# AT24LC512CN

**HGSEMI** · EEPROM · DIP-8

AT24LC512CN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E0 | input | Device address input that can be tied to VCC or GND (internally pulled down to GND if left floating) to allow up to eight devices on one bus. |
| 2 | E1 | input | Device address input that can be tied to VCC or GND (internally pulled down to GND if left floating) to allow up to eight devices on one bus. |
| 3 | E2 | input | Device address input that can be tied to VCC or GND (internally pulled down to GND if left floating) to allow up to eight devices on one bus. |
| 4 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 5 | SDA | bidirectional | Open-drain bidirectional serial data pin used to transfer data to and from the device. |
| 6 | SCL | input | Serial clock input that controls data flow; input data is latched on the rising edge of SCL and output data is clocked out on the falling edge. |
| 7 | WP | input | Write protection input; connected to VCC the entire memory array is write-protected (read-only), connected to GND or left floating write operations are enabled. |
| 8 | VCC | power_in | Device power supply pin, 1.7V to 5.5V; operation at invalid VCC voltages may produce spurious results. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Memory |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ambient temperature with power applied |  | -55 |  | 130 | °C |  | 18 |
| Storage temperature | TSTG | -65 |  | 150 | °C |  | 18 |
| Supply voltage | VCC | -0.5 |  | 6.5 | V |  | 18 |
| Voltage on input pins | VIN | -0.5 |  | 6.5 | V |  | 18 |
| Electrostatic pulse (human body model) | VESD |  |  | 6000 | V | Human body model | 18 |
| Supply voltage | VCC | 1.7 |  | 5.5 | V | Operating range TA = -40°C to +105°C | 18 |
| Operating temperature range | TA | -40 |  | 105 | °C | VCC = 1.7V to 5.5V | 18 |
| Power-On Reset Time | tPOR |  |  | 10 | ms |  | 6 |
| Power-On Reset Voltage | VPOR |  |  | 1.5 | V |  | 6 |
| Brown-out Reset Voltage | VBOR | 0.8 |  |  | V |  | 6 |
| Time from Power-On to First Command | tINIT | 10 |  |  | ms |  | 6 |
| Supply Current (Read) | ICC1 |  |  | 0.15 | mA | VCC= 1.7V, Read at 1MHz | 18 |
| Supply Current (Read) | ICC1 |  |  | 0.4 | mA | VCC= 5.5V, Read at 400 kHz | 18 |
| Supply Current (Read) | ICC1 |  |  | 0.5 | mA | VCC= 5.5V, Read at 1MHz | 18 |
| Supply Current (Write) | ICC2 |  |  | 0.5 | mA | VCC= 1.7V, Write at 400 kHz | 18 |
| Supply Current (Write) | ICC2 |  |  | 1 | mA | VCC= 5.5V, Write at 400 kHz | 18 |
| Standby Current | ISB |  |  | 0.5 | μA | VCC = 1.7V, VIN = VCC or GND | 18 |
| Standby Current | ISB |  |  | 1 | μA | VCC = 5.5V, VIN = VCC or GND | 18 |
| Input Leakage Current | ILI |  |  | 1 | μA | VIN = VCC or GND | 18 |
| Output Leakage Current | ILO |  |  | 1 | μA | VOUT = VCC or GND | 18 |
| Input Low-Level Voltage (SDA, SCL) | VIL | -0.5 |  |  | V | Printed max = 0.3*VCC | 18 |
| Input High-Level Voltage (SDA, SCL) | VIH | 0.7 |  |  | *VCC | Printed min = 0.7*VCC; printed max = VCC+0.5 V (expression) | 18 |
| Low-Level Output Voltage | VOL1 |  |  | 0.4 | V | VCC > 2V, IOL = 3mA | 18 |
| Low-Level Output Voltage | VOL2 |  |  | 0.2 | V | VCC ≤ 2V, IOL = 2mA | 18 |
| Clock Frequency, SCL | fSCL |  |  | 400 | kHz | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Clock Frequency, SCL | fSCL |  |  | 1000 | kHz | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Clock Pulse Width Low | tLOW | 1300 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Clock Pulse Width Low | tLOW | 600 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Clock Pulse Width High | tHIGH | 600 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Clock Pulse Width High | tHIGH | 260 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| SDA Rise Time | tR |  |  | 300 | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| SDA(Out) Fall Time | tF |  |  | 300 | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| SDA(Out) Fall Time | tF |  |  | 100 | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Start Hold Time | tHD.STA | 600 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Start Hold Time | tHD.STA | 250 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Start Setup Time | tSU.STA | 600 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Start Setup Time | tSU.STA | 250 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Stop Setup Time | tSU.STO | 600 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Stop Setup Time | tSU.STO | 250 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Bus Free Time between Stop and Next Start | tBUF | 1300 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Bus Free Time between Stop and Next Start | tBUF | 500 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Data In Hold Time | tHD.DI | 0 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Data In Setup Time | tSU.DAT | 100 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Data In Setup Time | tSU.DAT | 50 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Data Out Hold Time | tHD.DAT | 50 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| SCL Low to Data Out Valid | tAA | 100 |  | 900 | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| SCL Low to Data Out Valid | tAA | 50 |  | 500 | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| WP Pin Setup Time | tSU.WP | 1200 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| WP Pin Setup Time | tSU.WP | 600 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| WP Pin Hold Time | tHD.WP | 1200 |  |  | ns | Fast mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| WP Pin Hold Time | tHD.WP | 600 |  |  | ns | High Speed mode, VCC = 1.7V to 5.5V, CL = 100pF | 19 |
| Write Cycle Time | tWR |  |  | 5 | ms | Fast and High Speed modes, VCC = 1.7V to 5.5V | 19 |
| Noise Suppression Time | tI |  |  | 50 | ns | Fast and High Speed modes | 19 |
| Input/output Capacitance (SDA) | CI/O |  |  | 8 | pF | VI/O = 0V, TA = +25°C, fC = 1MHz | 21 |
| Input Capacitance (other pins) | CIN |  |  | 6 | pF | VIN = 0V, TA = +25°C, fC = 1MHz | 21 |
| Data Retention | DR | 200 |  |  | year | TA = +25°C | 21 |

## CAD (KiCad official)

- Symbol: `AT24LC512CN`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `at24lc512cn-etched.step` / `at24lc512cn-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `at24lc512cn.step` / `at24lc512cn.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](docs/at24lc512cn-datasheet.pdf) (26 pp, sha256 `31557ed94b2b886b`, retrieved 2026-10-14, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/at24lc512cn-datasheet.pdf)