main
History Download
Ray Publish 0.1.0 dd66c2b 8d ago

APG1608ZGCK

Kingbright · LED Indication - Discrete · 0603

APG1608ZGCK from Kingbright, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the green InGaN LED (pin 2 in the package drawing and diode symbol), with a reverse voltage limit of 5 V and a reverse current of at most 50 µA at VR = 5 V.
2 A passive Anode of the green InGaN LED (pin 1 in the package drawing and diode symbol), with a typical forward voltage of 3.3 V (max 4.1 V) at IF = 20 mA and a DC forward current rating of 25 mA.

Key specifications

Parameter Value
Manufacturer Kingbright
Package 0603
Category Optoelectronics
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage VF 3.3 4.1 V IF = 20mA 2
Reverse Current IR 50 µA VR = 5V 2
Luminous Intensity (Iv) Iv 300 400 mcd @ 20mA 1
Dominant Wavelength tolerance λdom -1 1 nm Setup value of sorting machine; tolerance λd ±1nm 2
Forward Voltage tolerance VF -0.1 0.1 V Forward voltage tolerance ±0.1V 2
Luminous Intensity / Luminous Flux tolerance Iv -15 15 % Luminous intensity / luminous flux tolerance ±15% 1
Power Dissipation PD 102.5 mW 2
Reverse Voltage VR 5 V 2
Junction Temperature Tj 115 °C 2
Operating Temperature Top -40 85 °C 2
Storage Temperature Tstg -40 85 °C 2
DC Forward Current IF 25 mA 2
Peak Forward Current IFM 150 mA 1/10 Duty Cycle, 0.1ms Pulse Width 2
Electrostatic Discharge Threshold (HBM) 450 V HBM 2
Thermal Resistance (Junction / Ambient) Rth JA 600 °C/W Mounted on PC board FR4 (pad size ≥ 16 mm2 per pad) 2
Thermal Resistance (Junction / Solder point) Rth JS 410 °C/W Mounted on PC board FR4 (pad size ≥ 16 mm2 per pad) 2

CAD (KiCad official)

  • Symbol: APG1608ZGCK
  • Footprint: LED_SMD:LED_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: apg1608zgck-etched.step / apg1608zgck-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); apg1608zgck.step / apg1608zgck.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Kingbright datasheet (4 pp, sha256 9b574a4dc817ddd4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF