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ASM330LHBTR

STMicroelectronics · Position Sensor · LGA-14(2.5x3)

ASM330LHBTR from STMicroelectronics, in a LGA-14(2.5x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDO/SA0 bidirectional Serves as SPI 4-wire serial data output (SDO), or as the I²C/MIPI I3CSM least significant bit of the device address (SA0), which is set by connecting the pin to Vdd_IO (address 1101011b) or GND (address 1101010b).
2 RES passive Reserved pin that must be connected to Vdd_IO or GND.
3 RES passive Reserved pin that must be connected to Vdd_IO or GND.
4 INT1 bidirectional Programmable interrupt 1 in I²C and SPI modes; it must be set to 0 or left unconnected during power-on when the I²C/SPI interfaces are used, and must be set to 1 when the device is used as a MIPI I3CSM pure slave.
5 Vdd_IO power_in Power supply for the I/O pins, with a recommended 100 nF filter capacitor.
6 NC unconnected Not internally connected; may be connected to Vdd_IO or GND or left unconnected.
7 GND power_in 0 V supply.
8 Vdd power_in Main power supply for the device core, with a recommended 100 nF plus 10 µF capacitors; the operational supply range is 1.71 V to 3.6 V.
9 INT2 output Programmable interrupt 2 (INT2) / data enable (DEN); the output is forced to ground by default.
10 NC unconnected Leave unconnected; the pin is to be left electrically unconnected and soldered to the PCB.
11 NC unconnected Leave unconnected; the pin is to be left electrically unconnected and soldered to the PCB.
12 CS input I²C/MIPI I3CSM/SPI mode selection: 1 selects SPI idle mode with I²C/MIPI I3CSM enabled, 0 selects SPI communication mode with I²C/MIPI I3CSM disabled.
13 SCL input I²C/MIPI I3CSM serial clock (SCL), or SPI serial port clock (SPC).
14 SDA bidirectional I²C/MIPI I3CSM serial data (SDA); in SPI mode it is the serial data input (SDI), or the 3-wire serial data output (SDO) in 3-wire mode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package LGA-14(2.5x3)
Category Sensors
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) Vdd -0.3 4.8 V 16
Input voltage on any control pin (absolute maximum), lower limit Vin -0.3 V 16
Acceleration g for 0.3 ms (absolute maximum) Sg 3000 g for 0.3 ms 16
Electrostatic discharge protection (HBM) ESD 2 kV 16
Storage temperature range TSTG -40 125 °C 16
Supply voltage Vdd 1.71 3.6 V 11
Power supply for I/O Vdd_IO 1.62 3.6 V 11
Operating temperature range Top -40 105 °C 11
Gyroscope and accelerometer current consumption GA_Idd 1.3 1.6 mA Vdd = 3.0 V, ODR = 1.6 kHz; -40 °C to +125 °C 11
Accelerometer current consumption in high-performance mode A_IddHP 360 530 µA Vdd = 3.0 V, ODR = 1.6 kHz; -40 °C to +125 °C 11
Accelerometer current consumption in low-power mode LA_IddLM 50 150 µA Vdd = 3.0 V, ODR = 52 Hz; @25 °C 11
Accelerometer current consumption in low-power mode LA_IddLM 40 150 µA Vdd = 1.71 V, ODR = 52 Hz; @25 °C 11
Current consumption in low-power mode, combo mode LC_IddLM 530 800 µA Vdd = 3.0 V, ODR = 52 Hz; -40 °C to +125 °C 11
Current consumption in low-power mode, combo mode LC_IddLM 520 800 µA Vdd = 1.71 V, ODR = 52 Hz; -40 °C to +125 °C 11
Gyroscope and accelerometer current consumption during power-down IddPD 5 13 µA Vdd = 3.0 V, @25 °C 11
Low-level output voltage VOL 0.2 V IOL = 4 mA 11
Linear acceleration sensitivity tolerance LA_So% -2 2 % @25 °C 9
Linear acceleration sensitivity tolerance - long term LA_So% -6 6 % 9
Angular rate sensitivity tolerance G_So% -2 2 % @25 °C 9
Angular rate sensitivity tolerance - long term G_So% -8 8 % 9
Linear acceleration sensitivity change vs. temperature LA_SoDr -100 100 ppm/°C 9
Angular rate sensitivity change vs. temperature G_SoDr -70 70 ppm/°C 9
Linear acceleration zero-g level offset accuracy LA_TyOff -20 20 mg @25 °C 9
Linear acceleration offset accuracy - long term LA_Off -150 150 mg 9
Angular rate zero-rate level accuracy G_TyOff -2 2 dps @25 °C 9
Angular rate offset accuracy - long term G_Off -7 7 dps 9
Linear acceleration zero-g level change vs. temperature LA_TCOff -0.1 0.1 mg/°C 9
Angular rate typical zero-rate level change vs. temperature G_TCOff -0.005 0.005 dps/°C 9
Linear acceleration cross-axis sensitivity LA_Cx -1 1 % @25 °C 9
Angular rate cross-axis sensitivity G_Cx -1 1 % @25 °C 10
Acceleration noise density An 60 200 µg/√Hz @LA_FS = ±2 g 10
Rate noise density Rn 5 12 mdps/√Hz 10
Linear acceleration self-test output change - long term Vst 40 1700 mg 10
Angular rate self-test output change - long term Vst 20 80 dps FS = ±250 dps 10
Angular rate self-test output change - long term Vst 150 700 dps FS = ±2000 dps 10
Temperature offset Toff -15 15 °C 12
SPI SPI clock cycle tc(SPC) 100 ns 13
SPI SPI clock frequency fc(SPC) 10 MHz 13
SPI CS setup time tsu(CS) 5 ns 13
SPI CS hold time th(CS) 20 ns 13
SPI SDI input setup time tsu(SI) 5 ns 13
SPI SDI input hold time th(SI) 15 ns 13
SPI SDO valid output time tv(SO) 50 ns 13
SPI SDO output hold time th(SO) 5 ns 13
SPI SDO output disable time tdis(SO) 50 ns 13
I2C SCL clock frequency f(SCL) 0 100 kHz I²C standard mode 14
I2C SCL clock frequency f(SCL) 0 400 kHz I²C fast mode 14
I2C SDA data hold time th(SDA) 0 3.45 µs I²C standard mode 14
I2C SDA data hold time th(SDA) 0 0.9 µs I²C fast mode 14
I2C SCL clock low time tw(SCLL) 4.7 µs I²C standard mode 14
I2C SCL clock low time tw(SCLL) 1.3 µs I²C fast mode 14
I2C SCL clock high time tw(SCLH) 4 µs I²C standard mode 14
I2C SCL clock high time tw(SCLH) 0.6 µs I²C fast mode 14
I2C SDA setup time tsu(SDA) 250 ns I²C standard mode 14
I2C SDA setup time tsu(SDA) 100 ns I²C fast mode 14
I2C START condition hold time th(ST) 4 µs I²C standard mode 14
I2C START condition hold time th(ST) 0.6 µs I²C fast mode 14
I2C repeated START condition setup time tsu(SR) 4.7 µs I²C standard mode 14
I2C repeated START condition setup time tsu(SR) 0.6 µs I²C fast mode 14

CAD (KiCad official)

  • Symbol: ASM330LHBTR
  • Footprint: Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm
  • 3D model: LGA-14(2.5x3) (KiCad packages3D, STEP)
  • 3D model files: asm330lhbtr-etched.step / asm330lhbtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); asm330lhbtr.step / asm330lhbtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (131 pp, sha256 a397954d22cf6ad0, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF