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AT24C128BN

Public Made by Adom

by adom

HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT24C128BN

HGSEMI · EEPROM · DIP-8

AT24C128BN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input with internal pull-down that selects the device address and may be tied directly to VCC or GND in any combination, with a floating pin read as zero.
2 A1 input Device address input with internal pull-down that selects the device address and may be tied directly to VCC or GND in any combination, with a floating pin read as zero.
3 A2 input Device address input with internal pull-down that selects the device address and may be tied directly to VCC or GND in any combination, with a floating pin read as zero.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Open-drain serial address, data input and data output that must be pulled high through an external pull-up resistor and may be wire-ORed with other open-drain devices on the bus.
6 SCL input Serial clock input that clocks data in on its rising edge and clocks data out on its falling edge.
7 WP input Write protect input with internal pull-down where connecting it to VCC write-protects the entire array, and a floating pin is read as zero.
8 VCC power_in Power supply input, rated 1.7 V to 5.5 V per the DC characteristics.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (absolute maximum) VCC -0.5 6.5 V 9
Voltage on Input Pins VIN -0.5 6.5 V 9
Maximum Junction Temperature TJ(max) 150 °C 9
Operation Temperature Top -40 85 °C 9
Storage Temperature Tstg -65 150 °C 9
Lead Temperature TLEAD 245 °C 9
Input Capacitance CIN 6 pF 10
Input / Output Capacitance CI/O 8 pF 10
Input rise and fall times 50 ns AC measurement 10
Input Leakage current (SCL, SDA) ILI 2 µA VIN=VCC or GND 10
Output leakage current ILO 2 µA VOUT=VCC or GND, SDA in Hi-Z 10
Write Supply current ICC1 1 mA VCC=5.5V, fC=400KHz 10
Read Supply current ICC2 0.2 mA VCC=5.5V, fC=400KHz 10
Standby supply current ISB1 1 µA VIN=VCC, VCC=3.0V 10
Supply Voltage Vcc 1.7 5.5 V Tamb = -40 C to +85 C 10
Input High Voltage VIH 0.7 V SCL, SDA; min printed as 0.7*VCC, max printed as VCC+1 10
Input Low Voltage VIL -0.5 0.3 V SCL, SDA; max printed as 0.3*VCC 10
Output Low Voltage VOL1 0.2 V Vcc=1.7V, SDA, IOL=0.2mA 10
Output Low Voltage VOL2 0.4 V Vcc=3.0V, SDA IOL=2mA 10
SCL clock frequency FSCL 400 kHz VCC≥1.7V, 400KHz 11
SCL clock frequency FSCL 1000 kHz VCC≥1.7V, 1000KHz 11
Low period of SCL clock TLOW 1300 ns VCC≥1.7V, 400KHz 11
Low period of SCL clock TLOW 400 ns VCC≥1.7V, 1000KHz 11
High period of SCL clock THIGH 600 ns VCC≥1.7V, 400KHz 11
High period of SCL clock THIGH 400 ns VCC≥1.7V, 1000KHz 11
Bus free time between a Stop and a Start conditions TBUF 1300 ns VCC≥1.7V, 400KHz 11
Bus free time between a Stop and a Start conditions TBUF 500 ns VCC≥1.7V, 1000KHz 11
Start condition Setup time TSU;STA 600 ns VCC≥1.7V, 400KHz 11
Start condition Setup time TSU;STA 260 ns VCC≥1.7V, 1000KHz 11
Start condition Hold time THD;STA 600 ns VCC≥1.7V, 400KHz 11
Start condition Hold time THD;STA 260 ns VCC≥1.7V, 1000KHz 11
Stop condition Setup time TSU;STO 600 ns VCC≥1.7V, 400KHz 11
Stop condition Setup time TSU;STO 260 ns VCC≥1.7V, 1000KHz 11
Data In Setup time TSU;DAT 100 ns VCC≥1.7V, 400KHz 11
Data In Setup time TSU;DAT 50 ns VCC≥1.7V, 1000KHz 11
Data In Hold time THD;DI 0 ns VCC≥1.7V, 400KHz 11
Data Out Hold Time THD:DAT 100 ns VCC≥1.7V, 400KHz 11
Data Out Hold Time THD:DAT 0 ns VCC≥1.7V, 1000KHz 11
Write Cycle TW 5 ms VCC≥1.7V, 400KHz and 1000KHz columns 11
Rise time of SDA TR 300 ns VCC≥1.7V, 400KHz 11
Rise time of SDA TR 120 ns VCC≥1.7V, 1000KHz 11
Fall time of SDA TF 300 ns VCC≥1.7V, 400KHz 11
Fall time of SDA TF 120 ns VCC≥1.7V, 1000KHz 11
Noise Suppression Time TN 100 ns VCC≥1.7V, 400KHz 11
Noise Suppression Time TN 50 ns VCC≥1.7V, 1000KHz 11
Operating temperature range Tamb -40 85 °C Features list operating temperature range 1

CAD (KiCad official)

  • Symbol: AT24C128BN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c128bn-etched.step / at24c128bn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c128bn.step / at24c128bn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (16 pp, sha256 946e15361107ce53, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF