AS5147-HTSM from AMS, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CSn	input	SPI chip select (active low); if SPI is not used a pull-up resistor is required and floating is not allowed.
2	CLK	input	SPI clock input; if SPI is not used a pull-down resistor is required and floating is not allowed.
3	MISO	output	SPI master data input, slave output; can be left open if SPI is not used.
4	MOSI	input	SPI master data output, slave input; if SPI is not used a pull-down resistor is required and floating is not allowed.
5	TEST	passive	Test pin, connect to ground.
6	B	output	Incremental signal B; can be left open if unused.
7	A	output	Incremental signal A; can be left open if unused.
8	W/PWM	output	Commutation signal W or PWM-encoded output; can be left open if unused.
9	V	power_in	Commutation signal V; can be left open if unused.
10	U	output	Commutation signal U; can be left open if unused.
11	VDD	power_in	5V power supply voltage for the on-chip regulator (4.5-5.5V in the application circuit, absolute maximum 7.0V).
12	VDD3V3	power_out	3.3V on-chip low-dropout (LDO) output requiring an external 1µF decoupling capacitor.
13	GND	power_in	Ground.
14	I/PWM	output	Incremental signal I (index) or PWM output; can be left open if unused.

Key specifications

Parameter	Value
Manufacturer	AMS
Package	TSSOP-14
Category	Sensors
Pins	14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
DC supply voltage at VDD pin	VDD5	-0.3		7	V		7
DC supply voltage at VDD3V3 pin	VDD3	-0.3		5	V		7
DC supply voltage at GND pin	VSS	-0.3		0.3	V		7
Input current (latch-up immunity)	Iscr	-100		100	mA	AEC-Q100-004	7
Electrostatic discharge	ESD	-2		2	kV	AEC-Q100-002	7
Total power dissipation	Pt			150	mW	all supplies and outputs	7
Ambient temperature 5V0	Ta5V0	-40		150	°C	In the 5.0V power supply mode only	7
Ambient temperature 3V3	Ta3V3	-40		125	°C	In the 3.3V power supply mode if NOISESET = 0	7
Programming temperature	TaProg	5		45	°C	Programming @ room temperature (25°C ± 20°C)	7
Storage temperature	Tstrg	-55		150	°C		7
Package body temperature	Tbody			260	°C	IPC/JEDEC J-STD-020	7
Relative humidity non-condensing	RHNC	5		85	%		7
Positive supply voltage	VDD	4.5	5	5.5	V	5.0V operation mode	8
Positive supply voltage	VDD3V3	3	3.3	3.6	V	3.3V operation mode; only from -40 to 125°C	8
Positive supply voltage	VDD3V3_150	3.2	3.4	3.6	V	3.3V operation mode; only from -40 to 150°C (3V150°C Bit has to be set)	8
Regulated voltage	VREG	3.2	3.4	3.6	V	Voltage at VDD3V3 pin if VDD ≠ VDD3V3	8
Supply current	IDD			15	mA		8
Current on digital output (ABI, UVW)	I_Out			1	mA		8
Current on digital output MISO	I_Out_MISO			4	mA		8
Capacitive load on digital output	C_L			50	pf		8
Orthogonal magnetic field strength, normal operating mode	Bz	35		70	mT	Required orthogonal component of the magnetic field strength measured at the die's surface along a circle of 1.1mm	9
Non-linearity, optimum placement of the magnet	INLOPT	-0.8		0.8	degree	@ 25°C	9
Non-linearity optimum placement over full temperature range	INLOPT+TEMP	-1		1	degree		9
Non-linearity @ displacement of magnet and temperature	INLDIS+TEMP	-1.2		1.2	degree	-40°C to 150°C; Assuming N35H Magnet (D=8mm, H=3mm) 500μm displacement in x and y z-distance @ 2000μm	9
System propagation delay, core	tdelay		90	110	μs	Reading angle via SPI	10
Residual system propagation delay after DAEC	tdelay_DAEC		1.5	1.9	μs	At ABI, UVW and SPI	10
Sampling rate	tsampl	202	222	247	ns	Refresh rate at SPI	10
Power-on time	tpon			10	ms	Not tested, guaranteed by design. Time between VDD > VDDMIN and the first valid outcome	10
Core resolution	RES		14		bit		9
RMS output noise NOISESET = 0	ONL		0.068		degree	Orthogonal component within Bz, NOISESET = 0	9
RMS output noise NOISESET = 1	ONH		0.082		degree	Orthogonal component within Bz, NOISESET = 1	9
Maximum speed	MS			14500	RPM		10

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	PC		Tbody Package body temperature 260 °C IPC/JEDEC J-STD-020	7

CAD (KiCad official)

Symbol: AS5147-HTSM
Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
3D model: TSSOP-14 (KiCad packages3D, STEP)
3D model files: as5147-htsm-etched.step / as5147-htsm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); as5147-htsm.step / as5147-htsm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: AMS datasheet (41 pp, sha256 0d093c89c4d1eb8e, retrieved 2026-10-31, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

AS5147-HTSM

Verified AS5147-HTSM

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README