# ARC1206CJR005

**JU YONG CHANG** · Current Sense Resistors/Shunt Resistors · 1206

ARC1206CJR005 from JU YONG CHANG, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | JU YONG CHANG |
| Package | 1206 |
| Category | Resistors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| TCR (resistance ≥4mΩ; this MPN is 5mΩ) |  | -100 |  | 100 | ppm/℃ | R ≥4mΩ | 3 |
| Operating temperature range |  | -55 |  | 170 | ℃ |  | 3 |
| Insulation resistance |  | 100 |  |  | MΩ |  | 3 |
| Short-time overload: resistance change |  | -1 |  | 1 | % | 5× rated power, 5 s | 5 |
| Low temperature operation: resistance change |  | -1 |  | 1 | % | IEC 60115-1 4.23.4 | 5 |
| Resistance to soldering heat: resistance change |  | -1 |  | 1 | % | IEC 60115-1 4.8 | 5 |
| Vibration: resistance change |  | -1 |  | 1 | % | MIL-STD-202 Method 204 | 5 |
| Shock: resistance change |  | -1 |  | 1 | % | MIL-STD-202 Method 213 | 5 |
| Bending test: resistance change |  | -1 |  | 1 | % | AEC-Q200-005 | 5 |
| Temperature cycling: resistance change |  | -1 |  | 1 | % | JESD 22 Method JA-104-1000 | 5 |
| Bias humidity: resistance change |  | -1 |  | 1 | % | MIL-STD-202 Method 103 | 5 |
| Load life: resistance change |  | -1 |  | 1 | % | MIL-STD-202 Method 108 | 5 |
| High temperature storage: resistance change |  | -1 |  | 1 | % | MIL-STD-202 Method 108 | 5 |
| Rated power |  |  | 1 |  | W |  | 3 |
| IR reflow preheat temperature |  | 150 |  | 180 | ℃ | preheat zone, 90±30 s | 6 |
| IR reflow solder zone temperature |  | 230 |  |  | ℃ | solder zone, 30±10 s | 6 |
| IR reflow peak temperature |  |  | 250 |  | ℃ | peak, +5/-0 ℃, 5 s | 6 |
| Storage temperature |  | 5 |  | 35 | ℃ | storage | 9 |
| Storage relative humidity |  | 45 |  | 75 | %RH | storage | 9 |

## CAD (KiCad official)

- Symbol: `ARC1206CJR005`
- Footprint: `Resistor_SMD:R_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `arc1206cjr005-etched.step` / `arc1206cjr005-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `arc1206cjr005.step` / `arc1206cjr005.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [JU YONG CHANG datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590197014161096704) (10 pp, sha256 `da117e915afd9d84`, retrieved 2026-10-20, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/arc1206cjr005-datasheet.pdf)