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Contents

README

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AP2186SG-13

Diodes Incorporated · Power Distribution Switches · SOP-8

AP2186SG-13 from Diodes Incorporated, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN1 input Switch 1 enable input, active low on AP2186 (active high on AP2196), with VIL max 0.8 V, VIH min 2.0 V, and an absolute maximum enable voltage of 6.5 V.
2 FLG1 output Switch 1 over-current and over-temperature fault report, open-drain output that goes active low after a nominal 7 ms deglitch timeout and stays low until both fault conditions are removed.
3 FLG2 output Switch 2 over-current and over-temperature fault report, open-drain output that goes active low after a nominal 7 ms deglitch timeout and stays low until both fault conditions are removed.
4 EN2 input Switch 2 enable input, active low on AP2186 (active high on AP2196), with VIL max 0.8 V, VIH min 2.0 V, and an absolute maximum enable voltage of 6.5 V.
5 OUT2 power_out Switch 2 voltage output; VOUT is limited to VIN + 0.3 V and the recommended maximum continuous load current is 1.5 A.
6 GND power_in Ground reference pin for the device.
7 IN power_in Voltage input pin; recommended input range is 2.7 V to 5.5 V with an absolute maximum of 6.5 V.
8 OUT1 power_out Switch 1 voltage output; VOUT is limited to VIN + 0.3 V and the recommended maximum continuous load current is 1.5 A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input UVLO threshold VUVLO 1.6 1.9 2.5 V RLOAD = 1kΩ 4
Over-load current limit ILIMIT 1.6 2.1 2.6 A VIN = 5V, VOUT = 4.5V, CL = 120µF, -40°C ≤ TA ≤ +85°C 4
Input quiescent current, dual enabled IQ 95 140 µA Dual Enabled, IOUT = 0 4
Input shutdown current ISHDN 0.5 1 µA Disabled, IOUT = 0 4
Input leakage current ILEAK 1 µA Disabled, OUT grounded 4
Reverse leakage current IREV 1 µA Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 4
Switch on-resistance (SO-8) RDS(ON) 100 135 mΩ VIN = 5V, IOUT = 1.5A, -40°C ≤ TA ≤ +85°C 4
Switch on-resistance (SO-8) RDS(ON) 120 160 mΩ VIN = 3.3V, IOUT = 1.5A, -40°C ≤ TA ≤ +85°C 4
FLG blanking time TBlank 4 7 15 ms CL = 68µF 4
FLG output FET on-resistance RFLG 20 40 Ω IFLG =10mA 4
Error flag off current IFOH 0.01 1 µA VFLG = 5V 4
Output turn-on rise time TR 0.6 1.5 ms CL=1µF, RLOAD = 10Ω 4
Output turn-off fall time TF 0.05 0.1 ms CL=1µF, RLOAD = 10Ω 4
EN input logic low voltage VIL 0.8 V VIN = 2.7V to 5.5V 4
EN input logic high voltage VIH 2 V VIN = 2.7V to 5.5V 4
EN input leakage ISINK 1 µA VEN = 5V 4
Input voltage VIN 2.7 5.5 V 3
Output current IOUT 0 1.5 A 3
EN input logic low voltage VIL 0 0.8 V 3
EN input logic high voltage VIH 2 V 3
Operating ambient temperature TA -40 85 C 3
ESD human body model protection ESD HBM 6 kV Human Body Model 3
ESD machine model protection ESD MM 300 V Machine Model 3
Input voltage VIN 6.5 V 3
Enable and flag voltage VEN, VFLG 6.5 V 3
Maximum junction temperature TJ(MAX) 150 C 3
Storage temperature range TST -65 150 C Note 4: UL recognized rating from -30°C to +70°C; Diodes qualified TST from -65°C to +150°C 3
Short-circuit current limit ISHORT 2.1 A Enabled into short circuit, CL = 68µF 4
Current limiting trigger threshold ITrig 2.5 A VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF 4
Short-circuit response time TSHORT 20 µs VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 68µF 4
Output turn-on delay time TD(ON) 0.05 ms CL=1µF, RLOAD = 10Ω 4
Output turn-off delay time TD(OFF) 0.01 ms CL=1µF, RLOAD = 10Ω 4
Thermal shutdown threshold TSHDN 140 C Enabled, RLOAD = 1kΩ 4
Thermal shutdown hysteresis THYS 25 C 4
Thermal resistance junction-to-ambient (SO-8) θJA 110 °C/W Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout (Note 5) 4

CAD (KiCad official)

  • Symbol: AP2186SG-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ap2186sg-13-etched.step / ap2186sg-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2186sg-13.step / ap2186sg-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (17 pp, sha256 8d3d843e06f0fd1a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF