component
APS12200LLHALT
Public Made by Adomby adom
Allegro MicroSystems, LLC Magnetic Sensors, SOT-23W. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 12d ago |
| viewers | 12d ago |
| aps12200llhalt-etched.glb | 12d ago |
| aps12200llhalt-etched.step | 12d ago |
| aps12200llhalt-hero.glb | 12d ago |
| aps12200llhalt-hero.overlay.json | 12d ago |
| aps12200llhalt.glb | 12d ago |
| aps12200llhalt.kicad_mod | 12d ago |
| aps12200llhalt.kicad_sym | 12d ago |
| aps12200llhalt.lbr | 12d ago |
| aps12200llhalt.step | 12d ago |
| package.json | 12d ago |
| page.json | 12d ago |
| README.md | 12d ago |
APS12200LLHALT
Allegro MicroSystems, LLC · Magnetic Sensors · SOT-23W
APS12200LLHALT from Allegro MicroSystems, LLC, in a SOT-23W. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Connects power supply to chip; operating range 2.8 to 24 V, with a 0.1 µF bypass capacitor to ground recommended close to the device. |
| 2 | VOUT | output | Open-drain, short-circuit-protected output that switches low when B exceeds BOP and goes high when B falls below BRP; short-circuit current limit 30 to 60 mA, off voltage up to 24 V. |
| 3 | GND | power_in | Ground connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | SOT-23W |
| Category | Sensors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Supply Voltage (operating) | VCC | 2.8 | 24 | V | Operating, TJ < 175°C | 4 | |
| Supply Current | ICC | 1 | 2 | 3 | mA | 4 | |
| Output Leakage Current | IOUTOFF | 10 | µA | VOUTOFF = 24 V, B < BRP | 4 | ||
| Output Saturation Voltage | VOUT(SAT) | 200 | 500 | mV | IOUT = 20 mA, B > BOP | 4 | |
| Output Off Voltage | VOUTOFF | 24 | V | B < BRP | 4 | ||
| Power-On Time | tON | 25 | µs | VCC ≥ VCC(min), B < BRP(min), 10 G, B > BOP(max) + 10 G | 4 | ||
| Chopping Frequency | fC | 800 | kHz | 4 | |||
| Output Rise Time | tr | 0.2 | 2 | µs | RLOAD = 1 kΩ, CL = 20 pF | 4 | |
| Output Fall Time | tf | 0.1 | 2 | µs | RLOAD = 1 kΩ, CL = 20 pF | 4 | |
| Output Short-Circuit Current Limit | IOM | 30 | 60 | mA | 4 | ||
| Output Zener Clamp Voltage | VZoutput | 30 | V | IOUT = 3 mA, TA = 25°C, Output Off | 4 | ||
| Reverse Battery Current | IRCC | -5 | mA | VRCC = -18 V, TA = 25°C | 4 | ||
| Supply Zener Clamp Voltage | VZ | 30 | V | ICC = ICC(max) + 3 mA, TA = 25°C | 4 | ||
| Operate Point (APS12200) | BOP | 5 | 20 | 35 | G | 4 | |
| Release Point (APS12200) | BRP | -35 | -20 | -5 | G | 4 | |
| Hysteresis (APS12200) | BHYS | 10 | 40 | 70 | G | 4 | |
| Symmetry | BSYM | -27.5 | 27.5 | G | BOP + BRP | 4 | |
| Magnetic Offset | BOFF | -13.75 | 13.75 | G | (BOP + BRP) / 2 | 4 | |
| Forward Supply Voltage | VCC | 30 | V | 2 | |||
| Reverse Supply Voltage | VRCC | -18 | V | 2 | |||
| Output Off Voltage | VOUT | 30 | V | 2 | |||
| Output Current | IOUT | 60 | mA | Through short-circuit current limiting device | 2 | ||
| Reverse Output Current | IROUT | -50 | mA | 2 | |||
| Maximum Junction Temperature | TJ(max) | 165 | °C | 2 | |||
| Maximum Junction Temperature (500 hours) | TJ(max) | 175 | °C | For 500 hours | 2 | ||
| Storage Temperature | Tstg | -65 | 170 | °C | 2 | ||
| ESD Voltage HBM | VESD(HBM) | -12 | 12 | kV | Human Body Model according to AEC-Q100-002 | 2 | |
| ESD Voltage CDM | VESD(CDM) | -1 | 1 | kV | Charged Device Model according to AEC-Q100-011 | 2 | |
| ESD Voltage System Level | VESD(SYS) | -15 | 15 | kV | ISO 10605, System Level | 2 | |
| Package Thermal Resistance, LH 1-layer | RθJA | 228 | °C/W | Package LH, 1-layer PCB with copper limited to solder pads | 5 | ||
| Package Thermal Resistance, LH 2-layer | RθJA | 110 | °C/W | Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | for through-hole mounting. Both packages are lead (Pb) free and RoHS compliant, with 100% matte-tin-plated leadframes. | 1 |
CAD (KiCad official)
- Symbol:
APS12200LLHALT - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23W (KiCad packages3D, STEP)
- 3D model files:
aps12200llhalt-etched.step/aps12200llhalt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aps12200llhalt.step/aps12200llhalt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems, LLC datasheet (16 pp, sha256
36565097e1a5ea7d, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).