component
AP2301GN-HF-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SOT-23(TO-236). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
AP2301GN-HF-VB
VBsemi Elec · MOSFETs · SOT-23(TO-236)
AP2301GN-HF-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel MOSFET; gate-source voltage is rated at ±12 V (absolute maximum). |
| 2 | S | passive | Source of the MOSFET; continuous source-drain diode current is rated at -2.1 A at TC = 25 °C and pulsed diode forward current at -10 A. |
| 3 | D | passive | Drain of the MOSFET; drain-source voltage is rated at -20 V with continuous drain current of -4 A at TC = 25 °C (package limited). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23(TO-236) |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | -20 | V | VDS = 0 V, ID = - 250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | -0.5 | -1.5 | V | VDS = VGS, ID = - 250 µA | 2 | |
| Gate-Source Leakage | IGSS | 100 | nA | VDS = 0 V, VGS = ± 12 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = - 20 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -10 | µA | VDS = - 20 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | -10 | A | VDS ≤ - 5 V, VGS = - 4.5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.06 | Ω | VGS = - 10 V, ID = - 3 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.065 | Ω | VGS = - 4.5 V, ID = - 2.5 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.08 | Ω | VGS = - 2.5 V, ID = - 2 A | 2 | ||
| Gate Resistance | Rg | 0.9 | 4.4 | 8.8 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | 22 | 33 | ns | VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 20 | 30 | ns | VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 28 | 42 | ns | VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 9 | 18 | ns | VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Continuous Source-Drain Diode Current | IS | -2.1 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | -10 | A | 2 | |||
| Body Diode Voltage | VSD | -0.8 | -1.2 | V | IS = - 3.1 A | 2 | |
| Body Diode Reverse Recovery Time | trr | 23 | 35 | ns | IF = - 3.1 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 12 | 20 | nC | IF = - 3.1 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Drain-Source Voltage | VDS | -20 | V | TA = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -12 | 12 | V | TA = 25 °C | 1 | |
| Continuous Drain Current | ID | -4 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | -3.2 | A | TJ = 150 °C, TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | -3.5 | A | TJ = 150 °C, TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | -2.5 | A | TJ = 150 °C, TA = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | -10 | A | 1 | |||
| Continuous Source-Drain Diode Current | IS | -2.1 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | -1 | A | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2.5 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.6 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.25 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 0.8 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 75 | 100 | °C/W | t = 5 s, surface mounted on 1" x 1" FR4 board | 1 | |
| Maximum Junction-to-Foot (Drain) | RthJF | 40 | 50 | °C/W | Steady State | 1 | |
| VDS Temperature Coefficient | ΔVDS/TJ | 13.4 | mV/°C | ID = - 250 µA | 2 | ||
| VGS(th) Temperature Coefficient | ΔVGS(th)/TJ | 2.9 | mV/°C | ID = - 250 µA | 2 | ||
| Forward Transconductance | gfs | 15 | S | VDS = - 5 V, ID = - 3 A | 2 | ||
| Input Capacitance | Ciss | 835 | pF | VDS = - 10 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 180 | pF | VDS = - 10 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 155 | pF | VDS = - 10 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Total Gate Charge | Qg | 10 | nC | VDS = - 10 V, VGS = - 4.5 V, ID = - 3.1 A | 2 | ||
| Total Gate Charge | Qg | 6.4 | nC | VDS = - 10 V, VGS = - 2.5 V, ID = - 3.1 A | 2 | ||
| Gate-Source Charge | Qgs | 1.7 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 3.4 | nC | 2 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
AP2301GN-HF-VB - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
ap2301gn-hf-vb-etched.step/ap2301gn-hf-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap2301gn-hf-vb.step/ap2301gn-hf-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (9 pp, sha256
021cbacc54e99381, retrieved 2026-11-13, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).