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AT24C256CN

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HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT24C256CN

HGSEMI · EEPROM · DIP-8

AT24C256CN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Device address input that sets the least-significant bit of the I2C seven-bit slave address and can be tied to VCC or GND, allowing up to eight devices on the same bus.
2 E1 input Device address input that sets the middle bit of the I2C seven-bit slave address and can be tied to VCC or GND, allowing up to eight devices on the same bus.
3 E2 input Device address input that sets the upper bit of the I2C seven-bit slave address and can be tied to VCC or GND, allowing up to eight devices on the same bus.
4 GND power_in Ground reference for the power supply, to be connected to system ground.
5 SDA bidirectional Serial data open-drain bidirectional pin used to transfer data to and from the device.
6 SCL input Serial clock input that controls data flow, latching input data on the rising edge and clocking output data on the falling edge.
7 WP input Write protect input: connected to VCC the whole memory array becomes read-only, connected to GND or left floating writes are enabled.
8 VCC power_in Device power supply pin, operating range 1.7V to 5.5V, with operation at invalid VCC voltages not to be attempted.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 1.7 5.5 V 18
Supply Current (Read) ICC1 0.15 mA VCC = 1.7V, Read at 1MHz 18
Supply Current (Read) ICC1 0.4 mA VCC = 5.5V, Read at 400 kHz 18
Supply Current (Read) ICC1 0.5 mA VCC = 5.5V, Read at 1MHz 18
Supply Current (Write) ICC2 0.5 mA VCC = 1.7V, Write at 400 kHz 18
Supply Current (Write) ICC2 1 mA VCC = 5.5V, Write at 400 kHz 18
Standby Current ISB 0.5 μA VCC = 1.7V, VIN = VCC or GND 18
Standby Current ISB 1 μA VCC = 5.5V, VIN = VCC or GND 18
Input Leakage Current ILI 1 μA VIN = VCC or GND 18
Output Leakage Current ILO 1 μA VOUT = VCC or GND 18
Input Low-Level Voltage (SDA, SCL) VIL -0.5 0.3 V max is 0.3*VCC 18
Input High-Level Voltage (SDA, SCL) VIH 0.7 0.5 V min is 0.7*VCC; max is VCC +0.5 18
Low-Level Output Voltage VOL1 0.4 V VCC > 2V, IOL = 3mA 18
Low-Level Output Voltage VOL2 0.2 V VCC ≤ 2V, IOL = 2mA 18
Ambient temperature with power applied TA -40 105 °C 18
Storage temperature TSTG -65 150 °C 18
Supply voltage VCC -0.5 6 V 18
Voltage on input Pins VIN -0.5 6 V 18
Lead Temperature (Soldering, 10 seconds) TL 245 °C 18
Operating Temperature Range TA -40 105 °C 1
Clock Frequency, SCL (Fast) fSCL 400 kHz Fast, VCC = 1.7V to 5.5V 19
Clock Frequency, SCL (High Speed) fSCL 1000 kHz High Speed, VCC = 1.7V to 5.5V 19
Clock Pulse Width Low (Fast) tLOW 1300 ns Fast 19
Clock Pulse Width Low (High Speed) tLOW 600 ns High Speed 19
Clock Pulse Width High (Fast) tHIGH 600 ns Fast 19
Clock Pulse Width High (High Speed) tHIGH 260 ns High Speed 19
SDA Rise Time (Fast) tR 300 ns Fast; ensured by characterization only 19
SDA Rise Time (High Speed) tR 300 ns High Speed; ensured by characterization only 19
SDA(Out) Fall Time (Fast) tF 300 ns Fast; ensured by characterization only 19
SDA(Out) Fall Time (High Speed) tF 100 ns High Speed; ensured by characterization only 19
Start Hold Time (Fast) tHD.STA 600 ns Fast 19
Start Hold Time (High Speed) tHD.STA 250 ns High Speed 19
Start Setup Time (Fast) tSU.STA 600 ns Fast 19
Start Setup Time (High Speed) tSU.STA 250 ns High Speed 19
Stop Setup Time (Fast) tSU.STO 600 ns Fast 19
Stop Setup Time (High Speed) tSU.STO 250 ns High Speed 19
Bus Free Time between Stop and Next Start (Fast) tBUF 1300 ns Fast 19
Bus Free Time between Stop and Next Start (High Speed) tBUF 500 ns High Speed 19
Data In Hold Time (Fast) tHD.DI 0 ns Fast 19
Data In Hold Time (High Speed) tHD.DI 0 ns High Speed 19
Data In Setup Time (Fast) tSU.DAT 100 ns Fast 19
Data In Setup Time (High Speed) tSU.DAT 50 ns High Speed 19
Data Out Hold Time (Fast) tHD.DAT 50 ns Fast 19
Data Out Hold Time (High Speed) tHD.DAT 50 ns High Speed 19
SCL Low to Data Out Valid (Fast) tAA 100 900 ns Fast 19
SCL Low to Data Out Valid (High Speed) tAA 50 500 ns High Speed 19
WP Pin Setup Time (Fast) tSU.WP 1200 ns Fast 19
WP Pin Setup Time (High Speed) tSU.WP 600 ns High Speed 19
WP Pin Hold Time (Fast) tHD.WP 1200 ns Fast 19
WP Pin Hold Time (High Speed) tHD.WP 600 ns High Speed 19
Write Cycle Time (Fast) tWR 5 ms Fast 19
Write Cycle Time (High Speed) tWR 5 ms High Speed 19
Noise Suppression Time (Fast) tI 50 ns Fast 19
Noise Suppression Time (High Speed) tI 50 ns High Speed 19
Power-On Reset Time tPOR 10 ms 6
Power-On Reset Voltage VPOR 1.6 V 6
Brown-out Reset Voltage VBOR 0.8 V 6
Time from Power-On to First Command tINIT 10 ms 6
Warm Power Cycle Off Time tPOFF 1 ms 6
Input/output Capacitance (SDA) CI/O 8 pF VI/O = 0V; TA = +25°C, fC = 1MHz 21
Input Capacitance (SA0, SA1, SA2, SCL) CIN 6 pF VIN = 0V; TA = +25°C, fC = 1MHz 21
Data Retention DR 100 year TA = +25°C 21

CAD (KiCad official)

  • Symbol: AT24C256CN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c256cn-etched.step / at24c256cn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c256cn.step / at24c256cn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (25 pp, sha256 cd5e09d73709b3f3, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF