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ASDM4100S-R

ASDsemi · MOSFETs · SOP-8

ASDM4100S-R from ASDsemi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of Q1 (N-channel, 100 V, 5 A) MOSFET.
2 G1 input Gate of Q1 (N-channel) MOSFET, VGS rated ±20 V.
3 S2 passive Source of Q2 (P-channel, -100 V, -4 A) MOSFET.
4 G2 input Gate of Q2 (P-channel) MOSFET, VGS rated ±20 V.
5 D2 passive Drain of Q2 (P-channel, VDSS -100 V), internally tied to pin 6.
6 D2 passive Drain of Q2 (P-channel, VDSS -100 V), internally tied to pin 5.
7 D1 passive Drain of Q1 (N-channel, VDSS 100 V), internally tied to pin 8.
8 D1 passive Drain of Q1 (N-channel, VDSS 100 V), internally tied to pin 7.

Key specifications

Parameter Value
Manufacturer ASDsemi
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (N-ch) VDSS 100 V 1
Drain-Source Voltage (P-ch) VDSS -100 V 1
Gate-Source Voltage (N-ch) VGSS -20 20 V 1
Gate-Source Voltage (P-ch) VGSS -20 20 V 1
Drain Current - Continuous (N-ch) ID 5 A Note 1a 1
Drain Current - Continuous (P-ch) ID -4 A Note 1a 1
Drain Current - Pulsed (N-ch) ID 20 A Pulsed 1
Drain Current - Pulsed (P-ch) ID -20 A Pulsed 1
Power Dissipation for Single Operation PD 1.6 W Note 1a 1
Power Dissipation for Single Operation PD 1 W Note 1b 1
Power Dissipation for Single Operation PD 0.9 W Note 1c 1
Operating and Storage Junction Temperature Range TJ, TSTG -55 150 °C 1
Drain-Source Breakdown Voltage (N-ch) BVDSS 100 V VGS = 0 V, ID = 250 μA 2
Drain-Source Breakdown Voltage (P-ch) BVDSS -100 V VGS = 0 V, ID = -250 μA 2
Zero Gate Voltage Drain Current (N-ch) IDSS 1 μA VDS = 24 V, VGS = 0 V 2
Zero Gate Voltage Drain Current (P-ch) IDSS -1 μA VDS = -24 V, VGS = 0 V 2
Gate-Body Leakage, Forward IGSSF 100 nA VGS = 20 V, VDS = 0 V 2
Gate-Body Leakage, Reverse IGSSR -100 nA VGS = -20 V, VDS = 0 V 2
Gate Threshold Voltage (N-ch) VGS(th) 1 1.6 3 V VDS = VGS, ID = 250 μA 2
Thermal Resistance, Junction-to-Ambient RθJA 78 °C/W Note 1a 1
Thermal Resistance, Junction-to-Case RθJC 40 °C/W Note 1 1

CAD (KiCad official)

  • Symbol: ASDM4100S-R
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: asdm4100s-r-etched.step / asdm4100s-r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); asdm4100s-r.step / asdm4100s-r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ASDsemi datasheet (9 pp, sha256 fe6e1dae3306ec62, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF