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AP2953AS8PRG
Public Made by Adomby adom
Wuxi Chipown Micro electronics DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ap2953as8prg: specified limits as data (metadata.characteristics, 39 rows from the datasheet)
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20d ago
AP2953AS8PRG
Wuxi Chipown Micro electronics · DC-DC Converters · ESOP-8
AP2953AS8PRG from Wuxi Chipown Micro electronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | power_in | Bootstrap input that drives the high-side N-MOSFET gate; a 0.01uF or larger capacitor is connected from SW to BS. |
| 2 | IN | power_in | Power input for the IC and the buck converter switch, driven over 4.75V to 18V and bypassed to GND with a suitable large capacitor. |
| 3 | SW | power_out | Power switch output at the switching node, connected to the output LC filter; a capacitor is required from SW to BS. |
| 4 | GND | power_in | Power ground; the exposed pad is connected to pin 4. |
| 5 | FB | input | Feedback input sensing the output voltage through a resistor divider, with a feedback threshold of 0.925V. |
| 6 | COMP | passive | Compensation node for the control loop, requiring an RC network to GND and sometimes an additional capacitor to GND. |
| 7 | EN | input | Digital enable input that turns the regulator on when driven high and off when driven low; a 100kΩ pull-up to IN is needed for automatic start-up. |
| 8 | SS | input | Soft-start control input where a capacitor to GND sets the soft-start time (0.1µF gives 15 ms), and leaving it unconnected disables soft-start. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi Chipown Micro electronics |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback voltage | VFB | 900 | 925 | 946 | mV | 4.75V≤VIN≤18V | 3 |
| EN turn-off threshold voltage (rising) | VEN | 1.1 | 1.3 | 1.5 | V | VEN rising | 3 |
| EN lockout threshold voltage | VEN | 2.2 | 2.5 | 2.7 | V | 3 | |
| Undervoltage lockout threshold | VIN | 3.8 | 4.05 | 4.4 | V | VIN rising | 3 |
| Oscillator frequency | fOSC | 310 | 370 | 390 | KHz | 3 | |
| Upper switch leakage current | ILEAK | 0 | 10 | µA | VEN = 0V, VSW = 0V | 3 | |
| Upper switch current limit | ILIM | 4 | 6 | A | 3 | ||
| Shutdown supply current | IQ | 0.3 | 3 | µA | VEN ≤ 0.3V | 3 | |
| Supply current | IQ | 1.3 | 1.5 | mA | VEN =2.0V, VFB = 1.0V | 3 | |
| Feedback overvoltage threshold | VFB_OVP | 1.1 | V | 3 | |||
| Error amplifier voltage gain | AVEA | 480 | V/V | 3 | |||
| Error amplifier transconductance | GEA | 800 | µA/V | ΔIC = ±10μA | 3 | ||
| Upper switch on-resistance | RDS(ON) | 100 | mΩ | 3 | |||
| Lower switch on-resistance | RDS(ON) | 100 | mΩ | 3 | |||
| Lower switch current limit | ILIM | 0.9 | A | 3 | |||
| COMP pin current sense transconductance | GCS | 5.2 | A/V | 3 | |||
| Short-circuit frequency | fSC | 150 | KHz | VFB = 0V | 3 | ||
| Maximum duty cycle | DMAX | 90 | % | VFB = 1.0V | 3 | ||
| Minimum on-time | tON(MIN) | 220 | nS | 3 | |||
| EN turn-off threshold hysteresis | VEN | 40 | mV | 3 | |||
| EN lockout hysteresis | VEN | 210 | mV | 3 | |||
| Undervoltage lockout hysteresis | VIN | 210 | mV | 3 | |||
| Soft-start current | ISS | 6 | µA | VSS = 0V | 3 | ||
| Soft-start time | tSS | 15 | ms | CSS = 0.1μF | 4 | ||
| Thermal shutdown temperature | TSD | 160 | °C | 4 | |||
| Input voltage (VIN) absolute maximum | VIN | -0.3 | 20 | V | 3 | ||
| Switch voltage (VSW) | VSW | -1 | 0.3 | V | Printed as -1V ~ VIN + 0.3V; max is relative to VIN | 3 | |
| Bootstrap voltage (VBS) | VBS | -0.3 | 6 | V | Printed as VSW-0.3V ~ VSW + 6V; referenced to VSW | 3 | |
| EN voltage (VEN) | VEN | -0.3 | 6 | V | 3 | ||
| COMP voltage (VCOMP) | VCOMP | -0.3 | 6 | V | 3 | ||
| Feedback voltage (VFB) | VFB | -0.3 | 6 | V | 3 | ||
| Junction temperature | TJ | 150 | ℃ | 3 | |||
| Lead temperature (soldering) | TLEAD | 260 | ℃ | 10s | 3 | ||
| Storage temperature | TSTG | -65 | 150 | ℃ | 3 | ||
| Input voltage (VIN) recommended | VIN | 4.75 | 18 | V | 3 | ||
| Output voltage (VSW) recommended | VSW | 0.925 | 15 | V | 3 | ||
| Operating temperature | TA | -40 | 85 | ℃ | 3 | ||
| Junction-to-ambient thermal resistance | θJA | 50 | ℃/W | 1 in² with 1 oz copper (note 2) | 3 | ||
| Junction-to-case thermal resistance | θJC | 10 | ℃/W | 3 |
CAD (KiCad official)
- Symbol:
AP2953AS8PRG - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
ap2953as8prg-etched.step/ap2953as8prg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap2953as8prg.step/ap2953as8prg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Wuxi Chipown Micro electronics datasheet (8 pp, sha256
a374357607b1121e, retrieved 2026-10-09, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AP2953AS8PRG
**Wuxi Chipown Micro electronics** · DC-DC Converters · ESOP-8
AP2953AS8PRG from Wuxi Chipown Micro electronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | power_in | Bootstrap input that drives the high-side N-MOSFET gate; a 0.01uF or larger capacitor is connected from SW to BS. |
| 2 | IN | power_in | Power input for the IC and the buck converter switch, driven over 4.75V to 18V and bypassed to GND with a suitable large capacitor. |
| 3 | SW | power_out | Power switch output at the switching node, connected to the output LC filter; a capacitor is required from SW to BS. |
| 4 | GND | power_in | Power ground; the exposed pad is connected to pin 4. |
| 5 | FB | input | Feedback input sensing the output voltage through a resistor divider, with a feedback threshold of 0.925V. |
| 6 | COMP | passive | Compensation node for the control loop, requiring an RC network to GND and sometimes an additional capacitor to GND. |
| 7 | EN | input | Digital enable input that turns the regulator on when driven high and off when driven low; a 100kΩ pull-up to IN is needed for automatic start-up. |
| 8 | SS | input | Soft-start control input where a capacitor to GND sets the soft-start time (0.1µF gives 15 ms), and leaving it unconnected disables soft-start. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi Chipown Micro electronics |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback voltage | VFB | 900 | 925 | 946 | mV | 4.75V≤VIN≤18V | 3 |
| EN turn-off threshold voltage (rising) | VEN | 1.1 | 1.3 | 1.5 | V | VEN rising | 3 |
| EN lockout threshold voltage | VEN | 2.2 | 2.5 | 2.7 | V | | 3 |
| Undervoltage lockout threshold | VIN | 3.8 | 4.05 | 4.4 | V | VIN rising | 3 |
| Oscillator frequency | fOSC | 310 | 370 | 390 | KHz | | 3 |
| Upper switch leakage current | ILEAK | 0 | | 10 | µA | VEN = 0V, VSW = 0V | 3 |
| Upper switch current limit | ILIM | 4 | | 6 | A | | 3 |
| Shutdown supply current | IQ | | 0.3 | 3 | µA | VEN ≤ 0.3V | 3 |
| Supply current | IQ | | 1.3 | 1.5 | mA | VEN =2.0V, VFB = 1.0V | 3 |
| Feedback overvoltage threshold | VFB_OVP | | 1.1 | | V | | 3 |
| Error amplifier voltage gain | AVEA | | 480 | | V/V | | 3 |
| Error amplifier transconductance | GEA | | 800 | | µA/V | ΔIC = ±10μA | 3 |
| Upper switch on-resistance | RDS(ON) | | 100 | | mΩ | | 3 |
| Lower switch on-resistance | RDS(ON) | | 100 | | mΩ | | 3 |
| Lower switch current limit | ILIM | | 0.9 | | A | | 3 |
| COMP pin current sense transconductance | GCS | | 5.2 | | A/V | | 3 |
| Short-circuit frequency | fSC | | 150 | | KHz | VFB = 0V | 3 |
| Maximum duty cycle | DMAX | | 90 | | % | VFB = 1.0V | 3 |
| Minimum on-time | tON(MIN) | | 220 | | nS | | 3 |
| EN turn-off threshold hysteresis | VEN | | 40 | | mV | | 3 |
| EN lockout hysteresis | VEN | | 210 | | mV | | 3 |
| Undervoltage lockout hysteresis | VIN | | 210 | | mV | | 3 |
| Soft-start current | ISS | | 6 | | µA | VSS = 0V | 3 |
| Soft-start time | tSS | | 15 | | ms | CSS = 0.1μF | 4 |
| Thermal shutdown temperature | TSD | | 160 | | °C | | 4 |
| Input voltage (VIN) absolute maximum | VIN | -0.3 | | 20 | V | | 3 |
| Switch voltage (VSW) | VSW | -1 | | 0.3 | V | Printed as -1V ~ VIN + 0.3V; max is relative to VIN | 3 |
| Bootstrap voltage (VBS) | VBS | -0.3 | | 6 | V | Printed as VSW-0.3V ~ VSW + 6V; referenced to VSW | 3 |
| EN voltage (VEN) | VEN | -0.3 | | 6 | V | | 3 |
| COMP voltage (VCOMP) | VCOMP | -0.3 | | 6 | V | | 3 |
| Feedback voltage (VFB) | VFB | -0.3 | | 6 | V | | 3 |
| Junction temperature | TJ | | | 150 | ℃ | | 3 |
| Lead temperature (soldering) | TLEAD | | | 260 | ℃ | 10s | 3 |
| Storage temperature | TSTG | -65 | | 150 | ℃ | | 3 |
| Input voltage (VIN) recommended | VIN | 4.75 | | 18 | V | | 3 |
| Output voltage (VSW) recommended | VSW | 0.925 | | 15 | V | | 3 |
| Operating temperature | TA | -40 | | 85 | ℃ | | 3 |
| Junction-to-ambient thermal resistance | θJA | | 50 | | ℃/W | 1 in² with 1 oz copper (note 2) | 3 |
| Junction-to-case thermal resistance | θJC | | 10 | | ℃/W | | 3 |
## CAD (KiCad official)
- Symbol: `AP2953AS8PRG`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `ap2953as8prg-etched.step` / `ap2953as8prg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap2953as8prg.step` / `ap2953as8prg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Wuxi Chipown Micro electronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588881122034270208) (8 pp, sha256 `a374357607b1121e`, retrieved 2026-10-09, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ap2953as8prg-datasheet.pdf)