component
AP2N7002K-HF-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SOT-23(TO-236). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
AP2N7002K-HF-VB
VBsemi Elec · MOSFETs · SOT-23(TO-236)
AP2N7002K-HF-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the gate-source voltage is limited to ±20 V per the absolute maximum ratings. |
| 2 | S | passive | Source terminal, the reference for VGS; the body-diode forward voltage VSD is specified as 1.3 V max at IS = 100 mA, VGS = 0 V. |
| 3 | D | passive | Drain terminal; the drain-source voltage is rated at 60 V and the continuous drain current is 250 mA at TA = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23(TO-236) |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 250 | mA | TA = 25 °C, TJ = 150 °C | 1 | ||
| Continuous Drain Current | ID | 150 | mA | TA = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | 800 | mA | Pulse width limited by maximum junction temperature | 1 | ||
| Power Dissipation | PD | 0.3 | W | TA = 25 °C | 1 | ||
| Power Dissipation | PD | 0.13 | W | TA = 100 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 350 | °C/W | Surface mounted on FR4 board | 1 | ||
| Drain-Source Breakdown Voltage | VDS | 60 | V | VGS = 0 V, ID = 10 µA | 2 | ||
| On-State Drain Current | ID(on) | 500 | mA | VGS = 10 V, VDS = 7.5 V | 2 | ||
| On-State Drain Current | ID(on) | 300 | mA | VGS = 4.5 V, VDS = 10 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 500 | µA | VDS = 60 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Gate-Body Leakage | IGSS | -10 | 10 | µA | VDS = 0 V, VGS = ±20 V | 2 | |
| Gate-Body Leakage | IGSS | -1 | 1 | µA | VDS = 0 V, VGS = ±15 V | 2 | |
| Gate-Body Leakage | IGSS | -150 | 150 | nA | VDS = 0 V, VGS = ±10 V | 2 | |
| Gate-Body Leakage | IGSS | -1000 | 1000 | nA | VDS = 0 V, VGS = ±10 V, TJ = 85 °C | 2 | |
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±5 V | 2 | |
| Drain-Source On-Resistance | RDS(on) | 2.8 | Ω | VGS = 10 V, ID = 200 mA | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 3.1 | Ω | VGS = 4.5 V, ID = 150 mA | 2 | ||
| Forward Transconductance | gfs | 100 | mS | VDS = 10 V, ID = 100 mA | 2 | ||
| Diode Forward Voltage | VSD | 1.3 | V | IS = 100 mA, VGS = 0 V | 2 | ||
| Total Gate Charge | Qg | 0.4 | 0.6 | nC | VDS = 10 V, VGS = 4.5 V, ID ≅ 150 mA | 2 | |
| Input Capacitance | Ciss | 25 | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 5 | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 2 | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Turn-On Time | td(on) | 20 | ns | VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω | 2 | ||
| Turn-Off Time | td(off) | 30 | ns | VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω | 2 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
AP2N7002K-HF-VB - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
ap2n7002k-hf-vb-etched.step/ap2n7002k-hf-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap2n7002k-hf-vb.step/ap2n7002k-hf-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
8263f891d52c6bbf, retrieved 2026-11-13, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).