# AP2302GN-HF

**APEC Advanced Power Elec** · MOSFETs · SOT-23

AP2302GN-HF from APEC Advanced Power Elec, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±12V, threshold 0.5V to 1.2V, capable of 2.5V gate drive. |
| 2 | S | passive | Source; body diode continuous current 1A, pulsed 10A. |
| 3 | D | passive | Drain; drain-source voltage 20V max, continuous drain current 3.2A at TA=25°C, pulsed 10A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | APEC Advanced Power Elec |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS |  |  | 20 | V |  | 1 |
| Gate-Source Voltage | VGS | -12 |  | 12 | V | Printed as ±12 | 1 |
| Continuous Drain Current | ID |  |  | 3.2 | A | ID@TA=25℃, VGS @ 4.5V | 1 |
| Continuous Drain Current | ID |  |  | 2.6 | A | ID@TA=70℃, VGS @ 4.5V | 1 |
| Pulsed Drain Current | IDM |  |  | 10 | A | Notes 1,2 | 1 |
| Total Power Dissipation | PD |  |  | 1.38 | W | PD@TA=25℃ | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | ℃ |  | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 20 |  |  | V | VGS=0V, ID=250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  |  | 85 | mΩ | VGS=4.5V, ID=3.6A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  |  | 115 | mΩ | VGS=2.5V, ID=3.1A | 2 |
| Gate Threshold Voltage | VGS(th) | 0.5 |  | 1.2 | V | VDS=VGS, ID=250uA | 2 |
| Drain-Source Leakage Current (Tj=25℃) | IDSS |  |  | 1 | uA | VDS=20V, VGS=0V | 2 |
| Drain-Source Leakage Current (Tj=70℃) | IDSS |  |  | 10 | uA | VDS=20V, VGS=0V | 2 |
| Gate-Source Leakage | IGSS | -100 |  | 100 | nA | VGS=±12V | 2 |
| Continuous Source Current (Body Diode) | IS |  |  | 1 | A | VD=VG=0V, VS=1.2V | 2 |
| Pulsed Source Current (Body Diode) | ISM |  |  | 10 | A | Note 1 | 2 |
| Forward On Voltage | VSD |  |  | 1.2 | V | IS=1.6A, VGS=0V | 2 |
| Thermal Resistance Junction-ambient | Rthj-a |  |  | 90 | ℃/W | Surface mounted on 1 in² copper pad of FR4 board (note 3) | 1 |
| Thermal Resistance Junction-ambient (minimum copper pad) | Rthj-a |  |  | 270 | ℃/W | Mounted on min. copper pad (note 3) | 2 |
| Linear Derating Factor |  |  | 0.01 |  | W/℃ |  | 1 |

## CAD (KiCad official)

- Symbol: `AP2302GN-HF`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `ap2302gn-hf-etched.step` / `ap2302gn-hf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap2302gn-hf.step` / `ap2302gn-hf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [APEC Advanced Power Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586182713929289728) (4 pp, sha256 `c02e933d55f94152`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ap2302gn-hf-datasheet.pdf)