component
ASDM3400ZA-R
Public Made by Adomby adom
Ascend MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ASDM3400ZA-R
Ascend · MOSFETs · SOT-23
ASDM3400ZA-R from Ascend, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS rated at ±12 V maximum and threshold VGS(th) of 0.65 V min, 0.9 V typ, 1.5 V max at ID=250μA. |
| 2 | S | passive | Source; connects to the load or ground side of the N-channel MOSFET, with body diode forward voltage VSD of 1.2 V max at IS=5.6A. |
| 3 | D | passive | Drain; rated for VDS of 30 V, continuous ID of 5.6 A at TA=25℃ and pulsed IDM of 23 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Ascend |
| Package | SOT-23 |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 30 | V | TA=25℃ | 1 | ||
| Gate-source voltage | VGS | -12 | 12 | V | TA=25℃ | 1 | |
| Drain current | ID | 5.6 | A | TA=25℃ | 1 | ||
| Drain current | ID | 4.5 | A | TA=70℃ | 1 | ||
| Pulsed drain current | IDM | 23 | A | TA=25℃ | 1 | ||
| Total power dissipation | PD | 1.2 | W | TA=25℃ | 1 | ||
| Total power dissipation | PD | 0.8 | W | TA=70℃ | 1 | ||
| Thermal resistance junction-to-ambient | RθJA | 104 | ℃/W | 1 in2 pad of 2oz copper | 1 | ||
| Junction and storage temperature range | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Drain-source breakdown voltage | BVDSS | 30 | V | VGS=0V, ID=250μA | 2 | ||
| Zero gate voltage drain current | IDSS | 1 | μA | VDS=30V, VGS=0V | 2 | ||
| Gate-body leakage current | IGSS1 | -100 | 100 | nA | VGS=±12V, VDS=0V | 2 | |
| Gate threshold voltage | VGS(th) | 0.65 | 0.9 | 1.5 | V | VDS=VGS, ID=250μA | 2 |
| Static drain-source on-resistance | RDS(ON) | 20 | 25 | mΩ | VGS=10V, ID=5.6A | 2 | |
| Static drain-source on-resistance | RDS(ON) | 23 | 31 | mΩ | VGS=4.5V, ID=5A | 2 | |
| Static drain-source on-resistance | RDS(ON) | 27 | 45 | mΩ | VGS=2.5V, ID=3A | 2 | |
| Diode forward voltage | VSD | 1.2 | V | IS=5.6A, VGS=0V | 2 | ||
| Input capacitance | Ciss | 630 | pF | VDS=15V, VGS=0V, f=1MHZ | 2 | ||
| Output capacitance | Coss | 55 | pF | VDS=15V, VGS=0V, f=1MHZ | 2 | ||
| Reverse transfer capacitance | Crss | 71 | pF | VDS=15V, VGS=0V, f=1MHZ | 2 | ||
| Total gate charge | Qg | 17.25 | nC | VGS=10V, VDS=15V, ID=5.6A | 2 | ||
| Gate-source charge | Qgs | 2.1 | nC | VGS=10V, VDS=15V, ID=5.6A | 2 | ||
| Gate-drain charge | Qgd | 2 | nC | VGS=10V, VDS=15V, ID=5.6A | 2 | ||
| Reverse recovery charge | Qrr | 1.1 | nC | IF=5.6A, di/dt=100A/us | 2 | ||
| Reverse recovery time | trr | 13.1 | ns | IF=5.6A, di/dt=100A/us | 2 | ||
| Turn-on delay time | tD(on) | 4.4 | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 | ||
| Turn-on rise time | tr | 28.2 | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 | ||
| Turn-off delay time | tD(off) | 16.2 | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 | ||
| Turn-off fall time | tf | 26 | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | mounting surface of the drain pins. RθJC is guaranteed by design, while RθJA is determined by the board design. The maximum rating presented here is based on mounting on a 1 in 2 pad of 2oz copper. | 2 |
CAD (KiCad official)
- Symbol:
ASDM3400ZA-R - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
asdm3400za-r-etched.step/asdm3400za-r-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);asdm3400za-r.step/asdm3400za-r.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Ascend datasheet (8 pp, sha256
dc2d9e49d834e8e3, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ASDM3400ZA-R
**Ascend** · MOSFETs · SOT-23
ASDM3400ZA-R from Ascend, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS rated at ±12 V maximum and threshold VGS(th) of 0.65 V min, 0.9 V typ, 1.5 V max at ID=250μA. |
| 2 | S | passive | Source; connects to the load or ground side of the N-channel MOSFET, with body diode forward voltage VSD of 1.2 V max at IS=5.6A. |
| 3 | D | passive | Drain; rated for VDS of 30 V, continuous ID of 5.6 A at TA=25℃ and pulsed IDM of 23 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Ascend |
| Package | SOT-23 |
| Category | Transistors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | | | 30 | V | TA=25℃ | 1 |
| Gate-source voltage | VGS | -12 | | 12 | V | TA=25℃ | 1 |
| Drain current | ID | | | 5.6 | A | TA=25℃ | 1 |
| Drain current | ID | | | 4.5 | A | TA=70℃ | 1 |
| Pulsed drain current | IDM | | | 23 | A | TA=25℃ | 1 |
| Total power dissipation | PD | | | 1.2 | W | TA=25℃ | 1 |
| Total power dissipation | PD | | | 0.8 | W | TA=70℃ | 1 |
| Thermal resistance junction-to-ambient | RθJA | | | 104 | ℃/W | 1 in2 pad of 2oz copper | 1 |
| Junction and storage temperature range | TJ, TSTG | -55 | | 150 | ℃ | | 1 |
| Drain-source breakdown voltage | BVDSS | 30 | | | V | VGS=0V, ID=250μA | 2 |
| Zero gate voltage drain current | IDSS | | | 1 | μA | VDS=30V, VGS=0V | 2 |
| Gate-body leakage current | IGSS1 | -100 | | 100 | nA | VGS=±12V, VDS=0V | 2 |
| Gate threshold voltage | VGS(th) | 0.65 | 0.9 | 1.5 | V | VDS=VGS, ID=250μA | 2 |
| Static drain-source on-resistance | RDS(ON) | | 20 | 25 | mΩ | VGS=10V, ID=5.6A | 2 |
| Static drain-source on-resistance | RDS(ON) | | 23 | 31 | mΩ | VGS=4.5V, ID=5A | 2 |
| Static drain-source on-resistance | RDS(ON) | | 27 | 45 | mΩ | VGS=2.5V, ID=3A | 2 |
| Diode forward voltage | VSD | | | 1.2 | V | IS=5.6A, VGS=0V | 2 |
| Input capacitance | Ciss | | 630 | | pF | VDS=15V, VGS=0V, f=1MHZ | 2 |
| Output capacitance | Coss | | 55 | | pF | VDS=15V, VGS=0V, f=1MHZ | 2 |
| Reverse transfer capacitance | Crss | | 71 | | pF | VDS=15V, VGS=0V, f=1MHZ | 2 |
| Total gate charge | Qg | | 17.25 | | nC | VGS=10V, VDS=15V, ID=5.6A | 2 |
| Gate-source charge | Qgs | | 2.1 | | nC | VGS=10V, VDS=15V, ID=5.6A | 2 |
| Gate-drain charge | Qgd | | 2 | | nC | VGS=10V, VDS=15V, ID=5.6A | 2 |
| Reverse recovery charge | Qrr | | 1.1 | | nC | IF=5.6A, di/dt=100A/us | 2 |
| Reverse recovery time | trr | | 13.1 | | ns | IF=5.6A, di/dt=100A/us | 2 |
| Turn-on delay time | tD(on) | | 4.4 | | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 |
| Turn-on rise time | tr | | 28.2 | | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 |
| Turn-off delay time | tD(off) | | 16.2 | | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 |
| Turn-off fall time | tf | | 26 | | ns | VGS=10V, VDS=15V, ID=5.6A, RGEN=3Ω | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | mounting surface of the drain pins. RθJC is guaranteed by design, while RθJA is determined by the board design. The maximum rating presented here is based on mounting on a 1 in 2 pad of 2oz copper. | 2 |
## CAD (KiCad official)
- Symbol: `ASDM3400ZA-R`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `asdm3400za-r-etched.step` / `asdm3400za-r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asdm3400za-r.step` / `asdm3400za-r.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Ascend datasheet](docs/asdm3400za-r-datasheet.pdf) (8 pp, sha256 `dc2d9e49d834e8e3`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/asdm3400za-r-datasheet.pdf)