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AT24C64B-10TU-1.8

Microchip Tech · Pre-ordered Chips · TSSOP-8

AT24C64B-10TU-1.8 from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	A0	input	Device address input, hard-wired to GND or VCC (up to eight devices per bus); internally pulled down to GND if not driven.
2	A1	input	Device address input, hard-wired to GND or VCC (up to eight devices per bus); internally pulled down to GND if not driven.
3	A2	input	Device address input, hard-wired to GND or VCC (up to eight devices per bus); internally pulled down to GND if not driven.
4	GND	power_in	Ground reference for the power supply, connected to system ground.
5	SDA	bidirectional	Open-drain bidirectional serial data pin requiring an external pull-up resistor not exceeding 10 kΩ.
6	SCL	input	Serial clock input; data is latched on the rising edge and output on the falling edge, and the pin must be forced high or pulled up when the bus is idle.
7	WP	input	Write-protect input; at GND allows normal writes, at VCC inhibits writes to the upper 16 Kb quadrant (0x1800-0x1FFF); internally pulled down to GND if not driven.
8	VCC	power_in	Device power supply, 1.8V to 5.5V operation for this variant.

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	TSSOP-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage (1.8V option)	VCC1	1.8		5.5	V	Low-Voltage Grade	9
Operating Temperature (Case)		-40		85	°C	Industrial Temperature Range	9
Supply Current Read	ICC1		0.4	1	mA	VCC = 5.0V, Read at 400 kHz	9
Supply Current Write	ICC2		2	3	mA	VCC = 5.0V, Write at 400 kHz	9
Standby Current (1.8V Option)	ISB1			1	μA	VCC = 1.8V, VIN = VCC or GND	9
Input Leakage Current	ILI		0.1	3	μA	VIN = VCC or GND	10
Output Leakage Current	ILO		0.05	3	μA	VOUT = VCC or GND	10
Input Low Level	VIL	-0.6			V	Note 2; max is VCC x 0.3	10
Output Low Level	VOL1			0.2	V	VCC = 1.8V, IOL = 0.15 mA	10
Output Low Level	VOL2			0.4	V	VCC = 3.0V, IOL = 2.1 mA	10
Clock Frequency, SCL	fSCL			400	kHz	VCC = 1.8V to 3.6V	10
Clock Pulse Width Low	tLOW	1300			ns	VCC = 1.8V to 3.6V	10
Clock Pulse Width High	tHIGH	600			ns	VCC = 1.8V to 3.6V	10
Noise Suppression Time	tI			100	ns	VCC = 1.8V to 3.6V	10
Clock Low to Data Out Valid	tAA	200		900	ns	VCC = 1.8V to 3.6V	10
Bus Free Time between Stop and Start	tBUF	1300			ns	VCC = 1.8V to 3.6V	10
Start Hold Time	tHD.STA	600			ns	VCC = 1.8V to 3.6V	10
Start Set-up Time	tSU.STA	600			ns	VCC = 1.8V to 3.6V	10
Data In Hold Time	tHD.DAT	0			ns	VCC = 1.8V to 3.6V	10
Data In Set-up Time	tSU.DAT	100			ns	VCC = 1.8V to 3.6V	10
Inputs Rise Time	tR			300	ns	VCC = 1.8V to 3.6V	10
Inputs Fall Time	tF			300	ns	VCC = 1.8V to 3.6V	10
Stop Set-up Time	tSU.STO	600			ns	VCC = 1.8V to 3.6V	10
Data Out Hold Time	tDH	200			ns	VCC = 1.8V to 3.6V	10
Write Cycle Time	tWR			5	ms	VCC = 1.8V to 3.6V	10
Time required after VCC is stable before device accepts commands	tPUP	100			µs		11
Power-on Reset Threshold Voltage	VPOR			1.5	V		11
Minimum time at VCC = 0V between power cycles	tPOFF	500			ms		12
Input/Output Capacitance (SDA)	CI/O			8	pF	VI/O = 0V	12
Input Capacitance (A0, A1, A2 and SCL)	CIN			6	pF	VIN = 0V	12
Write Endurance		1e+06			Write Cycles	TA = 25°C, VCC = 3.3V, Page Write mode	12
Data Retention		100			Years	TA = 55°C	12
Supply Voltage VCC	VCC			6.25	V		9
Voltage on any pin with respect to ground		-1		7	V		9
Storage temperature		-65		150	°C		9
Temperature under bias		-55		125	°C		9
DC output current				5	mA		9
ESD protection		2.5			kV	>2.5 kV	9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc.	25

CAD (KiCad official)

Symbol: AT24C64B-10TU-1.8
Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
3D model: TSSOP-8 (KiCad packages3D, STEP)
3D model files: at24c64b-10tu-1-8-etched.step / at24c64b-10tu-1-8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c64b-10tu-1-8.step / at24c64b-10tu-1-8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (35 pp, sha256 b7271c48d7ee12d2, retrieved 2026-10-23, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF