Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

AP2146SG-13

Diodes Incorporated · AC-DC Controllers & Regulators · SOIC-8

AP2146SG-13 from Diodes Incorporated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN1 input Switch 1 enable input, active low on AP2146 (active high on AP2156), with VIL max 0.8V and VIH min 2V.
2 FLG1 tri_state Switch 1 over-current and over-temperature fault report, open-drain output that goes low after a 7ms typical deglitch.
3 FLG2 tri_state Switch 2 over-current and over-temperature fault report, open-drain output that goes low after a 7ms typical deglitch.
4 EN2 input Switch 2 enable input, active low on AP2146 (active high on AP2156), with VIL max 0.8V and VIH min 2V.
5 OUT2 power_out Switch 2 voltage output pin, current limited to 0.8A typical with 0.5A recommended maximum continuous load.
6 GND power_in Ground.
7 IN power_in Voltage input pin, operating range 2.7V to 5.5V, shared by both switches.
8 OUT1 power_out Switch 1 voltage output pin, current limited to 0.8A typical with 0.5A recommended maximum continuous load.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input UVLO VUVLO 1.6 1.9 2.5 V RLOAD = 1kΩ 4
Input Shutdown Current ISHDN 0.5 1 µA Disabled, IOUT = 0 4
Input Quiescent Current, Dual IQ 95 140 µA Enabled, IOUT = 0 4
Input Leakage Current ILEAK 1 µA Disabled, OUT grounded 4
Reverse Leakage Current IREV 1 µA Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 4
Switch On-Resistance (SO-8, 5V) RDS(ON) 100 135 mΩ VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C, SO-8 4
Switch On-Resistance (3.3V) RDS(ON) 120 160 mΩ VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C 4
Short-Circuit Current Limit ISHORT 0.7 A Enabled into short circuit, CL = 68µF 4
Over-Load Current Limit ILIMIT 0.6 0.8 1 A VIN = 5V, VOUT = 4.8V, CL = 120µF, -40°C ≤ TA ≤ +85°C 4
Current Limiting Trigger Threshold ITrig 1 A VIN = VEN, Output Current Slew rate (<100A/WS), CL = 22µF 4
Short-Circuit Response Time TSHORT 20 µs VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 22µF 4
EN Input Logic Low Voltage VIL 0.8 V VIN = 2.7V to 5.5V 4
EN Input Logic High Voltage VIH 2 V VIN = 2.7V to 5.5V 4
EN Input Leakage ISINK 1 µA VEN = 5V 4
Output Turn-On Delay Time TD(ON) 0.05 ms CL=1µF, RLOAD = 10Ω 4
Output Turn-On Rise Time TR 0.6 1.5 ms CL=1µF, RLOAD = 10Ω 4
Output Turn-Off Delay Time TD(OFF) 0.01 ms CL=1µF, RLOAD = 10Ω 4
Output Turn-Off Fall Time TF 0.05 0.1 ms CL=1µF, RLOAD = 10Ω 4
FLG Output FET On-Resistance RFLG 20 40 Ω IFLG =10mA 4
FLG Blanking Time TBlank 4 7 15 ms CIN =10µF, CL = 68µF 4
Thermal Shutdown Threshold TSHDN 140 °C Enabled, RLOAD = 1kΩ 4
Thermal Shutdown Hysteresis 25 °C 4
Thermal Resistance Junction-to-Ambient, SO-8 θJA 110 °C/W SO-8, FR-4 2-layer board, 2oz copper, minimum recommended pad layout 4
Input Voltage (recommended) VIN 2.7 5.5 V TA = +25°C 3
Output Current (recommended) IOUT 0 500 mA TA = +25°C 3
Low-Level Input Voltage on EN (recommended) VIL 0 0.8 V TA = +25°C 3
High-Level Input Voltage on EN (recommended) VIH 2 V TA = +25°C; max printed as VIN 3
Operating Ambient Temperature TA -40 85 °C 3
Input Voltage (abs max) VIN 6.5 V TA = +25°C 3
Output Voltage (abs max) VOUT 0.3 V Printed as VIN +0.3 V; max is the +0.3 V margin above VIN 3
Enable Voltage (abs max) VEN, VFLG 6.5 V TA = +25°C 3
Maximum Junction Temperature TJ(MAX) 150 °C TA = +25°C 3
Storage Temperature Range TST -65 150 °C UL Recognized Rating from -30°C to +70°C 3
ESD Human Body Model ESD HBM 6 kV TA = +25°C 3
ESD Machine Model ESD MM 300 V TA = +25°C 3

CAD (KiCad official)

  • Symbol: AP2146SG-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ap2146sg-13-etched.step / ap2146sg-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2146sg-13.step / ap2146sg-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (17 pp, sha256 ec63110e473b3de8, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF