component
AP22817BKEWT-7
Public Made by Adomby adom
Diodes Incorporated Power Distribution Switches, TSOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AP22817BKEWT-7
Diodes Incorporated · Power Distribution Switches · TSOT-23-5
AP22817BKEWT-7 from Diodes Incorporated, in a TSOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Voltage output pin; connect a 0.1µF bypass capacitor and a high-value capacitor (at least 10µF in USB applications) to GND, close to the IC. |
| 2 | GND | power_in | Ground pin of the circuitry. |
| 3 | FLG | output | Overcurrent and overtemperature fault report; the open-drain flag is active-low when triggered (about 6 ms deglitch). |
| 4 | EN | input | Enable input; the AP22817B variant is active-low (VIL max 0.5 V, VIH min 1.5 V, and the pin should not be left floating). |
| 5 | IN | power_in | Voltage input pin, rated 2.7 V to 5.5 V; connect a 1µF low-ESR capacitor to GND, close to the IC. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-23-5 |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input UVLO | VUVLO | 1.8 | 2.3 | 2.6 | V | VIN Rising | 4 |
| Input Shutdown Current | ISHDN | 0.1 | 1 | µA | Disabled, OUT = Open | 4 | |
| Input Leakage Current | ILEAK | 0.1 | 1 | µA | Disabled, OUT Grounded | 4 | |
| Reverse Leakage Current | IREV | 0.01 | 1 | µA | Disabled, VIN = 0V, VOUT = 5V, IREV at VIN | 4 | |
| Switch On-Resistance | RDS(ON) | 75 | 95 | mΩ | VIN = 5V, IOUT = 1A TA = +25°C | 4 | |
| Over Load Current Limit (AP22817) | ILIMIT | 1.65 | 2.2 | 2.8 | A | VIN = 5V, VOUT = 4.5V (AP22817) | 4 |
| EN/EN Input Logic Low Voltage | VIL | 0.5 | V | VIN = 2.7V to 5.5V | 4 | ||
| EN/EN Input Logic High Voltage | VIH | 1.5 | V | VIN = 2.7V to 5.5V | 4 | ||
| EN/EN Input Leakage | ILEAK-EN/EN | 0.01 | 1 | µA | VIN = 5V, VEN/EN = 0V and 5.5V | 4 | |
| Output Leakage Current | ILEAK-O | 0.5 | 1 | µA | Disabled, VOUT = 0V | 4 | |
| Output Turn-On Rise Time | tR | 1 | 2.1 | 3.5 | ms | CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 1 | 4 |
| FLG Output FET On-Resistance | RFLG | 30 | 60 | Ω | IFLG = 10mA | 4 | |
| FLG Off Current | IFOH | 0.01 | 1 | µA | VFLG = 5V | 4 | |
| FLG Blanking Time | tBLANK | 2 | 5 | 15 | ms | Assertion or deassertion due to overcurrent and overtemperature condition | 4 |
| Discharge Resistance | RDIS | 140 | 200 | Ω | VIN = 5V, Disabled, IOUT = 1mA | 4 | |
| Reverse-Voltage Comparator Trip Point | VRVP | 35 | 70 | 105 | mV | VOUT - VIN | 4 |
| Time from Reverse-Voltage Condition to MOSFET Turn off | tTRIG | 2 | 5 | 15 | ms | VIN | 4 |
| Input Voltage | VIN | 2.7 | 5.5 | V | 3 | ||
| Output Current (AP22817) | IOUT | 0 | 1.5 | A | AP22817 | 3 | |
| EN/EN Input Logic Low Voltage | VIL | 0 | 0.5 | V | 3 | ||
| EN/EN Input Logic High Voltage | VIH | 1.5 | V | 3 | |||
| Operating Ambient Temperature | TA | -40 | 85 | C | 3 | ||
| Human Body ESD Protection | ESD | 2000 | V | HBM | 3 | ||
| Charged Device Model ESD Protection | ESD | 500 | V | CDM | 3 | ||
| Input Voltage | VIN | -0.3 | 6 | V | 3 | ||
| Output Voltage | VOUT | -0.3 | V | 3 | |||
| Enable Voltage | VEN/EN | -0.3 | V | 3 | |||
| Maximum Junction Temperature | TJ(max) | 150 | °C | 3 | |||
| Storage Temperature | TST | -65 | 150 | °C | 3 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 123 | °C/W | TSOT25; Notes 6, 7 | 3 | ||
| Thermal Resistance, Junction to Case | RθJC | 32 | °C/W | TSOT25; Notes 7 | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: TSOT-25: Finish, Matte Tin Plated Leads, Solderable per | 1 |
CAD (KiCad official)
- Symbol:
AP22817BKEWT-7 - Footprint:
Package_TO_SOT_SMD:TSOT-23-5 - 3D model: TSOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
ap22817bkewt-7-etched.step/ap22817bkewt-7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap22817bkewt-7.step/ap22817bkewt-7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (17 pp, sha256
288a4b503a5a9423, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AP22817BKEWT-7
**Diodes Incorporated** · Power Distribution Switches · TSOT-23-5
AP22817BKEWT-7 from Diodes Incorporated, in a TSOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Voltage output pin; connect a 0.1µF bypass capacitor and a high-value capacitor (at least 10µF in USB applications) to GND, close to the IC. |
| 2 | GND | power_in | Ground pin of the circuitry. |
| 3 | FLG | output | Overcurrent and overtemperature fault report; the open-drain flag is active-low when triggered (about 6 ms deglitch). |
| 4 | EN | input | Enable input; the AP22817B variant is active-low (VIL max 0.5 V, VIH min 1.5 V, and the pin should not be left floating). |
| 5 | IN | power_in | Voltage input pin, rated 2.7 V to 5.5 V; connect a 1µF low-ESR capacitor to GND, close to the IC. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-23-5 |
| Category | Power Management (PMIC) |
| Pins | 5 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input UVLO | VUVLO | 1.8 | 2.3 | 2.6 | V | VIN Rising | 4 |
| Input Shutdown Current | ISHDN | | 0.1 | 1 | µA | Disabled, OUT = Open | 4 |
| Input Leakage Current | ILEAK | | 0.1 | 1 | µA | Disabled, OUT Grounded | 4 |
| Reverse Leakage Current | IREV | | 0.01 | 1 | µA | Disabled, VIN = 0V, VOUT = 5V, IREV at VIN | 4 |
| Switch On-Resistance | RDS(ON) | | 75 | 95 | mΩ | VIN = 5V, IOUT = 1A TA = +25°C | 4 |
| Over Load Current Limit (AP22817) | ILIMIT | 1.65 | 2.2 | 2.8 | A | VIN = 5V, VOUT = 4.5V (AP22817) | 4 |
| EN/EN Input Logic Low Voltage | VIL | | | 0.5 | V | VIN = 2.7V to 5.5V | 4 |
| EN/EN Input Logic High Voltage | VIH | 1.5 | | | V | VIN = 2.7V to 5.5V | 4 |
| EN/EN Input Leakage | ILEAK-EN/EN | | 0.01 | 1 | µA | VIN = 5V, VEN/EN = 0V and 5.5V | 4 |
| Output Leakage Current | ILEAK-O | | 0.5 | 1 | µA | Disabled, VOUT = 0V | 4 |
| Output Turn-On Rise Time | tR | 1 | 2.1 | 3.5 | ms | CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 1 | 4 |
| FLG Output FET On-Resistance | RFLG | | 30 | 60 | Ω | IFLG = 10mA | 4 |
| FLG Off Current | IFOH | | 0.01 | 1 | µA | VFLG = 5V | 4 |
| FLG Blanking Time | tBLANK | 2 | 5 | 15 | ms | Assertion or deassertion due to overcurrent and overtemperature condition | 4 |
| Discharge Resistance | RDIS | | 140 | 200 | Ω | VIN = 5V, Disabled, IOUT = 1mA | 4 |
| Reverse-Voltage Comparator Trip Point | VRVP | 35 | 70 | 105 | mV | VOUT - VIN | 4 |
| Time from Reverse-Voltage Condition to MOSFET Turn off | tTRIG | 2 | 5 | 15 | ms | VIN | 4 |
| Input Voltage | VIN | 2.7 | | 5.5 | V | | 3 |
| Output Current (AP22817) | IOUT | 0 | | 1.5 | A | AP22817 | 3 |
| EN/EN Input Logic Low Voltage | VIL | 0 | | 0.5 | V | | 3 |
| EN/EN Input Logic High Voltage | VIH | 1.5 | | | V | | 3 |
| Operating Ambient Temperature | TA | -40 | | 85 | C | | 3 |
| Human Body ESD Protection | ESD | | | 2000 | V | HBM | 3 |
| Charged Device Model ESD Protection | ESD | | | 500 | V | CDM | 3 |
| Input Voltage | VIN | -0.3 | | 6 | V | | 3 |
| Output Voltage | VOUT | -0.3 | | | V | | 3 |
| Enable Voltage | VEN/EN | -0.3 | | | V | | 3 |
| Maximum Junction Temperature | TJ(max) | | | 150 | °C | | 3 |
| Storage Temperature | TST | -65 | | 150 | °C | | 3 |
| Thermal Resistance, Junction to Ambient | RθJA | | 123 | | °C/W | TSOT25; Notes 6, 7 | 3 |
| Thermal Resistance, Junction to Case | RθJC | | 32 | | °C/W | TSOT25; Notes 7 | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminals: TSOT-25: Finish, Matte Tin Plated Leads, Solderable per | 1 |
## CAD (KiCad official)
- Symbol: `AP22817BKEWT-7`
- Footprint: `Package_TO_SOT_SMD:TSOT-23-5`
- 3D model: TSOT-23-5 (KiCad packages3D, STEP)
- 3D model files: `ap22817bkewt-7-etched.step` / `ap22817bkewt-7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap22817bkewt-7.step` / `ap22817bkewt-7.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603207864097910784) (17 pp, sha256 `288a4b503a5a9423`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ap22817bkewt-7-datasheet.pdf)