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Contents

README

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AT17LV010A-10PU

Microchip Tech · Non-Volatile Memory (ROM) · PDIP-8

AT17LV010A-10PU from Microchip Tech, in a PDIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DATA bidirectional Three-state DATA output for configuration, and open-collector bi-directional pin for programming.
2 DCLK bidirectional Clock output or clock input; rising edges increment the internal address counter and present the next data bit when RESET/OE is High and nCS is Low, otherwise the master drives it Low.
3 RESET/OE input Reset (active Low) / Output Enable (active High) input: Low resets the address counter, High with nCS Low enables DATA and counting; polarity is programmable and must be programmed active High (RESET active Low) for Altera applications.
4 nCS input Active-Low chip select: Low (with OE High) lets DCLK increment the address counter and enables DATA; reset with nCS Low makes the device the master in a daisy-chain, reset with nCS High makes it a subsequent device.
5 GND power_in Ground; a 0.2μF decoupling capacitor between VCC and GND is recommended.
6 nCASC output Active-Low cascade select output that goes Low when the address counter reaches its maximum value, usually connected to the nCS input of the next device in a daisy-chain.
7 SER_EN input Serial enable must be held High during FPGA loading (tie to VCC for non-ISP applications); bringing it Low enables the 2-wire serial programming mode.
8 VCC power_in Power supply pin for 3.3V (±10%) and 5.0V (±10%) operation.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package PDIP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Temperature -40 85 °C 7
Storage Temperature -65 150 °C 7
Voltage on Any Pin with Respect to Ground -0.1 0.5 V max is VCC + 0.5V 7
Supply Voltage VCC -0.5 7 V 7
ESD 2000 V RZAP = 1.5K, CZAP = 100 pF 7
Industrial Supply Voltage (3.3V) VCC 3 3.6 V -40C to +85C 7
Industrial Supply Voltage (5.0V) VCC 4.5 5.5 V -40C to +85C 7
Thermal Resistance Junction to Case, 8P3 PDIP θJC 37 °C/W 11
Thermal Resistance Junction to Ambient, 8P3 PDIP θJA 107 °C/W Airflow = 0ft/min 11
High-level Input Voltage (3.3V) VIH 2 V VCC = 3.3V ± 10%; max is VCC 7
Low-level Input Voltage (3.3V) VIL 0 0.8 V VCC = 3.3V ± 10% 7
High-level Output Voltage (3.3V) VOH 2.4 V IOH = -2mA; VCC = 3.3V ± 10% 7
Low-level Output Voltage (3.3V) VOL 0.4 V IOL = +3mA; VCC = 3.3V ± 10% 7
Supply Current, Active Mode (3.3V) ICCA 5 mA VCC = 3.3V ± 10% 7
Input or Output Leakage Current (3.3V) IL -10 10 μA VIN = VCC or GND; VCC = 3.3V ± 10% 7
Supply Current, Standby Mode (3.3V) ICCS 100 μA VCC = 3.3V ± 10% 7
High-level Input Voltage (5.0V) VIH 2 V VCC = 5.0V ± 10%; max is VCC 8
Low-level Input Voltage (5.0V) VIL 0 0.8 V VCC = 5.0V ± 10% 8
High-level Output Voltage (5.0V) VOH 3.76 V IOH = -2mA; VCC = 5.0V ± 10% 8
Low-level Output Voltage (5.0V) VOL 0.37 V IOL = +3mA; VCC = 5.0V ± 10% 8
Supply Current, Active Mode (5.0V) ICCA 10 mA VCC = 5.0V ± 10% 8
Input or Output Leakage Current (5.0V) IL -10 10 μA VIN = VCC or GND; VCC = 5.0V ± 10% 8
Supply Current, Standby Mode (5.0V) ICCS1 200 μA VCC = 5.0V ± 10% 8
OE to Data Delay (3.3V) TOE 55 ns VCC = 3.3V ± 10%; AC test load = 50pF 8
CE to Data Delay (3.3V) TCE 60 ns VCC = 3.3V ± 10%; AC test load = 50pF 8
CLK to Data Delay (3.3V) TCAC 60 ns VCC = 3.3V ± 10%; AC test load = 50pF 8
Data Hold from CE, OE, or CLK (3.3V) TOH 0 ns VCC = 3.3V ± 10% 8
CE or OE to Data Float Delay (3.3V) TDF 50 ns VCC = 3.3V ± 10%; float delays measured with 5pF AC loads 8
CLK Low Time (3.3V) TLC 25 ns VCC = 3.3V ± 10% 8
CLK High Time (3.3V) THC 25 ns VCC = 3.3V ± 10% 8
CE Setup Time to CLK (3.3V) TSCE 35 ns to guarantee proper counting; VCC = 3.3V ± 10% 8
CE Hold Time from CLK (3.3V) THCE 0 ns to guarantee proper counting; VCC = 3.3V ± 10% 8
OE High Time (3.3V) THOE 25 ns guarantees counter is reset; VCC = 3.3V ± 10% 8
Maximum Input Clock Frequency (3.3V) FMAX 10 MHz VCC = 3.3V ± 10% 8
CLK to Data Float Delay, Cascading (3.3V) TCDF 50 ns VCC = 3.3V ± 10%; float delays measured with 5pF AC loads 9
CLK to CEO Delay, Cascading (3.3V) TOCK 55 ns VCC = 3.3V ± 10%; AC test load = 50pF 9
CE to CEO Delay, Cascading (3.3V) TOCE 40 ns VCC = 3.3V ± 10%; AC test load = 50pF 9
RESET/OE to CEO Delay, Cascading (3.3V) TOOE 35 ns VCC = 3.3V ± 10%; AC test load = 50pF 9
Maximum Input Clock Frequency, Cascading (3.3V) FMAX 10 MHz VCC = 3.3V ± 10% 9
OE to Data Delay (5.0V) TOE 35 ns VCC = 5.0V ± 10%; AC test load = 50pF 9
CE to Data Delay (5.0V) TCE 45 ns VCC = 5.0V ± 10%; AC test load = 50pF 9
CLK to Data Delay (5.0V) TCAC 50 ns VCC = 5.0V ± 10%; AC test load = 50pF 9
Data Hold from CE, OE, or CLK (5.0V) TOH 0 ns VCC = 5.0V ± 10% 9
CE or OE to Data Float Delay (5.0V) TDF 50 ns VCC = 5.0V ± 10%; float delays measured with 5pF AC loads 9
CLK Low Time (5.0V) TLC 20 ns VCC = 5.0V ± 10% 9
CLK High Time (5.0V) THC 20 ns VCC = 5.0V ± 10% 9
CE Setup Time to CLK (5.0V) TSCE 25 ns to guarantee proper counting; VCC = 5.0V ± 10% 9
CE Hold Time from CLK (5.0V) THCE 0 ns to guarantee proper counting; VCC = 5.0V ± 10% 9
OE High Time (5.0V) THOE 20 ns guarantees counter is reset; VCC = 5.0V ± 10% 9
Maximum Input Clock Frequency (5.0V) FMAX 15 MHz VCC = 5.0V ± 10% 9
CLK to Data Float Delay, Cascading (5.0V) TCDF 50 ns VCC = 5.0V ± 10%; float delays measured with 5pF AC loads 10
CLK to CEO Delay, Cascading (5.0V) TOCK 40 ns VCC = 5.0V ± 10%; AC test load = 50pF 10
CE to CEO Delay, Cascading (5.0V) TOCE 35 ns VCC = 5.0V ± 10%; AC test load = 50pF 10
RESET/OE to CEO Delay, Cascading (5.0V) TOOE 30 ns VCC = 5.0V ± 10%; AC test load = 50pF 10
Maximum Input Clock Frequency, Cascading (5.0V) FMAX 12.5 MHz VCC = 5.0V ± 10% 10

CAD (KiCad official)

  • Symbol: AT17LV010A-10PU
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: PDIP-8 (KiCad packages3D, STEP)
  • 3D model files: at17lv010a-10pu-etched.step / at17lv010a-10pu-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at17lv010a-10pu.step / at17lv010a-10pu.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (16 pp, sha256 c23627784bc00bef, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF