 5 | ||
| VCC Standby Current TTL | ISB2 | 2 | mA | CE = 2.0V to VCC + 1V | 5 | ||
| Input Load Current | ILI | 10 | µA | VIN = 0V to VCC + 1V | 5 | ||
| Output Leakage Current | ILO | 10 | µA | VI/O = 0V to VCC | 5 | ||
| Input Low Voltage | VIL | 0.8 | V | 5 | |||
| Input High Voltage | VIH | 2 | V | 5 | |||
| Output Low Voltage | VOL | 0.4 | V | IOL = 2.1 mA | 5 | ||
| Output High Voltage | VOH | 2.4 | V | IOH = -400 µA | 5 | ||
| Address to Output Delay (AT28C64B-15) | tACC | 150 | ns | 6 | |||
| CE to Output Delay (AT28C64B-15) | tCE | 150 | ns | 6 | |||
| OE to Output Delay (AT28C64B-15) | tOE | 0 | 70 | ns | 6 | ||
| CE or OE to Output Float (AT28C64B-15) | tDF | 0 | 50 | ns | CL = 5 pF | 6 | |
| Output Hold from OE, CE or Address, whichever occurred first (AT28C64B-15) | tOH | 0 | ns | 6 | |||
| Input Pin Capacitance | CIN | 4 | 6 | pF | VIN = 0V | 7 | |
| Output Pin Capacitance | COUT | 8 | 12 | pF | VOUT = 0V | 7 | |
| Address, OE Setup Time | tAS, tOES | 0 | ns | 8 | |||
| Address Hold Time | tAH | 50 | ns | 8 | |||
| Chip Select Setup Time | tCS | 0 | ns | 8 | |||
| Chip Select Hold Time | tCH | 0 | ns | 8 | |||
| Write Pulse Width (WE or CE) | tWP | 100 | ns | 8 | |||
| Data Setup Time | tDS | 50 | ns | 8 | |||
| Data, OE Hold Time | tDH, tOEH | 0 | ns | 8 | |||
| Write Cycle Time (standard) | tWC | 10 | ms | 9 | |||
| Byte Load Cycle Time | tBLC | 150 | µs | 9 | |||
| Write Pulse Width High | tWPH | 50 | ns | 9 | |||
| Chip Erase Setup Time | tS | 1 | µs | 9 | |||
| Chip Erase Hold Time | tH | 1 | µs | 9 | |||
| Chip Erase Write Time | tW | 10 | ms | 9 | |||
| Data Hold Time (DATA Polling) | tDH | 0 | ns | 11 | |||
| OE Hold Time (DATA Polling) | tOEH | 0 | ns | 11 | |||
| Write Recovery Time (DATA Polling) | tWR | 0 | ns | 11 | |||
| Data Hold Time (Toggle Bit) | tDH | 10 | ns | 11 | |||
| OE Hold Time (Toggle Bit) | tOEH | 10 | ns | 11 | |||
| OE High Pulse (Toggle Bit) | tOEHP | 150 | ns | 11 | |||
| Write Recovery Time (Toggle Bit) | tWR | 0 | ns | 11 | |||
| Temperature Under Bias | -55 | 125 | °C | 5 | |||
| Storage Temperature | -65 | 150 | °C | 5 | |||
| All Input Voltages (including NC pins) with respect to Ground | -0.6 | 6.25 | V | 5 | |||
| All Output Voltages with respect to Ground | -0.6 | V | Maximum printed as VCC + 0.6 V | 5 | |||
| Voltage on OE and A9 with respect to Ground | -0.6 | 13.5 | V | 5 |
CAD (KiCad official)
- Symbol:
AT28C64B-15PU - Footprint:
Package_DIP:DIP-28_W7.62mm - 3D model: DIP-28-600mil (KiCad packages3D, STEP)
- 3D model files:
at28c64b-15pu-etched.step/at28c64b-15pu-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at28c64b-15pu.step/at28c64b-15pu.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (18 pp, sha256
fa7183edcd4cbf3c, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).