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AT24C32D-XHM-T

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Microchip Tech EEPROM, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT24C32D-XHM-T

Microchip Tech · EEPROM · TSSOP-8

AT24C32D-XHM-T from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input hard-wired to GND or VCC; if left floating it is internally pulled down to GND, and Microchip recommends pull-up resistors of 10 kΩ or less.
2 A1 input Device address input hard-wired to GND or VCC; if left floating it is internally pulled down to GND, and Microchip recommends pull-up resistors of 10 kΩ or less.
3 A2 input Device address input hard-wired to GND or VCC; if left floating it is internally pulled down to GND, and Microchip recommends pull-up resistors of 10 kΩ or less.
4 GND power_in Ground reference for the power supply, which should be connected to the system ground.
5 SDA bidirectional Open-drain serial data input/output that must be pulled high with an external pull-up resistor not exceeding 10 kΩ and may be wire-ORed with other open-drain devices.
6 SCL input Serial clock input that latches command and input data on its rising edge and must be forced high or pulled high when the bus is idle.
7 WP input Write-protect input: connecting it to GND allows normal write operations, while connecting it to VCC inhibits all writes to the protected memory (full array); if left floating it is internally pulled down to GND.
8 VCC power_in Device power supply pin; operation at invalid VCC voltages may produce spurious results and should not be attempted (the device operates from 1.7 V to 5.5 V).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Temperature under bias -55 125 °C 9
Storage temperature -65 150 °C 9
VCC VCC 6.25 V 9
Voltage on any pin with respect to ground -1 7 V 9
DC output current 5 mA 9
ESD protection 3 kV 9
Operating Temperature (Case), Industrial Temperature Range -40 85 °C 9
VCC Power Supply, Low Voltage Grade VCC 1.7 5.5 V 9
Supply Voltage VCC1 1.7 5.5 V 9
Supply Current (Read) ICC1 0.4 1 mA VCC = 5.0V, Read at 400 kHz 9
Supply Current (Write) ICC2 2 3 mA VCC = 5.0V, Write at 400 kHz 9
Standby Current ISB1 1 μA VCC = 1.7V, VIN = VCC or GND 9
Standby Current 6 μA VCC = 5.0V, VIN = VCC or GND 9
Input Leakage Current ILI 0.1 3 μA VIN = VCC or GND; VCC = 5.0V 9
Output Leakage Current ILO 0.05 3 μA VOUT = VCC or GND; VCC = 5.0V 9
Input Low Level VIL -0.6 V Note 2 9
Output Low Level VOL1 0.2 V VCC = 1.7V, IOL = 0.15 mA 10
Output Low Level VOL2 0.4 V VCC = 3.0V, IOL = 2.1 mA 10
Clock Frequency, SCL fSCL 400 kHz 1.7V column 10
Clock Frequency, SCL fSCL 1000 kHz 2.5V, 5.0V column 10
Clock Pulse Width Low tLOW 1300 ns 1.7V column 10
Clock Pulse Width Low tLOW 500 ns 2.5V, 5.0V column 10
Clock Pulse Width High tHIGH 600 ns 1.7V column 10
Clock Pulse Width High tHIGH 400 ns 2.5V, 5.0V column 10
Noise Suppression Time tI 100 ns 1.7V column 10
Noise Suppression Time tI 50 ns 2.5V, 5.0V column 10
Clock Low to Data Out Valid tAA 50 900 ns 1.7V column 10
Clock Low to Data Out Valid tAA 50 450 ns 2.5V, 5.0V column 10
Bus Free Time between Stop and Start tBUF 1300 ns 1.7V column 10
Bus Free Time between Stop and Start tBUF 500 ns 2.5V, 5.0V column 10
Start Hold Time tHD.STA 600 ns 1.7V column 10
Start Hold Time tHD.STA 250 ns 2.5V, 5.0V column 10
Start Set-up Time tSU.STA 600 ns 1.7V column 10
Start Set-up Time tSU.STA 250 ns 2.5V, 5.0V column 10
Data In Hold Time tHD.DAT 0 ns 1.7V column 10
Data In Set-up Time tSU.DAT 100 ns 1.7V column 10
Inputs Rise Time tR 300 ns 1.7V column 10
Inputs Fall Time tF 300 ns 1.7V column 10
Inputs Fall Time tF 100 ns 2.5V, 5.0V column 10
Stop Set-up Time tSU.STO 600 ns 1.7V column 10
Stop Set-up Time tSU.STO 250 ns 2.5V, 5.0V column 10
Data Out Hold Time tDH 50 ns 1.7V column 10
Write Cycle Time tWR 5 ms 1.7V column 10
Minimum time after VCC is stable before device accepts commands tPUP 100 µs 11
Power-on Reset Threshold Voltage VPOR 1.5 V 11
Minimum time at VCC = 0V between power cycles tPOFF 500 ms 11
Input/Output Capacitance (SDA) CI/O 8 pF VI/O = 0V 12
Input Capacitance (A0, A1, A2 and SCL) CIN 6 pF VIN = 0V 12
Write Endurance 1e+06 Write Cycles TA = 25°C, VCC = 3.3V, Page Write mode 12
Data Retention 100 Years TA = 55°C 12

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc. 25

CAD (KiCad official)

  • Symbol: AT24C32D-XHM-T
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c32d-xhm-t-etched.step / at24c32d-xhm-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c32d-xhm-t.step / at24c32d-xhm-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (41 pp, sha256 a65f64dbb6baaabc, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF