# APH160808C1R5MP01

**APV** · Power Inductors · 0603

APH160808C1R5MP01 from APV, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised inductor or ferrite bead; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised inductor or ferrite bead; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | APV |
| Package | 0603 |
| Category | Inductors, Coils, Chokes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Inductance tolerance |  | -20 |  | 20 | % |  | 1 |
| Operating temperature (including self heating) |  | -55 |  | 125 | ℃ | Including self heating | 1 |
| Storage temperature (product with taping) |  | 15 |  | 35 | ℃ | Inductors with taping, storage | 29 |
| Storage humidity |  | 25 |  | 70 | %RH | Storage with taping | 29 |
| DC resistance (DCR) | DCR |  | 240 | 285 | mΩ |  | 6 |
| Saturation current | Isat |  | 2.4 | 2 | A | Isat: DC current that causes L0 to drop approximately 30% | 6 |
| Heating rated current | Irms |  | 1.7 | 1.4 | A | Irms: DC current that causes an approximate ΔT of 40 ℃ | 6 |
| Peak reflow temperature (Pb-free profile) | Tp |  |  | 260 | ℃ | Printed as 260 +0/-5 ℃; Pb-free reflow, 2 reflows allowed max | 25 |
| Inductance (nominal) | L |  | 1.5 |  | μH | @1MHz,1V | 6 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | 1.No case deformation or change in appearance. 2.Terminal area must have 95% min. Solder coverage. ①Temperature:245± 5℃. ②Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). ③Sample immersion tin furnace 5 ± | 23 |

## CAD (KiCad official)

- Symbol: `APH160808C1R5MP01`
- Footprint: `Inductor_SMD:L_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `aph160808c1r5mp01-etched.step` / `aph160808c1r5mp01-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `aph160808c1r5mp01.step` / `aph160808c1r5mp01.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [APV datasheet](docs/aph160808c1r5mp01-datasheet.pdf) (30 pp, sha256 `c7b91ec229258ae5`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/aph160808c1r5mp01-datasheet.pdf)