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AT24C16C-XHM-T-TUDI

Public Made by Adom

by adom

Tudi EEPROM, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT24C16C-XHM-T-TUDI

Tudi · EEPROM · TSSOP-8

AT24C16C-XHM-T-TUDI from Tudi, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect pin with no internal function stated in the datasheet.
2 NC unconnected No connect pin with no internal function stated in the datasheet.
3 NC unconnected No connect pin with no internal function stated in the datasheet; the AT24C16C does not use device address pins.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Serial data pin for bidirectional transfer, open-drain driven and may be wire-ORed with other open-drain or open-collector devices.
6 SCL input Serial clock input that positive-edge clocks data into the EEPROM and negative-edge clocks data out.
7 WP input Write protect input: normal read/write when connected to GND, full array protected when connected to VCC.
8 VCC power_in Power supply, 1.7V to 5.5V operating range.

Key specifications

Parameter Value
Manufacturer Tudi
Package TSSOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC1 1.7 5.5 V TAI = -40°C to +85°C 5
Supply Current Read ICC 0.4 1 mA VCC=5.0V Read at 100kHz 5
Supply Current Write ICC 2 3 mA VCC=5.0V Write at 100kHz 5
Standby Current ISB1 1 μA VCC=1.7V VIN=VCC or VSS 5
Standby Current ISB2 6 μA VCC=5.5V VIN=VCC or VSS 5
Input Leakage Current ILI 0.1 3 μA VIN=VCC or VSS 5
Output Leakage Current ILO 0.05 3 μA VOUT=VCC or VSS 5
Input Low Level VIL -0.6 0.3 V max is Vcc×0.3; reference only, not tested 6
Input High Level VIH 0.7 0.5 V min is Vcc×0.7, max is Vcc+0.5; reference only, not tested 6
Output Low Level VOL2 0.4 V Vcc=3.0V IOL=2.1mA 6
Output Low Level VOL1 0.2 V Vcc=1.7V IOL=0.15mA 6
I/O Capacitance (SDA) CI/O 8 pF VI/O=0V, TA=25°C, f=1.0MHz, VCC=5.5V 5
Input Capacitance (SCL) CIN 6 pF VIN=0V, TA=25°C, f=1.0MHz, VCC=5.5V 5
Clock Frequency, SCL (1.7V) fSCL 400 kHz VCC=1.7V, CL=1TTL gate and 100pF 6
Clock Frequency, SCL (2.5/2.7/5.0V) fSCL 1000 kHz VCC=2.5V,2.7V,5.0V, CL=1TTL gate and 100pF 6
Clock Pulse Width Low (1.7V) tLOW 1.2 μs VCC=1.7V 6
Clock Pulse Width Low (2.5/2.7/5.0V) tLOW 0.4 μs VCC=2.5V,2.7V,5.0V 6
Clock Pulse Width High (1.7V) tHIGH 0.6 μs VCC=1.7V 6
Clock Pulse Width High (2.5/2.7/5.0V) tHIGH 0.4 μs VCC=2.5V,2.7V,5.0V 6
Noise Suppression Time (1.7V) tI 100 ns VCC=1.7V 6
Noise Suppression Time (2.5/2.7/5.0V) tI 50 ns VCC=2.5V,2.7V,5.0V 6
Clock Low to Data Out Valid (1.7V) tAA 0.1 0.9 μs VCC=1.7V 6
Clock Low to Data Out Valid (2.5/2.7/5.0V) tAA 0.05 0.55 μs VCC=2.5V,2.7V,5.0V 6
Bus Free Time (1.7V) tBUF 1.2 μs VCC=1.7V 6
Bus Free Time (2.5/2.7/5.0V) tBUF 0.5 μs VCC=2.5V,2.7V,5.0V 6
Start Condition Hold Time (1.7V) tHD.STA 0.6 μs VCC=1.7V 6
Start Condition Hold Time (2.5/2.7/5.0V) tHD.STA 0.25 μs VCC=2.5V,2.7V,5.0V 6
Start Condition Setup Time (1.7V) tSU.STA 0.6 μs VCC=1.7V 6
Start Condition Setup Time (2.5/2.7/5.0V) tSU.STA 0.25 μs VCC=2.5V,2.7V,5.0V 6
Data In Hold Time tHD.DAT 0 μs 1.7V and 2.5V,2.7V,5.0V 6
Data In Setup Time tSU.DAT 100 ns 1.7V and 2.5V,2.7V,5.0V 6
Inputs Rise Time tR 0.3 μS 1.7V and 2.5V,2.7V,5.0V; ensured by characterization 6
Inputs Fall Time (1.7V) tF 300 ns VCC=1.7V 6
Inputs Fall Time (2.5/2.7/5.0V) tF 100 ns VCC=2.5V,2.7V,5.0V 6
Stop Condition Setup Time (1.7V) tSU.STO 0.6 μs VCC=1.7V 6
Stop Condition Setup Time (2.5/2.7/5.0V) tSU.STO 0.25 μS VCC=2.5V,2.7V,5.0V 6
Write Cycle Time tWR 5 ms 1.7V and 2.5V,2.7V,5.0V 7
Endurance 1e+06 Write Cycles 3.3V,25℃ Page Mode 7
Operating Temperature -55 125 °C 3
Storage Temperature -65 150 °C 3
Voltage on any pin with respect to ground -1 7 V 3
Maximum Operating Voltage 6.25 V 3
DC Output Current 5 mA 3

CAD (KiCad official)

  • Symbol: AT24C16C-XHM-T-TUDI
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c16c-xhm-t-tudi-etched.step / at24c16c-xhm-t-tudi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c16c-xhm-t-tudi.step / at24c16c-xhm-t-tudi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Tudi datasheet (20 pp, sha256 2424c65d64e02993, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF