component
AS360-AL
Public Made by Adomby adom
AnBon Schottky Barrier Diodes (SBD), SMA. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 2d ago |
| viewers | 2d ago |
| as360-al-etched.glb | 2d ago |
| as360-al-etched.step | 2d ago |
| as360-al-hero.glb | 2d ago |
| as360-al-hero.overlay.json | 2d ago |
| as360-al.glb | 2d ago |
| as360-al.kicad_mod | 2d ago |
| as360-al.kicad_sym | 2d ago |
| as360-al.lbr | 2d ago |
| as360-al.step | 2d ago |
| package.json | 2d ago |
| page.json | 2d ago |
| README.md | 2d ago |
AS360-AL
AnBon · Schottky Barrier Diodes (SBD) · SMA
AS360-AL from AnBon, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode, indicated by the cathode band on the package; the diode blocks up to 60V (VRRM) reverse for the AS360-AL. |
| 2 | A | passive | Anode; the diode conducts up to 3.0A average forward current toward the cathode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | AnBon |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 60 | V | TA=25°C | 1 | ||
| Maximum RMS voltage | VRMS | 42 | V | TA=25°C | 1 | ||
| Maximum continuous reverse voltage | VR | 60 | V | TA=25°C | 1 | ||
| Maximum average forward rectified current | IO | 3 | A | TA=25°C | 1 | ||
| Non-repetitive peak forward surge current | IFSM | 80 | A | 8.3ms single half sine-wave | 1 | ||
| Storage temperature range | TSTG | -65 | 175 | °C | 1 | ||
| Typical thermal resistance junction to ambient | RθJA | 52 | °C/W | Note 2: mounted on FR-4 PCB copper, minimum recommended pad layout | 1 | ||
| Typical thermal resistance junction to case | RθJC | 26 | °C/W | Note 2: mounted on FR-4 PCB copper, minimum recommended pad layout | 1 |
CAD (KiCad official)
- Symbol:
AS360-AL - Footprint:
Diode_SMD:D_SMA - 3D model: SMA (KiCad packages3D, STEP)
- 3D model files:
as360-al-etched.step/as360-al-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);as360-al.step/as360-al.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: AnBon datasheet (3 pp, sha256
e867ccb22f308b81, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).