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AQHV12-01LTG
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Littelfuse TVS, SOD-523. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AQHV12-01LTG
Littelfuse · TVS · SOD-523
AQHV12-01LTG from Littelfuse, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | passive | Protected line (cathode side of the unidirectional TVS); standoff 12.0V max, breakdown 13.3V min at 1mA, clamps to 26V max at 10A (8/20µs) referenced to GND. |
| 2 | GND | power_in | Ground reference (anode side) for the I/O-to-GND clamp, rated ±30kV IEC 61000-4-2 contact and air discharge. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Standoff Voltage | VRWM | 12 | V | IR=1μA | 2 | ||
| Breakdown Voltage | VBR | 13.3 | 14.3 | V | IR=1mA | 2 | |
| Clamp Voltage | VC | 16.5 | 20 | V | IPP=1A, tp=8/20µs, I/O to GND | 2 | |
| Clamp Voltage | VC | 23.5 | 26 | V | IPP=10A, tP=8/20μs, I/O to GND | 2 | |
| Peak Pulse Current | Ipp | 10 | A | tp=8/20µs | 2 | ||
| ESD Withstand Voltage | VESD | 30 | kV | IEC 61000-4-2 (Contact Discharge) | 2 | ||
| Diode Capacitance | CI/O-GND | 55.5 | 60 | pF | Reverse Bias=0V, f=1MHz | 2 | |
| Reverse Leakage Current | ILEAK | 5 | 50 | nA | VR=12V | 2 | |
| Dynamic Resistance | RDYN | 0.22 | Ω | TLP, tp=100ns, I/O to GND | 2 | ||
| Peak Pulse Power | Ppk | 250 | W | tp=8/20μs | 1 | ||
| Operating Temperature | TOP | -40 | 150 | °C | 1 | ||
| Storage Temperature | TSTOR | -55 | 150 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | tin | Lead Plating Matte Tin Lead Material Copper Alloy | 6 |
CAD (KiCad official)
- Symbol:
AQHV12-01LTG - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
aqhv12-01ltg-etched.step/aqhv12-01ltg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aqhv12-01ltg.step/aqhv12-01ltg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (7 pp, sha256
1b67fe92c04744b4, retrieved 2026-10-29, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AQHV12-01LTG
**Littelfuse** · TVS · SOD-523
AQHV12-01LTG from Littelfuse, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | passive | Protected line (cathode side of the unidirectional TVS); standoff 12.0V max, breakdown 13.3V min at 1mA, clamps to 26V max at 10A (8/20µs) referenced to GND. |
| 2 | GND | power_in | Ground reference (anode side) for the I/O-to-GND clamp, rated ±30kV IEC 61000-4-2 contact and air discharge. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Standoff Voltage | VRWM | | | 12 | V | IR=1μA | 2 |
| Breakdown Voltage | VBR | 13.3 | | 14.3 | V | IR=1mA | 2 |
| Clamp Voltage | VC | | 16.5 | 20 | V | IPP=1A, tp=8/20µs, I/O to GND | 2 |
| Clamp Voltage | VC | | 23.5 | 26 | V | IPP=10A, tP=8/20μs, I/O to GND | 2 |
| Peak Pulse Current | Ipp | | | 10 | A | tp=8/20µs | 2 |
| ESD Withstand Voltage | VESD | | | 30 | kV | IEC 61000-4-2 (Contact Discharge) | 2 |
| Diode Capacitance | CI/O-GND | | 55.5 | 60 | pF | Reverse Bias=0V, f=1MHz | 2 |
| Reverse Leakage Current | ILEAK | | 5 | 50 | nA | VR=12V | 2 |
| Dynamic Resistance | RDYN | | 0.22 | | Ω | TLP, tp=100ns, I/O to GND | 2 |
| Peak Pulse Power | Ppk | | | 250 | W | tp=8/20μs | 1 |
| Operating Temperature | TOP | -40 | | 150 | °C | | 1 |
| Storage Temperature | TSTOR | -55 | | 150 | °C | | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | tin | Lead Plating Matte Tin Lead Material Copper Alloy | 6 |
## CAD (KiCad official)
- Symbol: `AQHV12-01LTG`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `aqhv12-01ltg-etched.step` / `aqhv12-01ltg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `aqhv12-01ltg.step` / `aqhv12-01ltg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Littelfuse datasheet](docs/aqhv12-01ltg-datasheet.pdf) (7 pp, sha256 `1b67fe92c04744b4`, retrieved 2026-10-29, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/aqhv12-01ltg-datasheet.pdf)