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AP2952AS8PRG

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Wuxi Chipown Micro electronics DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AP2952AS8PRG

Wuxi Chipown Micro electronics · DC-DC Converters · ESOP-8

AP2952AS8PRG from Wuxi Chipown Micro electronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BS passive Bootstrap input that drives the high-side N-channel MOSFET switch; a 0.01uF or larger capacitor must be connected from SW to BS.
2 IN power_in Power input for the IC and the buck converter switch, driven in the 4.75V to 18V range and bypassed to GND with a suitably large capacitor to remove input noise.
3 SW output Power switch output that provides the switching node; the output LC filter connects from SW to the load, and a capacitor is required between SW and BS.
4 GND power_in Power ground; the exposed pad is connected to pin 4.
5 FB input Feedback input that senses the output voltage through a resistor divider and regulates it to a feedback threshold of 0.925V.
6 COMP passive Compensation node for the control loop, using an RC network from COMP to GND and sometimes an additional COMP-to-GND capacitor.
7 EN input Digital enable input where driving it high turns the regulator on and driving it low turns it off; automatic start-up requires a 100 kΩ pull-up resistor.
8 SS passive Soft-start control input where a capacitor from SS to GND sets the soft-start time (0.1μF gives 15 ms), and leaving it unconnected disables soft-start.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Wuxi Chipown Micro electronics
Package ESOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Shutdown supply current 1 3 µA VEN ≤ 0.3V 3
Supply current 1.3 1.5 mA VEN = 2.0V, VFB = 1.0V 3
Feedback voltage 900 925 946 mV 4.75V≤VIN≤18V 3
High-side switch current limit 2.4 3.4 A 3
EN turn-off threshold voltage (rising) VEN 1.1 1.5 2 V VEN Rising 3
EN lockout threshold voltage 2.2 2.5 2.7 V 3
Undervoltage lockout threshold 3.8 4.1 4.4 V VIN Rising 3
Input voltage (absolute maximum) VIN -0.3 20 V 3
Switch voltage (absolute maximum) VSW -1 V Maximum printed as VIN + 0.3V 3
Bootstrap voltage (absolute maximum) VBS -0.3 6 V Referenced to VSW (printed as VSW-0.3V to VSW+6V) 3
EN/UVLO voltage (absolute maximum) VEN -0.3 6 V 3
COMP voltage (absolute maximum) VCOMP -0.3 6 V 3
Feedback voltage (absolute maximum) VFB -0.3 6 V 3
Junction temperature (absolute maximum) 150 °C 3
Lead temperature (absolute maximum) 260 °C Soldering, 10s 3
Storage temperature (absolute maximum) -65 150 °C 3
Input voltage (recommended) VIN 4.75 18 V 3
Output voltage (recommended) 0.925 15 V 3
Operating temperature (recommended) -40 85 °C 3
EN turn-off threshold hysteresis 40 mV 3
EN lockout hysteresis 210 mV 3
UVLO hysteresis 210 mV 3
Feedback overvoltage threshold 1.1 V 3
Error amplifier voltage gain 400 V/V 3
Error amplifier transconductance 800 µA/V ΔIC = ±10μA 3
High-side switch on-resistance 130 mΩ 3
Low-side switch on-resistance 130 mΩ 3
High-side switch leakage current 10 µA VEN = 0V, VSW = 0V 3
Low-side switch current limit 1.1 A 3
COMP current-sense transconductance 3.5 А/V 3
Oscillator frequency 450 KHz 3
Short-circuit frequency 150 KHz VFB = 0V 3
Maximum duty cycle 90 % VFB = 1.0V 3
Minimum on-time 220 nS 3
Soft-start current 6 µA VSS = 0V 4
Soft-start time 15 ms CSS = 0.1μF 4
Thermal shutdown temperature 160 °C 4
Junction-to-ambient thermal resistance θJA 50 ℃/W 1 in² with 1 oz copper (note 2) 3
Junction-to-case thermal resistance θJC 10 ℃/W 3

CAD (KiCad official)

  • Symbol: AP2952AS8PRG
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: ap2952as8prg-etched.step / ap2952as8prg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2952as8prg.step / ap2952as8prg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi Chipown Micro electronics datasheet (8 pp, sha256 15966dc6ef16c619, retrieved 2026-10-14, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF