# ASMD1812-050

**Shenzhen JDT Fuse** · Resettable Fuses · 1812

ASMD1812-050 from Shenzhen JDT Fuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum fault current (Imax) | I max |  |  | 100 | A | At rated voltage (Vmax) | 3 |
| Hold current (Ihold) | I hold |  |  | 0.5 | A | 25°C still air; device will not trip | 3 |
| Trip current (Itrip) | I trip | 1 |  |  | A | 25°C still air; device will always trip | 3 |
| Minimum device resistance before tripping (Ri min) | Ri min | 0.15 |  |  | Ω | 25°C, prior to tripping | 3 |
| Maximum device resistance (R1max) | R1max |  |  | 1 | Ω | Measured one hour post reflow | 3 |
| Maximum time to trip |  |  |  | 0.15 | Sec | At 8.0 A fault current | 3 |
| Power dissipation in tripped state (Pd) | P d |  | 0.8 |  | W | Tripped state, 25°C still air, at rated voltage | 3 |
| Resistance change, passive aging |  | -5 |  | 5 | % | +85°C, 1000 hrs; typical | 4 |
| Resistance change, humidity aging |  | -5 |  | 5 | % | +85°C, 85% R.H., 168 hours; typical | 4 |
| Resistance change, thermal shock |  | -33 |  | 33 | % | +85°C to -40°C, 20 times; typical | 4 |
| Ambient operating temperature |  | -40 |  | 85 | °C | Ambient operating conditions | 4 |
| Maximum surface temperature in tripped state |  |  |  | 125 | °C | Device in tripped state | 4 |
| Peak reflow temperature (Tp) | Tp |  |  | 260 | ℃ | Pb-free reflow profile | 6 |

## CAD (KiCad official)

- Symbol: `ASMD1812-050`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `asmd1812-050-etched.step` / `asmd1812-050-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asmd1812-050.step` / `asmd1812-050.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JDT Fuse datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588899520993878016) (10 pp, sha256 `9a262a458868b11e`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/asmd1812-050-datasheet.pdf)