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APX809S-29SR-7

Diodes Incorporated · Monitors & Reset Circuits · SOT-23

APX809S-29SR-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 /RESET output Push-pull active-low reset output that asserts when VCC falls below the reset threshold and stays asserted for at least 240 ms after VCC rises above it; RESET output voltage is rated 0 to 5.5 V (absolute maximum -0.3 to 6.0 V).
2 GND power_in Ground reference pin for the device.
3 VCC power_in Operating voltage input with a recommended supply range of 1.0 V to 5.5 V (absolute maximum -0.3 V to 6.0 V), and outputs are guaranteed valid down to VCC = 1 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Power Supply Chip
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Current ICC 7 16 µA VTH + 0.2V 4
Reset Threshold Voltage VTH 2.89 2.93 2.97 V APX809SXX-29, TA = +25°C 4
Reset Active Timeout Period tDELAY 140 240 280 ms APX809S-XX, VCC ≥ 1.02 x VTH 4
RESET Output Voltage Low VOL 0.3 V VCC = VTH - 0.2V, ISINK = 1.2mA 4
RESET Output Voltage Low VOL 0.4 V VCC = VTH - 0.2V, ISINK = 3.2mA 4
Reset Threshold Temperature Coefficient ΔVTH/ΔT 30 ppm/°C TA = -40 to +125°C 4
VCC Drop to Reset Delay tS 20 µs VCC = VTH to (VTH - 100mV) 4
Supply Voltage VCC -0.3 6 V 3
RESET Voltage VRESET -0.3 6 V 3
Input Current ICC 20 mA 3
Output Current IO 20 mA 3
Junction Temperature Range TJ -40 150 °C 3
Storage Temperature Range TSTG -65 150 C 3
ESD HBM ESD 6000 V HBM (Human Body Model) 3
ESD MM ESD 600 V MM (Machine Model) 3
Operating Ambient Temperature Range TA -40 125 °C 3
Supply Voltage VCC 1 5.5 V 3
RESET Output Voltage VRESET 0 5.5 V 3
Thermal Resistance Junction-to-Ambient θJA 232 °C/W SOT23 3
Thermal Resistance Junction-to-Case θJC 87 °C/W SOT23 3

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: APX809S-29SR-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: apx809s-29sr-7-etched.step / apx809s-29sr-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); apx809s-29sr-7.step / apx809s-29sr-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (10 pp, sha256 b644892b2c8d0948, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF