component
ASM330LHHTR
Public Made by Adomby adom
STMICROELECTRONICS Global Sourcing Parts, LGA-14(2.5x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ASM330LHHTR
STMICROELECTRONICS · Global Sourcing Parts · LGA-14(2.5x3)
ASM330LHHTR from STMICROELECTRONICS, in a LGA-14(2.5x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SDO/SA0 | bidirectional | SPI 4-wire serial data output (SDO) and I2C least significant bit of the device address (SA0). |
| 2 | RES | passive | Reserved; connect to VDDIO or GND. |
| 3 | RES | passive | Reserved; connect to VDDIO or GND. |
| 4 | INT1 | output | Programmable interrupt #1; must be set to '0' or left unconnected during power-on. |
| 5 | Vdd_IO | power_in | Power supply for I/O pins; recommended 100 nF filter capacitor. |
| 6 | GND | power_in | Connect to GND (printed as GNSD in the pin table). |
| 7 | GND | power_in | Connect to GND. |
| 8 | Vdd | power_in | Power supply; recommended 100 nF plus 10 µF capacitors. |
| 9 | INT2 | bidirectional | Programmable interrupt #2 (INT2) / Data enable (DEN). |
| 10 | NC | unconnected | Leave unconnected. |
| 11 | NC | unconnected | Leave unconnected. |
| 12 | CS | input | I2C/SPI mode selection (1: SPI idle mode / I2C communication enabled; 0: SPI communication mode / I2C disabled and reset). |
| 13 | SCL | input | I2C serial clock (SCL) / SPI serial port clock (SPC). |
| 14 | SDA | bidirectional | I2C serial data (SDA), SPI serial data input (SDI), and 3-wire interface serial data output (SDO). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMICROELECTRONICS |
| Package | LGA-14(2.5x3) |
| Category | Global Sourcing Parts |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Linear acceleration sensitivity tolerance | LA_So% | -5 | 5 | % | at component level, @25 °C | 14 | |
| Angular rate sensitivity tolerance | G_So% | -5 | 5 | % | at component level, @25 °C | 14 | |
| Linear acceleration sensitivity change vs. temperature | LA_SoDr | -100 | 100 | ppm/°C | 14 | ||
| Angular rate sensitivity change vs. temperature | G_SoDr | -70 | 70 | ppm/°C | 14 | ||
| Linear acceleration zero-g level offset accuracy | LA_TyOff | -80 | 80 | mg | 15 | ||
| Angular rate zero-rate level | G_TyOff | -10 | 10 | dps | 15 | ||
| Linear acceleration zero-g level change vs. temperature | LA_TCOff | -0.1 | 0.1 | mg/°C | 15 | ||
| Angular rate typical zero-rate level change vs. temperature | G_TCOff | -0.005 | 0.005 | dps/°C | 15 | ||
| Linear acceleration cross-axis sensitivity | LA_Cx | -1 | 1 | % | T = 25 °C | 15 | |
| Angular rate cross-axis sensitivity | G_Cx | -1 | 1 | % | T = 25 °C | 15 | |
| Rate noise density | Rn | 5 | 12 | mdps/√Hz | 15 | ||
| Acceleration noise density | An | 60 | 200 | μg/√Hz | @LA_FS = ±2 g | 15 | |
| Linear acceleration self-test output change | Vst | 90 | 1700 | mg | 15 | ||
| Angular rate self-test output change | Vst | 20 | 80 | dps | FS = 250 dps | 15 | |
| Angular rate self-test output change | Vst | 150 | 700 | dps | FS = 2000 dps | 15 | |
| Supply voltage | Vdd | 2 | 3.6 | V | 17 | ||
| Power supply for I/O | Vdd_IO | 1.62 | 3.6 | V | 17 | ||
| Gyroscope and accelerometer current consumption | GA_Idd | 1.3 | 1.6 | mA | ODR = 1.6 kHz | 17 | |
| Accelerometer current consumption | A_Idd | 360 | 530 | μA | ODR < 1.6 kHz | 17 | |
| Gyroscope and accelerometer current consumption during power-down | IddPD | 3 | 13 | μA | @25°C | 17 | |
| Digital high-level input voltage | VIH | 0.7 | * VDD_IO | 17 | |||
| Digital low-level input voltage | VIL | 0.3 | * VDD_IO | 17 | |||
| Low-level output voltage | VOL | 0.2 | V | IOL = 4 mA | 17 | ||
| Operating temperature range | Top | -40 | 105 | °C | 17 | ||
| Temperature offset | Toff | -15 | 15 | °C | 18 | ||
| SPI clock cycle | tc(SPC) | 100 | ns | 19 | |||
| SPI clock frequency | fc(SPC) | 10 | MHz | 19 | |||
| CS setup time | tsu(CS) | 5 | ns | 19 | |||
| CS hold time | th(CS) | 20 | ns | 19 | |||
| SDI input setup time | tsu(SI) | 5 | ns | 19 | |||
| SDI input hold time | th(SI) | 15 | ns | 19 | |||
| SDO valid output time | tv(SO) | 50 | ns | 19 | |||
| SDO output hold time | th(SO) | 5 | ns | 19 | |||
| SDO output disable time | tdis(SO) | 50 | ns | 19 | |||
| SCL clock frequency | f(SCL) | 0 | 100 | kHz | I2C standard mode | 20 | |
| SCL clock frequency | f(SCL) | 0 | 400 | kHz | I2C fast mode | 20 | |
| SCL clock low time | tw(SCLL) | 4.7 | μs | I2C standard mode | 20 | ||
| SCL clock low time | tw(SCLL) | 1.3 | μs | I2C fast mode | 20 | ||
| SCL clock high time | tw(SCLH) | 4 | μs | I2C standard mode | 20 | ||
| SCL clock high time | tw(SCLH) | 0.6 | μs | I2C fast mode | 20 | ||
| SDA setup time | tsu(SDA) | 250 | ns | I2C standard mode | 20 | ||
| SDA setup time | tsu(SDA) | 100 | ns | I2C fast mode | 20 | ||
| SDA data hold time | th(SDA) | 0 | 3.45 | μs | I2C standard mode | 20 | |
| SDA data hold time | th(SDA) | 0 | 0.9 | μs | I2C fast mode | 20 | |
| START condition hold time | th(ST) | 4 | μs | I2C standard mode | 20 | ||
| START condition hold time | th(ST) | 0.6 | μs | I2C fast mode | 20 | ||
| Repeated START condition setup time | tsu(SR) | 4.7 | μs | I2C standard mode | 20 | ||
| Repeated START condition setup time | tsu(SR) | 0.6 | μs | I2C fast mode | 20 | ||
| STOP condition setup time | tsu(SP) | 4 | μs | I2C standard mode | 20 | ||
| STOP condition setup time | tsu(SP) | 0.6 | μs | I2C fast mode | 20 | ||
| Bus free time between STOP and START condition | tw(SP:SR) | 4.7 | μs | I2C standard mode | 20 | ||
| Bus free time between STOP and START condition | tw(SP:SR) | 1.3 | μs | I2C fast mode | 20 | ||
| Supply voltage | Vdd | -0.3 | 4.8 | V | 21 | ||
| Storage temperature range | TSTG | -40 | 125 | °C | 21 | ||
| Acceleration g | Sg | 10000 | g | for 0.2 ms | 21 | ||
| Electrostatic discharge protection (HBM) | ESD | 2 | kV | 21 |
CAD (KiCad official)
- Symbol:
ASM330LHHTR - Footprint:
Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm - 3D model: LGA-14(2.5x3) (KiCad packages3D, STEP)
- 3D model files:
asm330lhhtr-etched.step/asm330lhhtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);asm330lhhtr.step/asm330lhhtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMICROELECTRONICS datasheet (84 pp, sha256
5447ee161020bdf3, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ASM330LHHTR
**STMICROELECTRONICS** · Global Sourcing Parts · LGA-14(2.5x3)
ASM330LHHTR from STMICROELECTRONICS, in a LGA-14(2.5x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SDO/SA0 | bidirectional | SPI 4-wire serial data output (SDO) and I2C least significant bit of the device address (SA0). |
| 2 | RES | passive | Reserved; connect to VDDIO or GND. |
| 3 | RES | passive | Reserved; connect to VDDIO or GND. |
| 4 | INT1 | output | Programmable interrupt #1; must be set to '0' or left unconnected during power-on. |
| 5 | Vdd_IO | power_in | Power supply for I/O pins; recommended 100 nF filter capacitor. |
| 6 | GND | power_in | Connect to GND (printed as GNSD in the pin table). |
| 7 | GND | power_in | Connect to GND. |
| 8 | Vdd | power_in | Power supply; recommended 100 nF plus 10 µF capacitors. |
| 9 | INT2 | bidirectional | Programmable interrupt #2 (INT2) / Data enable (DEN). |
| 10 | NC | unconnected | Leave unconnected. |
| 11 | NC | unconnected | Leave unconnected. |
| 12 | CS | input | I2C/SPI mode selection (1: SPI idle mode / I2C communication enabled; 0: SPI communication mode / I2C disabled and reset). |
| 13 | SCL | input | I2C serial clock (SCL) / SPI serial port clock (SPC). |
| 14 | SDA | bidirectional | I2C serial data (SDA), SPI serial data input (SDI), and 3-wire interface serial data output (SDO). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMICROELECTRONICS |
| Package | LGA-14(2.5x3) |
| Category | Global Sourcing Parts |
| Pins | 14 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Linear acceleration sensitivity tolerance | LA_So% | -5 | | 5 | % | at component level, @25 °C | 14 |
| Angular rate sensitivity tolerance | G_So% | -5 | | 5 | % | at component level, @25 °C | 14 |
| Linear acceleration sensitivity change vs. temperature | LA_SoDr | -100 | | 100 | ppm/°C | | 14 |
| Angular rate sensitivity change vs. temperature | G_SoDr | -70 | | 70 | ppm/°C | | 14 |
| Linear acceleration zero-g level offset accuracy | LA_TyOff | -80 | | 80 | mg | | 15 |
| Angular rate zero-rate level | G_TyOff | -10 | | 10 | dps | | 15 |
| Linear acceleration zero-g level change vs. temperature | LA_TCOff | -0.1 | | 0.1 | mg/°C | | 15 |
| Angular rate typical zero-rate level change vs. temperature | G_TCOff | -0.005 | | 0.005 | dps/°C | | 15 |
| Linear acceleration cross-axis sensitivity | LA_Cx | -1 | | 1 | % | T = 25 °C | 15 |
| Angular rate cross-axis sensitivity | G_Cx | -1 | | 1 | % | T = 25 °C | 15 |
| Rate noise density | Rn | | 5 | 12 | mdps/√Hz | | 15 |
| Acceleration noise density | An | | 60 | 200 | μg/√Hz | @LA_FS = ±2 g | 15 |
| Linear acceleration self-test output change | Vst | 90 | | 1700 | mg | | 15 |
| Angular rate self-test output change | Vst | 20 | | 80 | dps | FS = 250 dps | 15 |
| Angular rate self-test output change | Vst | 150 | | 700 | dps | FS = 2000 dps | 15 |
| Supply voltage | Vdd | 2 | | 3.6 | V | | 17 |
| Power supply for I/O | Vdd_IO | 1.62 | | 3.6 | V | | 17 |
| Gyroscope and accelerometer current consumption | GA_Idd | | 1.3 | 1.6 | mA | ODR = 1.6 kHz | 17 |
| Accelerometer current consumption | A_Idd | | 360 | 530 | μA | ODR < 1.6 kHz | 17 |
| Gyroscope and accelerometer current consumption during power-down | IddPD | | 3 | 13 | μA | @25°C | 17 |
| Digital high-level input voltage | VIH | 0.7 | | | * VDD_IO | | 17 |
| Digital low-level input voltage | VIL | | | 0.3 | * VDD_IO | | 17 |
| Low-level output voltage | VOL | | | 0.2 | V | IOL = 4 mA | 17 |
| Operating temperature range | Top | -40 | | 105 | °C | | 17 |
| Temperature offset | Toff | -15 | | 15 | °C | | 18 |
| SPI clock cycle | tc(SPC) | 100 | | | ns | | 19 |
| SPI clock frequency | fc(SPC) | | | 10 | MHz | | 19 |
| CS setup time | tsu(CS) | 5 | | | ns | | 19 |
| CS hold time | th(CS) | 20 | | | ns | | 19 |
| SDI input setup time | tsu(SI) | 5 | | | ns | | 19 |
| SDI input hold time | th(SI) | 15 | | | ns | | 19 |
| SDO valid output time | tv(SO) | | | 50 | ns | | 19 |
| SDO output hold time | th(SO) | 5 | | | ns | | 19 |
| SDO output disable time | tdis(SO) | | | 50 | ns | | 19 |
| SCL clock frequency | f(SCL) | 0 | | 100 | kHz | I2C standard mode | 20 |
| SCL clock frequency | f(SCL) | 0 | | 400 | kHz | I2C fast mode | 20 |
| SCL clock low time | tw(SCLL) | 4.7 | | | μs | I2C standard mode | 20 |
| SCL clock low time | tw(SCLL) | 1.3 | | | μs | I2C fast mode | 20 |
| SCL clock high time | tw(SCLH) | 4 | | | μs | I2C standard mode | 20 |
| SCL clock high time | tw(SCLH) | 0.6 | | | μs | I2C fast mode | 20 |
| SDA setup time | tsu(SDA) | 250 | | | ns | I2C standard mode | 20 |
| SDA setup time | tsu(SDA) | 100 | | | ns | I2C fast mode | 20 |
| SDA data hold time | th(SDA) | 0 | | 3.45 | μs | I2C standard mode | 20 |
| SDA data hold time | th(SDA) | 0 | | 0.9 | μs | I2C fast mode | 20 |
| START condition hold time | th(ST) | 4 | | | μs | I2C standard mode | 20 |
| START condition hold time | th(ST) | 0.6 | | | μs | I2C fast mode | 20 |
| Repeated START condition setup time | tsu(SR) | 4.7 | | | μs | I2C standard mode | 20 |
| Repeated START condition setup time | tsu(SR) | 0.6 | | | μs | I2C fast mode | 20 |
| STOP condition setup time | tsu(SP) | 4 | | | μs | I2C standard mode | 20 |
| STOP condition setup time | tsu(SP) | 0.6 | | | μs | I2C fast mode | 20 |
| Bus free time between STOP and START condition | tw(SP:SR) | 4.7 | | | μs | I2C standard mode | 20 |
| Bus free time between STOP and START condition | tw(SP:SR) | 1.3 | | | μs | I2C fast mode | 20 |
| Supply voltage | Vdd | -0.3 | | 4.8 | V | | 21 |
| Storage temperature range | TSTG | -40 | | 125 | °C | | 21 |
| Acceleration g | Sg | | | 10000 | g | for 0.2 ms | 21 |
| Electrostatic discharge protection (HBM) | ESD | | | 2 | kV | | 21 |
## CAD (KiCad official)
- Symbol: `ASM330LHHTR`
- Footprint: `Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm`
- 3D model: LGA-14(2.5x3) (KiCad packages3D, STEP)
- 3D model files: `asm330lhhtr-etched.step` / `asm330lhhtr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asm330lhhtr.step` / `asm330lhhtr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMICROELECTRONICS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589040558115598336) (84 pp, sha256 `5447ee161020bdf3`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/asm330lhhtr-datasheet.pdf)