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AT28C256-15SU

Public Made by Adom

by adom

Microchip Tech Pre-ordered Chips, SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT28C256-15SU

Microchip Tech · Pre-ordered Chips · SOIC-28-300mil

AT28C256-15SU from Microchip Tech, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A14 input Address input for the 32,768-byte array (organized as 32,768 x 8).
2 A12 input Address input for the 32,768-byte array (organized as 32,768 x 8).
3 A7 input Address input for the 32,768-byte array (organized as 32,768 x 8).
4 A6 input Address input for the 32,768-byte array (organized as 32,768 x 8).
5 A5 input Address input for the 32,768-byte array (organized as 32,768 x 8).
6 A4 input Address input for the 32,768-byte array (organized as 32,768 x 8).
7 A3 input Address input for the 32,768-byte array (organized as 32,768 x 8).
8 A2 input Address input for the 32,768-byte array (organized as 32,768 x 8).
9 A1 input Address input for the 32,768-byte array (organized as 32,768 x 8).
10 A0 input Address input for the 32,768-byte array (organized as 32,768 x 8).
11 I/O0 bidirectional Data input/output bit 0 of the 8-bit data bus.
12 I/O1 bidirectional Data input/output bit 1 of the 8-bit data bus.
13 I/O2 bidirectional Data input/output bit 2 of the 8-bit data bus.
14 GND power_in Ground reference for the device.
15 I/O3 bidirectional Data input/output bit 3 of the 8-bit data bus.
16 I/O4 bidirectional Data input/output bit 4 of the 8-bit data bus.
17 I/O5 bidirectional Data input/output bit 5 of the 8-bit data bus.
18 I/O6 bidirectional Data input/output bit 6 of the 8-bit data bus.
19 I/O7 bidirectional Data input/output bit 7 of the 8-bit data bus; DATA Polling of I/O7 indicates end of write.
20 CE input Chip Enable input; when the device is deselected the CMOS standby current is less than 200 µA.
21 A10 input Address input for the 32,768-byte array (organized as 32,768 x 8).
22 OE input Output Enable input controlling the data outputs.
23 A11 input Address input for the 32,768-byte array (organized as 32,768 x 8).
24 A9 input Address input for the 32,768-byte array (organized as 32,768 x 8).
25 A8 input Address input for the 32,768-byte array (organized as 32,768 x 8).
26 A13 input Address input for the 32,768-byte array (organized as 32,768 x 8).
27 WE input Write Enable input controlling writes to the device.
28 VCC power_in Device power supply, single 5V ± 10% supply.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-28-300mil
Category Interface ICs
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Temperature under bias -55 125 °C 7
Storage temperature -65 150 °C 7
All input voltages (including NC pins) with respect to ground -0.6 6.25 V 7
All output voltages with respect to ground -0.6 V VCC + 0.6V 7
Voltage on OE and A9 with respect to ground -0.6 13.5 V 7
Operating Temperature (Case) Industrial -40 85 °C AT28C256-15 7
VCC Power Supply tolerance VCC -10 10 % 5V ± 10% 7
VCC Standby Current CMOS ISB1 200 μA CE = VCC - 0.3V to VCC + 1V 7
VCC Standby Current TTL ISB2 3 mA CE = 2.0V to VCC + 1V 7
VCC Active Current ICC 50 mA f = 5 MHz; IOUT = 0 mA 7
Input Load Current ILI 10 μA VIN = 0V to VCC + 1V 7
Output Leakage Current ILO 10 μA VI/O = 0V to VCC 7
Input Low Voltage VIL 0.8 V 7
Input High Voltage VIH 2 V 7
Output Low Voltage VOL 0.45 V IOL = 2.1 mA 7
Output High Voltage VOH1 2.4 V IOH = -400 μA 7
Pin Capacitance input CIN 4 6 pF VIN = 0V 8
Pin Capacitance output COUT 8 12 pF VOUT = 0V 8
Address to Output Delay tACC 150 ns 11
CE to Output Delay tCE 150 ns 11
OE to Output Delay tOE 0 70 ns 11
CE or OE to Output Float tDF 0 50 ns 11
Output Hold from OE, CE or Address, whichever occurred first tOH 0 ns 11
Address, OE Setup Time tAS, tOES 0 ns 13
Address Hold Time tAH 50 ns 13
Chip Select Setup Time tCS 0 ns 13
Chip Select Hold Time tCH 0 ns 13
Write Pulse Width (WE or CE) tWP 100 ns 13
Data Setup Time tDS 50 ns 13
Data, OE Hold Time tDH, tOEH 0 ns 13
Write Cycle Time (AT28C256) tWC 10 ms 14
Page Mode Address Setup Time tAS 0 ns 14
Page Mode Address Hold Time tAH 50 ns 14
Page Mode Data Setup Time tDS 50 ns 14
Page Mode Data Hold Time tDH 0 ns 14
Page Mode Write Pulse Width tWP 100 ns 14
Byte Load Cycle Time tBLC 150 µs 14
Write Pulse Width High tWPH 50 ns 14

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin U = -40°C to +85°C Industrial Temperature Grade, 100% Matte Sn Terminal Finish AT28 C 256 ( )- 15 29

CAD (KiCad official)

  • Symbol: AT28C256-15SU
  • Footprint: Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm
  • 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
  • 3D model files: at28c256-15su-etched.step / at28c256-15su-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at28c256-15su.step / at28c256-15su.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (32 pp, sha256 2a586001cf95d3b5, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF