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Contents

README

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AT24C04CM

HGSEMI · EEPROM · SOP-8

AT24C04CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection. May be left floating or tied to any potential.
2 E1 input Device address input bit 1. Combined with E2 forms the 2-bit hard-wired chip address inside the I2C device address byte, allowing multiple devices on the same bus. Tie to VCC or GND; if left floating, an internal pull-down forces it to GND.
3 E2 input Device address input bit 2. Combined with E1 forms the 2-bit hard-wired chip address inside the I2C device address byte. Tie to VCC or GND; if left floating, an internal pull-down forces it to GND.
4 GND power_in Ground reference for the power supply and I2C interface. Connect to system ground.
5 SDA bidirectional I2C serial data. Open-drain bidirectional line for command, address, and data transfer; requires an external pull-up resistor to VCC. Data is latched on the rising edge of SCL and shifted out on the falling edge. Input capacitance up to 8 pF.
6 SCL input I2C serial clock input driven by the bus master. Controls data flow on SDA; supports 400 kHz Fast-Mode and 1 MHz High-Speed operation. Schmitt-triggered with input filtering for noise suppression.
7 WP input Hardware write protect. When tied to VCC the entire memory array (and Identification Page) is Read-only; when tied to GND write operations are enabled. If left floating an internal pull-down defaults the pin to GND (writes enabled).
8 VCC power_in Device power supply, 1.7 V to 5.5 V. Standby current 1 uA max, read 0.5 mA max, write 1 mA max. Bypass locally to GND.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Ordering variants

  • AT24C04CMCM/TR
  • AT24C04CMCN
  • AT24C04CMCMM/TR
  • AT24C04CMCMT/TR
  • AT24C04CMCDQ3/TR
  • AT24C04CMCDQ2/TR
  • AT24C04CMCM5/TR

CAD (KiCad official)

  • Symbol: AT24C04CM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c04cm-etched.step / at24c04cm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c04cm.step / at24c04cm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (26 pp, sha256 38c548dbc7c3897e, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF