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Contents

README

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APL5934KAI-TRG

Anpec Elec · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOP-8-EP

APL5934KAI-TRG from Anpec Elec, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the circuitry; all voltage levels are measured with respect to this pin.
2 FB input Voltage feedback pin connected to an external resistor divider to set the output voltage against the 0.8V reference.
3 VOUT power_out Regulator output pin that requires at least 10μF of output capacitance for stability and can provide 3A (max.) load current.
4 VOUT power_out Regulator output pin that requires at least 10μF of output capacitance for stability and can provide 3A (max.) load current.
5 VIN power_in Main supply input for voltage conversion, with at least 10μF decoupling recommended and monitored for Power-On-Reset; VIN supply range is 1.2 to 5.5V.
6 VCNTL power_in Bias voltage input for internal control circuitry, recommended at +5V with 0.1μF decoupling; VCNTL supply range is 3.0 to 5.5V and it is monitored for Power-On-Reset.
7 POK output Open-drain power-OK output that is pulled low when the output voltage is not within the Power-OK voltage window.
8 EN input Active-high enable control pin; applying and holding a voltage below the enable threshold shuts down the output, and an internal 3μA current defines the level when left open.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Anpec Elec
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Supply Voltage (VIN to GND) VIN -0.3 6 V 4
VCNTL Supply Voltage (VCNTL to GND) VCNTL -0.3 6 V 4
VOUT to GND Voltage VOUT -0.3 V max VIN +0.3 V 4
POK to GND Voltage POK -0.3 6 V 4
EN, FB to GND Voltage EN, FB -0.3 V max VCNTL +0.3 V 4
Power Dissipation PD 1.8 W TA=25°C 4
VOUT Peak Current IOUT(PK) 9 A <30μs 4
Maximum Junction Temperature TJ 150 °C 4
Storage Temperature TSTG -65 150 °C 4
Maximum Lead Soldering Temperature, 10 Seconds TSDR 260 °C 10 seconds 4
VCNTL Supply Voltage VCNTL 3 5.5 V 4
VIN Supply Voltage VIN 1.2 5.5 V 4
VOUT Output Voltage VOUT 0.8 V when VCNTL-VOUT>1.9V; max VIN-VDROP 4
VOUT Output Current, Continuous Current IOUT 0 3 A Continuous Current 4
VOUT Output Current, Peak Current IOUT 0 4 A Peak Current 4
VOUT Output Capacitance COUT 8 1100 μF IOUT = 3A at 25% nominal VOUT 4
VOUT Output Capacitance COUT 8 1700 μF IOUT = 2A at 25% nominal VOUT 4
VOUT Output Capacitance COUT 8 2400 μF IOUT = 1A at 25% nominal VOUT 4
ESR of VOUT Output Capacitor ESRCOUT 0 200 mΩ 4
Ambient Temperature TA -40 85 °C 4
Junction Temperature TJ -40 125 °C 4
VCNTL Supply Current IVCNTL 100 120 μA EN = High or ENB = Low, IOUT=0A 5
VCNTL Supply Current at Shutdown ISD 3 μA EN = Low, or ENB = High 5
VIN Supply Current at Shutdown 1 μA EN = Low, or ENB = High 5
Rising VCNTL POR Threshold 2.5 2.7 2.9 V 5
Rising VIN POR Threshold 0.8 0.9 1 V 5
Output Voltage Accuracy -1.5 1.5 % VCNTL=3.0 ~ 5.5V, IOUT= 03A, TJ= -40125°C 5
Load Regulation 0.06 0.25 % IOUT=0A ~3A 5
Line Regulation 0.15 0.15 %/V IOUT=10mA, VCNTL= 3.0 ~ 5.5V 5
FB Input Current VFB -100 100 nA VFB=0.8V 5
VIN-to-VOUT Dropout Voltage VDROP 0.26 0.31 V VCNTL=5.0V, IOUT=3A, VOUT=2.5V, TJ=25°C 5
VIN-to-VOUT Dropout Voltage VDROP 0.42 V VCNTL=5.0V, IOUT=3A, VOUT=2.5V, TJ=-40~125°C 5
VIN-to-VOUT Dropout Voltage VDROP 0.24 0.29 V VCNTL=5.0V, IOUT=3A, VOUT=1.8V, TJ=25°C 5
VIN-to-VOUT Dropout Voltage VDROP 0.4 V VCNTL=5.0V, IOUT=3A, VOUT=1.8V, TJ=-40~125°C 5
VIN-to-VOUT Dropout Voltage VDROP 0.23 0.28 V VCNTL=5.0V, IOUT=3A, VOUT=1.2V, TJ=25°C 5
VIN-to-VOUT Dropout Voltage VDROP 0.38 V VCNTL=5.0V, IOUT=3A, VOUT=1.2V, TJ=-40~125°C 5
Current-Limit Level ILIM 4.7 5.7 6.7 A TJ=25°C 5
Current-Limit Level ILIM 4.2 A TJ= -40 ~ 125°C 5
Short Current-Limit Blanking Time 0.6 1.5 ms From beginning of soft-start 5
Thermal Shutdown Temperature TSD 145 150 °C TJ rising 5
EN Logic High Threshold Voltage / ENB Logic Low Threshold Voltage VEN/VENB 0.5 0.8 1.1 V VEN rising or VENB rising 6
Soft-Start Interval tSS 0.3 0.6 1.2 ms VOUT=10% to 90% (APL5934/B/C) 6
Turn On Delay tON 60 120 230 μs From being enabled to VOUT rising 10% (APL5934/C) 6
Rising POK Threshold Voltage VTHPOK 90 92 94 % VFB rising 6
POK Pull-low Voltage 0.25 0.4 V POK sinks 5mA 6
POK Delay Time 1 2 4 ms From VFB =VTHPOK to rising edge of the VPOK 6
VCNTL POR Hysteresis 0.4 V 5
VIN POR Hysteresis 0.5 V 5
Reference Voltage VREF 0.8 V FB=VOUT 5
VOUT Pull-low Resistance 85 Ω VCNTL=5V, VEN=0V, VOUT<0.8V 5
Short Current-Limit Level ISHORT 1.1 A VFB<0.2V 5
EN/ENB Hysteresis 0.1 V 6
EN/ENB Pull-High / Pull-Low Current 3 μA EN=GND or ENB = GND (pull-high); EN=VCNTL or ENB = VCNTL (pull-low) 6
POK Threshold Hysteresis 8 % 6
POK Debounce Interval 10 μs VFB<falling POK voltage threshold 6
Thermal Shutdown Hysteresis 50 °C 5
Junction-to-Ambient Resistance in Free Air, SOP-8P θJA 50 °C/W Note 2: measured on high effective thermal conductivity test board in free air 4
Junction-to-Case Resistance in Free Air, SOP-8P θJC 18 °C/W Note 2: measured on high effective thermal conductivity test board in free air 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed 3
contacts tin Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed 3

CAD (KiCad official)

  • Symbol: APL5934KAI-TRG
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: apl5934kai-trg-etched.step / apl5934kai-trg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); apl5934kai-trg.step / apl5934kai-trg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Anpec Elec datasheet (24 pp, sha256 629fcaf4c28f7105, retrieved 2026-11-06, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF