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ap1509-33sg-13-jsm
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JSMSEMI DC-DC Converters, SOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
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README.mdadded+47@@ -0,0 +1,47 @@+# AP1509-33SG-13-JSM++**JSMSEMI** · DC-DC Converters · SOP-8++AP1509-33SG-13-JSM from JSMSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VIN | power_in | Positive input supply for the IC switching regulator. Absolute maximum 40 V; operating range 4.75 V to 40 V for the 3.3 V version. Requires an input bypass capacitor to minimize voltage transients and supply the switching currents. |+| 2 | Output | output | Power switching output from the internal 3A switch. Voltage at this pin switches between (+VIN − VSAT) and approximately −0.5 V, with a duty cycle approximately VOUT/VIN. PCB copper area on this pin should be minimized to reduce coupling to sensitive circuitry. |+| 3 | FB | input | Output voltage feedback control. Senses the regulated output voltage to complete the feedback loop. Internal reference is 1.235 V; feedback bias current is typically 50 nA (100 nA max). |+| 4 | EN | input | ON/OFF shutdown control input. Pulling this pin below ~1.3 V (VIL ≤ 0.6 V) turns the regulator ON; pulling it above ~1.3 V (VIH ≥ 2.0 V) shuts the regulator down, dropping supply current to ~150 µA (standby ~50 µA typ). Tie to GND if the shutdown feature is not needed. |+| 5 | GND | power_in | Circuit ground. All four GND pins (5, 6, 7, 8) are tied together to the die paddle for heat dissipation and must be connected to the ground plane. |+| 6 | GND | power_in | Circuit ground. All four GND pins (5, 6, 7, 8) are tied together to the die paddle for heat dissipation and must be connected to the ground plane. |+| 7 | GND | power_in | Circuit ground. All four GND pins (5, 6, 7, 8) are tied together to the die paddle for heat dissipation and must be connected to the ground plane. |+| 8 | GND | power_in | Circuit ground. All four GND pins (5, 6, 7, 8) are tied together to the die paddle for heat dissipation and must be connected to the ground plane. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | JSMSEMI |+| Package | SOP-8 |+| Category | PMIC |+| Pins | 8 |++## Ordering variants++- `AP1509-33SG-13-JSM`++## CAD (KiCad official)++- Symbol: `AP1509-33SG-13-JSM`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOP-8 (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [JSMSEMI datasheet](docs/ap1509-33sg-13-jsm-datasheet.pdf) (None pp, sha256 `f72b8cf572cb82e0`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/ap1509-33sg-13-jsm-datasheet.pdf)
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