# ASMD1210SL500-12V

**JDTfuse(集电通)** · Resettable Fuses · 1210

ASMD1210SL500-12V from JDTfuse(集电通), in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | JDTfuse(集电通) |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (rated voltage) | V max |  |  | 12 | V | at rated current (Imax) | 3 |
| Maximum fault current | I max |  |  | 50 | A | at rated voltage (V max) | 3 |
| Hold current | I hold |  |  | 5 | A | @25°C, still air | 3 |
| Trip current | I trip | 10 |  |  | A | @25°C, still air | 3 |
| Maximum time to trip |  |  |  | 2 | s | at 25.0 A | 3 |
| Minimum device resistance prior to tripping | Ri min | 0.001 |  |  | Ω | @25°C | 3 |
| Maximum device resistance one hour post reflow | R1max |  |  | 0.012 | Ω | measured one hour post reflow | 3 |
| Operating temperature |  | -40 |  | 85 | ℃ |  | 2 |
| Resistance change after passive aging |  | -10 |  | 10 | % | +85°C, 1000 hrs. | 4 |
| Resistance change after humidity aging |  | -5 |  | 5 | % | +85°C, 85% R.H., 100 hours | 4 |
| Ramp-up rate (Ts max to Tp) |  |  |  | 3 | ℃/second | Pb-free reflow profile | 6 |
| Ramp-down rate |  |  |  | 3 | ℃/second | Pb-free reflow profile | 6 |
| Time 25℃ to peak temperature |  |  |  | 8 | minutes | Pb-free reflow profile | 6 |
| Peak/classification temperature (Tp) | Tp |  |  | 260 | ℃ | Pb-free reflow profile | 6 |
| Time within 5℃ of actual peak temperature (TP) | TP |  |  | 30 | seconds | Pb-free reflow profile | 6 |
| Preheat temperature (Ts min to Ts max) | Ts | 150 |  | 200 | ℃ | Pb-free reflow profile | 6 |
| Preheat time (Ts min to Ts max) |  | 60 |  | 120 | seconds | Pb-free reflow profile | 6 |
| Time maintained above liquidus temperature (TL) | TL | 217 |  |  | ℃ | Pb-free reflow profile | 6 |
| Time maintained above TL | tL | 60 |  | 150 | seconds | Pb-free reflow profile | 6 |
| Power dissipation in tripped state | Pd |  | 1 |  | W | tripped state, 25°C still air, at rated voltage | 3 |
| Resistance change after thermal shock |  |  | -30 |  | % | MIL-STD-202 Method 107G, +85°C to -40°C, 20 times | 4 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | tin | Terminal Materials Tin-Plated Nickle-copper | 4 |

## CAD (KiCad official)

- Symbol: `ASMD1210SL500-12V`
- Footprint: `Fuse:Fuse_1210_3225Metric`
- 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files: `asmd1210sl500-12v-etched.step` / `asmd1210sl500-12v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asmd1210sl500-12v.step` / `asmd1210sl500-12v.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [JDTfuse(集电通) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8613804051511324672) (10 pp, sha256 `fecbba5619ec2df1`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/asmd1210sl500-12v-datasheet.pdf)