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AP2N7002K-HF-VB

VBsemi Elec · MOSFETs · SOT-23(TO-236)

AP2N7002K-HF-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 G input Gate terminal; the gate-source voltage is limited to ±20 V per the absolute maximum ratings.
2 S passive Source terminal, the reference for VGS; the body-diode forward voltage VSD is specified as 1.3 V max at IS = 100 mA, VGS = 0 V.
3 D passive Drain terminal; the drain-source voltage is rated at 60 V and the continuous drain current is 250 mA at TA = 25 °C.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SOT-23(TO-236)
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 250 mA TA = 25 °C, TJ = 150 °C 1
Continuous Drain Current ID 150 mA TA = 100 °C 1
Pulsed Drain Current IDM 800 mA Pulse width limited by maximum junction temperature 1
Power Dissipation PD 0.3 W TA = 25 °C 1
Power Dissipation PD 0.13 W TA = 100 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 350 °C/W Surface mounted on FR4 board 1
Drain-Source Breakdown Voltage VDS 60 V VGS = 0 V, ID = 10 µA 2
On-State Drain Current ID(on) 500 mA VGS = 10 V, VDS = 7.5 V 2
On-State Drain Current ID(on) 300 mA VGS = 4.5 V, VDS = 10 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 60 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 500 µA VDS = 60 V, VGS = 0 V, TJ = 125 °C 2
Gate-Body Leakage IGSS -10 10 µA VDS = 0 V, VGS = ±20 V 2
Gate-Body Leakage IGSS -1 1 µA VDS = 0 V, VGS = ±15 V 2
Gate-Body Leakage IGSS -150 150 nA VDS = 0 V, VGS = ±10 V 2
Gate-Body Leakage IGSS -1000 1000 nA VDS = 0 V, VGS = ±10 V, TJ = 85 °C 2
Gate-Body Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±5 V 2
Drain-Source On-Resistance RDS(on) 2.8 Ω VGS = 10 V, ID = 200 mA 2
Drain-Source On-Resistance RDS(on) 3.1 Ω VGS = 4.5 V, ID = 150 mA 2
Forward Transconductance gfs 100 mS VDS = 10 V, ID = 100 mA 2
Diode Forward Voltage VSD 1.3 V IS = 100 mA, VGS = 0 V 2
Total Gate Charge Qg 0.4 0.6 nC VDS = 10 V, VGS = 4.5 V, ID ≅ 150 mA 2
Input Capacitance Ciss 25 pF VDS = 25 V, VGS = 0 V, f = 1 MHz 2
Output Capacitance Coss 5 pF VDS = 25 V, VGS = 0 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 2 pF VDS = 25 V, VGS = 0 V, f = 1 MHz 2
Turn-On Time td(on) 20 ns VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω 2
Turn-Off Time td(off) 30 ns VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: AP2N7002K-HF-VB
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: ap2n7002k-hf-vb-etched.step / ap2n7002k-hf-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2n7002k-hf-vb.step / ap2n7002k-hf-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (8 pp, sha256 8263f891d52c6bbf, retrieved 2026-11-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF