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AT25M02-SSHM-T

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Microchip Tech Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT25M02-SSHM-T

Microchip Tech · Pre-ordered Chips · SOIC-8

AT25M02-SSHM-T from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip Select is active low, so the device is selected only when CS is low; when deselected, SI data is not accepted and SO stays high-impedance, and CS should be pulled up to VCC with a resistor of 10 kOhm or less.
2 SO output Serial Data Output shifts read data out after the falling edge of SCK and remains in a high-impedance state when the device is not selected.
3 WP input Write-Protect driven low while WPEN is 1 inhibits all STATUS register write operations, the pin is blocked when WPEN is 0, and it should be driven high or low as appropriate.
4 GND power_in Ground is the reference for the device power supply and should be connected to the system ground.
5 SI input Serial Data Input receives instructions, addresses and data, which are latched on the rising edge of SCK.
6 SCK input Serial Data Clock synchronizes communication, latching SI on its rising edge and clocking SO out on its falling edge.
7 HOLD input HOLD, used together with CS, pauses serial communication when brought low while SCK is low and resumes when brought high while SCK is low, and it should be driven high or low as appropriate.
8 VCC power_in Device Power Supply supplies the source voltage to the device, and operation at invalid VCC voltages may produce spurious results and should not be attempted.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating temperature -55 125 °C 9
Storage temperature -65 150 °C 9
Voltage on any pin with respect to ground -1 7 V 9
VCC 6.25 V 9
DC output current 5 mA 9
ESD protection 4 kV 9
Operating Temperature (Case) Industrial Temperature Range -40 85 °C 9
VCC Power Supply Low-Voltage Grade 1.7 5.5 V 9
VCC Power Supply Standard-Voltage Grade 2.5 5.5 V 9
Supply Voltage VCC1 1.7 5.5 V 9
Supply Voltage VCC2 2.5 5.5 V 9
Supply Current ICC1 0.3 1 mA VCC = 1.8V(3) at 1 MHz, SO = Open, Read 9
Supply Current ICC2 0.5 1 mA VCC = 1.8V(3) at 5 MHz, SO = Open, Read, Write 9
Supply Current ICC3 1 2 mA VCC = 5.0V at 1 MHz, SO = Open, Read 9
Supply Current ICC4 2 3 mA VCC = 5.0V at 5 MHz, SO = Open, Read 9
Supply Current ICC5 0.3 2 mA VCC = 1.8V(3), SO = Open, During tWC, CS = VCC 10
Supply Current ICC6 0.5 3 mA VCC = 5.0V, SO = Open, During tWC, CS = VCC 10
Standby Current ISB1 0.08 1 µA VCC = 1.8V(3), CS = VCC 10
Standby Current ISB2 0.08 2 µA VCC = 2.5V, CS = VCC 10
Standby Current ISB3 0.15 3 µA VCC = 5.5V, CS = VCC 10
Input Leakage IIL -3 3 µA VIN = 0V to VCC 10
Output Leakage IOL -3 3 µA VIN = 0V to VCC, TA = 0°C to +70°C 10
Input Low-Voltage VIL -1 V 10
Output Low-Voltage VOL1 0.4 V 3.6V ≤ VCC ≤ 5.5V IOL = 3.0 mA 10
Output Low-Voltage VOL2 0.2 V 1.7V ≤ VCC ≤ 3.6V IOL = 0.15 mA 10
SCK Clock Frequency fSCK 0 5 MHz 11
Input Rise Time tRI 80 ns 11
Input Fall Time tFI 80 ns 11
SCK High Time tWH 80 ns 11
SCK Low Time tWL 80 ns 11
CS High Time tCS 200 ns 11
CS Setup Time tCSS 200 ns 11
CS Hold Time tCSH 200 ns 11
Data In Setup Time tSU 20 ns 11
Data In Hold Time tH 20 ns 11
HOLD Setup Time tHD 20 ns 11
HOLD Hold Time tCD 20 ns 11
Output Valid tV 0 80 ns 11
Output Hold Time tHO 0 ns 11
HOLD to Output Low-Z tLZ 0 100 ns 11
HOLD to Output High-Z tHZ 100 ns 11
Output Disable Time tDIS 100 ns 11
Write Cycle Time tWC 10 ms 11
Time required after VCC is stable before the device can accept instructions tPUP 100 µs 12
Power-on Reset Threshold Voltage VPOR 1.5 V 12
Minimum time at VCC = 0V between power cycles tPOFF 1 ms 12
Output Capacitance (SO) COUT 8 pF VOUT = 0V 13
Input Capacitance (CS, SCK, SI, WP, HOLD) CIN 6 pF VIN = 0V 13
Write Endurance 1e+06 Write Cycles TA = 25°C, VCC(min.) < VCC < VCC(max.), Byte or Page Write mode 13
Data Retention 100 Years TA = 55°C 13

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc. 28

CAD (KiCad official)

  • Symbol: AT25M02-SSHM-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: at25m02-sshm-t-etched.step / at25m02-sshm-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at25m02-sshm-t.step / at25m02-sshm-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (37 pp, sha256 18d23e907911498f, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF