component
AT24C256N
Public Made by Adomby adom
HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AT24C256N
HGSEMI · EEPROM · DIP-8
AT24C256N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input that is hardwired to VIH or VIL, and is read as VIL if left unconnected. |
| 2 | A1 | input | Device address input that is hardwired to VIH or VIL, and is read as VIL if left unconnected. |
| 3 | A2 | input | Device address input that is hardwired to VIH or VIL, and is read as VIL if left unconnected. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | Serial data line that is bi-directional with an open-drain output, so it can be wire-ORed and is typically pulled high by an external resistor. |
| 6 | SCL | input | Serial clock input where the rising edge latches data into the EEPROM and the falling edge clocks data out. |
| 7 | WP | input | Write protect input that blocks all programming when connected to VIH or VCC, allows programming when left unconnected or at VIL, and does not affect reads. |
| 8 | VCC | power_in | Supply voltage of 1.8V to 5.5V, with a decoupling capacitor of at least 10nF recommended. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Clock frequency, SCL | fSCL | 400 | kHz | VCC 1.8V column | 9 | ||
| Clock frequency, SCL | fSCL | 1000 | kHz | VCC 2.5-5.0V column | 9 | ||
| Noise suppression time | tI | 100 | ns | VCC 1.8V column | 9 | ||
| Noise suppression time | tI | 50 | ns | VCC 2.5-5.0V column | 9 | ||
| Clock pulse width low | tLOW | 1.3 | µs | VCC 1.8V column | 9 | ||
| Clock pulse width low | tLOW | 0.4 | µs | VCC 2.5-5.0V column | 9 | ||
| Clock pulse width high | tHIGH | 0.6 | µs | VCC 1.8V column | 9 | ||
| Clock pulse width high | tHIGH | 0.4 | µs | VCC 2.5-5.0V column | 9 | ||
| Clock low to data out valid | tAA | 0.9 | µs | VCC 1.8V column | 9 | ||
| Clock low to data out valid | tAA | 0.55 | µs | VCC 2.5-5.0V column | 9 | ||
| Time the bus must be free before a new transmission can start | tBUF | 1.3 | µs | VCC 1.8V column | 9 | ||
| Time the bus must be free before a new transmission can start | tBUF | 0.5 | µs | VCC 2.5-5.0V column | 9 | ||
| START hold time | tHD.STA | 0.6 | µs | VCC 1.8V column | 9 | ||
| START hold time | tHD.STA | 0.25 | µs | VCC 2.5-5.0V column | 9 | ||
| START set-up time | tSU.STA | 0.6 | µs | VCC 1.8V column | 9 | ||
| START set-up time | tSU.STA | 0.25 | µs | VCC 2.5-5.0V column | 9 | ||
| Data in hold time | tHD.DAT | 0 | µs | VCC 1.8V column | 9 | ||
| Data in set-up time | tSU.DAT | 100 | ns | VCC 1.8V column | 9 | ||
| Input rise time | tR | 0.3 | µs | VCC 1.8V column | 9 | ||
| Input fall time | tF | 300 | ns | VCC 1.8V column | 9 | ||
| Input fall time | tF | 100 | ns | VCC 2.5-5.0V column | 9 | ||
| STOP set-up time | tSU.STO | 0.6 | µs | VCC 1.8V column | 9 | ||
| STOP set-up time | tSU.STO | 0.25 | µs | VCC 2.5-5.0V column | 9 | ||
| Data out hold time | tDH | 50 | ns | VCC 1.8V column | 9 | ||
| VCC slew rate at power up | tPWR,R | 0.1 | 50 | V/ms | VCC 1.8V column | 9 | |
| Time required after VCC is stable before the device can accept commands | tPUP | 100 | µs | VCC 1.8V column | 9 | ||
| Minimum time at VCC=0V between power cycles | tPOFF | 500 | ms | VCC 1.8V column | 9 | ||
| Write cycle time | tWR | 5 | ms | VCC 1.8V column | 9 | ||
| Endurance | 1e+06 | write cycles | 25℃, Page Mode, 3.3V | 9 | |||
| 24C256 supply | VCC1 | 1.8 | 5.5 | V | 10 | ||
| Supply read current | ICC1 | 0.4 | 1 | mA | VCC @ 5.0V SCL = 100 kHz | 10 | |
| Supply write current | ICC2 | 2 | 3 | mA | VCC @ 5.0V SCL = 100 kHz | 10 | |
| Supply current | ISB1 | 1 | µA | VCC @ 1.8V, VIN = VCC or VSS | 10 | ||
| Input leakage current | IIL | 3 | µA | VIN = VCC or VSS | 10 | ||
| Output leakage current | ILO | 3 | µA | VIN = VCC or VSS | 10 | ||
| Input low level | VIL | -0.6 | V | 10 | |||
| Output low level | VOL2 | 0.4 | V | VCC @ 3.0V, IOL = 2.1 mA | 10 | ||
| Industrial operating temperature | -40 | 85 | ℃ | 2 | |||
| Storage temperature | -50 | 125 | ℃ | 2 | |||
| Maximum voltage | 8 | V | 2 | ||||
| Input voltage on any pin relative to ground | -0.3 | V | relative to ground | 2 | |||
| ESD protection on all pins | 2000 | V | all pins | 2 |
CAD (KiCad official)
- Symbol:
AT24C256N - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
at24c256n-etched.step/at24c256n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at24c256n.step/at24c256n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (11 pp, sha256
d7220784e4d64aba, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AT24C256N
**HGSEMI** · EEPROM · DIP-8
AT24C256N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input that is hardwired to VIH or VIL, and is read as VIL if left unconnected. |
| 2 | A1 | input | Device address input that is hardwired to VIH or VIL, and is read as VIL if left unconnected. |
| 3 | A2 | input | Device address input that is hardwired to VIH or VIL, and is read as VIL if left unconnected. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | Serial data line that is bi-directional with an open-drain output, so it can be wire-ORed and is typically pulled high by an external resistor. |
| 6 | SCL | input | Serial clock input where the rising edge latches data into the EEPROM and the falling edge clocks data out. |
| 7 | WP | input | Write protect input that blocks all programming when connected to VIH or VCC, allows programming when left unconnected or at VIL, and does not affect reads. |
| 8 | VCC | power_in | Supply voltage of 1.8V to 5.5V, with a decoupling capacitor of at least 10nF recommended. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Memory |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Clock frequency, SCL | fSCL | | | 400 | kHz | VCC 1.8V column | 9 |
| Clock frequency, SCL | fSCL | | | 1000 | kHz | VCC 2.5-5.0V column | 9 |
| Noise suppression time | tI | | | 100 | ns | VCC 1.8V column | 9 |
| Noise suppression time | tI | | | 50 | ns | VCC 2.5-5.0V column | 9 |
| Clock pulse width low | tLOW | 1.3 | | | µs | VCC 1.8V column | 9 |
| Clock pulse width low | tLOW | 0.4 | | | µs | VCC 2.5-5.0V column | 9 |
| Clock pulse width high | tHIGH | 0.6 | | | µs | VCC 1.8V column | 9 |
| Clock pulse width high | tHIGH | 0.4 | | | µs | VCC 2.5-5.0V column | 9 |
| Clock low to data out valid | tAA | | | 0.9 | µs | VCC 1.8V column | 9 |
| Clock low to data out valid | tAA | | | 0.55 | µs | VCC 2.5-5.0V column | 9 |
| Time the bus must be free before a new transmission can start | tBUF | 1.3 | | | µs | VCC 1.8V column | 9 |
| Time the bus must be free before a new transmission can start | tBUF | 0.5 | | | µs | VCC 2.5-5.0V column | 9 |
| START hold time | tHD.STA | 0.6 | | | µs | VCC 1.8V column | 9 |
| START hold time | tHD.STA | 0.25 | | | µs | VCC 2.5-5.0V column | 9 |
| START set-up time | tSU.STA | 0.6 | | | µs | VCC 1.8V column | 9 |
| START set-up time | tSU.STA | 0.25 | | | µs | VCC 2.5-5.0V column | 9 |
| Data in hold time | tHD.DAT | 0 | | | µs | VCC 1.8V column | 9 |
| Data in set-up time | tSU.DAT | 100 | | | ns | VCC 1.8V column | 9 |
| Input rise time | tR | | | 0.3 | µs | VCC 1.8V column | 9 |
| Input fall time | tF | | | 300 | ns | VCC 1.8V column | 9 |
| Input fall time | tF | | | 100 | ns | VCC 2.5-5.0V column | 9 |
| STOP set-up time | tSU.STO | 0.6 | | | µs | VCC 1.8V column | 9 |
| STOP set-up time | tSU.STO | 0.25 | | | µs | VCC 2.5-5.0V column | 9 |
| Data out hold time | tDH | 50 | | | ns | VCC 1.8V column | 9 |
| VCC slew rate at power up | tPWR,R | 0.1 | | 50 | V/ms | VCC 1.8V column | 9 |
| Time required after VCC is stable before the device can accept commands | tPUP | 100 | | | µs | VCC 1.8V column | 9 |
| Minimum time at VCC=0V between power cycles | tPOFF | 500 | | | ms | VCC 1.8V column | 9 |
| Write cycle time | tWR | | | 5 | ms | VCC 1.8V column | 9 |
| Endurance | | 1e+06 | | | write cycles | 25℃, Page Mode, 3.3V | 9 |
| 24C256 supply | VCC1 | 1.8 | | 5.5 | V | | 10 |
| Supply read current | ICC1 | | 0.4 | 1 | mA | VCC @ 5.0V SCL = 100 kHz | 10 |
| Supply write current | ICC2 | | 2 | 3 | mA | VCC @ 5.0V SCL = 100 kHz | 10 |
| Supply current | ISB1 | | | 1 | µA | VCC @ 1.8V, VIN = VCC or VSS | 10 |
| Input leakage current | IIL | | | 3 | µA | VIN = VCC or VSS | 10 |
| Output leakage current | ILO | | | 3 | µA | VIN = VCC or VSS | 10 |
| Input low level | VIL | -0.6 | | | V | | 10 |
| Output low level | VOL2 | | | 0.4 | V | VCC @ 3.0V, IOL = 2.1 mA | 10 |
| Industrial operating temperature | | -40 | | 85 | ℃ | | 2 |
| Storage temperature | | -50 | | 125 | ℃ | | 2 |
| Maximum voltage | | | | 8 | V | | 2 |
| Input voltage on any pin relative to ground | | -0.3 | | | V | relative to ground | 2 |
| ESD protection on all pins | | 2000 | | | V | all pins | 2 |
## CAD (KiCad official)
- Symbol: `AT24C256N`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `at24c256n-etched.step` / `at24c256n-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `at24c256n.step` / `at24c256n.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912606908461056) (11 pp, sha256 `d7220784e4d64aba`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/at24c256n-datasheet.pdf)