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Ray Publish 0.1.0 0403e3f 11d ago

AQ24COM-02HTG

Littelfuse · ESD And Surge Protection (TVS/ESD) · SOT-23-3

AQ24COM-02HTG from Littelfuse, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 passive TVS-protected I/O channel 1, protected to GND with 24 V reverse standoff, 26 V min breakdown at 1 mA and ±30 kV IEC 61000-4-2 ESD withstand.
2 I/O2 passive TVS-protected I/O channel 2, protected to GND with 24 V reverse standoff, 26 V min breakdown at 1 mA and ±30 kV IEC 61000-4-2 ESD withstand.
3 GND power_in Common ground/reference pin to which both I/O channels are clamped, as shown in the functional block diagram and the I/O to GND test conditions.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SOT-23-3
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 26 33 V IR = 1 mA, I/O to GND 2
Reverse Leakage Current ILEAK 1 50 nA VR = 24 V, I/O to GND 2
Clamp Voltage VC 38.5 V IPP = 1 A, tp = 8/20 μs, I/O to GND 2
Clamp Voltage VC 50 V IPP = 5 A, tp = 8/20 μs, I/O to GND 2
Reverse Standoff Voltage VRWM 24 V 2
ESD Withstand Voltage (Contact) VESD -30 30 kV IEC 61000-4-2 (Contact Discharge) 2
ESD Withstand Voltage (Air) VESD -30 30 kV IEC 61000-4-2 (Air Discharge) 2
Peak Pulse Power PPK 250 W tp = 8/20 μs 2
Peak Current IPP 5 A tp = 8/20 μs 2
Operating Temperature TOP -40 150 °C 2
Storage Temperature TSTOR -55 150 °C 2
Dynamic Resistance RDYN 0.42 Ω TLP, tP = 100 ns, I/O to GND 2
Diode Capacitance CI/O-GND 13 pF Reverse Bias = 0 V, f = 1 MHz; I/O to GND 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper alloy tin Lead plating Matte tin Lead material Copper alloy 4

CAD (KiCad official)

  • Symbol: AQ24COM-02HTG
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: aq24com-02htg-etched.step / aq24com-02htg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aq24com-02htg.step / aq24com-02htg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (6 pp, sha256 f4eccbf3cdce113e, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF