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AS2376QS-13

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Diodes Incorporated Operational Amplifier, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AS2376QS-13

Diodes Incorporated · Operational Amplifier · SO-8

AS2376QS-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT A output Output of amplifier channel A.
2 -IN A input Inverting input of amplifier channel A; input signals swinging more than 0.3V beyond the rails should be current limited to 10mA or less.
3 +IN A input Noninverting input of amplifier channel A; input signals swinging more than 0.3V beyond the rails should be current limited to 10mA or less.
4 V- power_in Negative (lowest) power supply; supply span V+ to V- is 2.2V to 5.5V recommended, 6.5V absolute maximum.
5 +IN B input Noninverting input of amplifier channel B; input signals swinging more than 0.3V beyond the rails should be current limited to 10mA or less.
6 -IN B input Inverting input of amplifier channel B; input signals swinging more than 0.3V beyond the rails should be current limited to 10mA or less.
7 OUT B output Output of amplifier channel B.
8 V+ power_in Positive (highest) power supply; supply span V+ to V- is 2.2V to 5.5V recommended, 6.5V absolute maximum.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input offset voltage VOS 5 25 μV 4
Long-term stability VOS 60 μV Note 11 4
Package level shift VOS 320 μV Note 12 4
Input offset voltage vs temperature ΔVOS/ΔT 0.26 1.2 μV/°C TA = -40°C to +85°C 4
Input offset voltage vs temperature ΔVOS/ΔT 0.32 2 μV/°C TA = -40°C to +125°C 4
Input offset voltage vs power supply PSRR 5 20 μV/V TA = 25°C, VS = 2.2V to 5.5 V, VCM < (V+), 1.3 V 4
Input bias current IB 0.2 70 pA TA = 25°C 4
Input offset current IOS 0.2 70 pA 4
Common-mode rejection ratio CMRR 76 90 dB (V-) < VCM < (V+), 1.3 V 4
Common-mode voltage range low VCM -0.1 V (V-) + value; printed (V-), 0.1 4
Common-mode voltage range high VCM 0.1 V printed (V+) + 0.1 4
Open-loop voltage gain AOL 120 134 dB 50 mV < VO < (V+), 50 mV, RL = 10 kΩ 4
Open-loop voltage gain AOL 120 126 dB 100 mV < VO < (V+), 100 mV, RL = 2 kΩ 4
Output swing from rail 10 20 mV TA = 25°C, RL = 10 kΩ 5
Output swing from rail 40 mV TA = -40°C to +125°C, RL = 10 kΩ 5
Output swing from rail 40 50 mV TA = 25°C, RL = 2 kΩ 5
Output swing from rail 80 mV TA = -40°C to +125°C, RL = 2 kΩ 5
Specified voltage range VS 2.2 5.5 V 5
Quiescent current per amplifier IQ 760 950 μA TA = 25°C, I= 0, V = 5.5 V, VCM< (V+), 1.3 V 5
Quiescent current per amplifier IQ 1 mA TA = -40°C to +125°C 5
Specified temperature range -40 125 °C 5
Operating temperature range -40 150 °C 5
Supply voltage V+ -V- 6.5 V TA = +25°C 3
Storage temperature TST -65 150 °C 3
Maximum junction temperature TJ 150 °C 3
Lead temperature TLEAD 260 °C Soldering, 10 seconds 3
ESD HBM ESD HBM 4 kV Human Body Model 3
ESD CDM ESD CDM 1 kV Charged-device Model 3
Supply voltage VCC 2.2 5.5 V 3
Ambient operating temperature range TA -40 125 °C 3
Junction-to-ambient thermal resistance RθJA 115 °C/W SO-8 3
Junction-to-case thermal resistance RθJC 18 °C/W SO-8 3
Channel separation, dc 0.5 mV/V 4
Input voltage noise 0.8 μVPP f = 0.1 Hz to 10 Hz 4
Input voltage noise density en 9.5 nV/√Hz f = 1 kHz 4
Gain-bandwidth product GBW 5.5 MHz CL = 100 pF, VS = 5.5 V 4
Slew rate SR 2 V/μs G = 1 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208  Weight: 0.074 grams (Approximate) 13

CAD (KiCad official)

  • Symbol: AS2376QS-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: as2376qs-13-etched.step / as2376qs-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); as2376qs-13.step / as2376qs-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (14 pp, sha256 2b0a97f6af7d06b1, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF