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APX810-29SAG-7

Diodes Incorporated · Monitors & Reset Circuits · SOT-23

APX810-29SAG-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 RESET output Active-high push-pull reset output for the APX810 that is asserted when VCC falls below the reset threshold and held for the reset timeout period (typ. 200ms) after VCC rises above it, valid down to VCC = 1V.
3 VCC power_in Operating voltage input, recommended 1.1V to 5.5V with an absolute maximum of -0.3V to +6.0V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reset Threshold (APX810-29), TA = 0°C to +85°C VTH 2.88 2.93 3 V TA = 0oC to +85oC 3
Reset Threshold (APX810-29), TA = -40°C to +85°C VTH 2.86 2.93 3 V TA = -40oC to +85oC 3
VCC Range VCC 1 5.5 V TA = 0oC to +70oC 3
Supply Current ICC 30 40 μA VTH + 0.2V 3
Reset Active Timeout Period tDELAY 140 200 280 ms TA = 0oC to +85oC 3
RESET Output Voltage Low (APX810) 1.2mA VOL 0.3 V VCC = VTH +0.2, ISINK = 1.2mA 3
RESET Output Voltage Low (APX810) 3.2mA VOL 0.4 V VCC = VTH +0.2, ISINK = 3.2mA 3
RESET Output Voltage High (APX810) VOH 0.8 V 1.8V < VCC < VTH -0.2, ISOURCE = 150µA (min is 0.8VCC) 3
Reset Threshold Tempco 30 ppm/oC 3
Set-up Time tS 20 μs VCC = VTH to (VTH - 100mV) 3
Supply Voltage VCC 1.1 5.5 V 3
Input Voltage VIN 0 V max is (VCC + 0.3) 3
Operating Ambient Temperature Range TA -40 85 oC 3
VCC Rising Time tR 100 µs VCC = 0 to VT 3
Supply Voltage VCC -0.3 6 V 2
RESET Voltage (Push-pull) VRESET -0.3 V max is (VCC + 0.3) 2
Input Current, VCC ICC 20 mA 2
Output Current, RESET IO 20 mA 2
Continuous Power Dissipation PD 400 mW TA = +70°C, De-rate 4mW/°C above +70°C 2
Operating Junction Temperature Range TOP -40 105 °C 2
Storage Temperature Range TST -65 150 °C 2
ESD HBM ESD HBM 5 kV Human Body Model 2
ESD MM ESD MM 500 V Machine Model 2
Thermal Resistance Junction-to-Ambient θJA 201 oC/W SOT23 (Note 4) 3
Thermal Resistance Junction-to-Case θJC 56 oC/W SOT23 (Note 4) 3

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: APX810-29SAG-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: apx810-29sag-7-etched.step / apx810-29sag-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); apx810-29sag-7.step / apx810-29sag-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 6cea3bdb5cde9297, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF