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AP0603GH-HF-VB

Public Made by Adom

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VBsemi Elec MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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AP0603GH-HF-VB

VBsemi Elec · MOSFETs · TO-252

AP0603GH-HF-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, with VGS(th) of 1.5 V min to 2.5 V max at ID = 250 µA.
2 D passive Drain (also the mounting tab); drain-source voltage rated 30 V, continuous drain current 100 A at TC = 25 °C (package limit 90 A).
3 S passive Source; continuous source-drain diode current 90 A at TC = 25 °C, body diode VSD 1.2 V max at IS = 22 A.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V TA = 25 °C 1
Gate-Source Voltage VGS -20 20 V TA = 25 °C 1
Continuous Drain Current ID 100 A TJ = 175 °C, TC = 25 °C 1
Continuous Drain Current ID 80 A TJ = 175 °C, TC = 70 °C 1
Continuous Drain Current ID 35.8 A TJ = 175 °C, TA = 25 °C 1
Continuous Drain Current ID 27 A TJ = 175 °C, TA = 70 °C 1
Pulsed Drain Current IDM 300 A 1
Single Pulse Avalanche Energy EAS 94.8 mJ L = 0.1 mH 1
Continuous Source-Drain Diode Current IS 90 A TC = 25 °C 1
Maximum Power Dissipation PD 235 W TC = 25 °C 1
Maximum Power Dissipation PD 165 W TC = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 175 °C 1
Junction-to-Ambient RthJA 32 40 °C/W t ≤ 10 sec 1
Junction-to-Case RthJC 0.5 0.6 °C/W Steady State 1
Drain-Source Breakdown Voltage VDS 30 V VGS = 0 V, ID = 250 µA 2
Gate-Source Threshold Voltage VGS(th) 1.5 2.5 V VDS = VGS, ID = 250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 10 µA VDS = 30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) 90 A VDS ≥ 5 V, VGS = 10 V 2
Total Gate Charge Qg 151 227 nC VDS = 15 V, VGS = 10 V, ID = 38.8 A 2
Total Gate Charge Qg 71.5 103 nC VDS = 15 V, VGS = 4.5 V, ID = 28.8 A 2
Gate Resistance Rg 1.4 2.1 Ω f = 1 MHz 2
Turn-On Delay Time td(on) 18 27 ns VDD = 15 V, RL = 0.625 Ω, VGEN = 10 V, Rg = 1 Ω 2
Rise Time tr 11 17 ns VDD = 15 V, RL = 0.625 Ω, VGEN = 10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 70 105 ns VDD = 15 V, RL = 0.625 Ω, VGEN = 10 V, Rg = 1 Ω 2
Fall Time tf 10 15 ns VDD = 15 V, RL = 0.625 Ω, VGEN = 10 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 55 83 ns VDD = 15 V, RL = 0.67 Ω, VGEN = 4.5 V, Rg = 1 Ω 2
Rise Time tr 180 270 ns VDD = 15 V, RL = 0.67 Ω, VGEN = 4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 55 83 ns VDD = 15 V, RL = 0.67 Ω, VGEN = 4.5 V, Rg = 1 Ω 2
Fall Time tf 12 18 ns VDD = 15 V, RL = 0.67 Ω, VGEN = 4.5 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS 120 A TC = 25 °C 2
Pulse Diode Forward Current ISM 120 A 2
Body Diode Voltage VSD 0.8 1.2 V IS = 22 A 2
Body Diode Reverse Recovery Time trr 52 78 ns IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 70.2 105 nC IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C 2
Drain-Source On-State Resistance RDS(on) 0.002 Ω VGS = 10 V, ID = 38.8 A 2
Drain-Source On-State Resistance RDS(on) 0.003 Ω VGS = 4.5 V, ID = 37 A 2
Forward Transconductance gfs 160 S VDS = 15 V, ID = 38.8 A 2
Input Capacitance Ciss 5201 pF VDS = 15 V, VGS = 0 V, f = 1 MHz 2
Output Capacitance Coss 1525 pF VDS = 15 V, VGS = 0 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 770 pF VDS = 15 V, VGS = 0 V, f = 1 MHz 2
Gate-Source Charge Qgs 30 nC 2
Gate-Drain Charge Qgd 24 nC 2

CAD (KiCad official)

  • Symbol: AP0603GH-HF-VB
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: ap0603gh-hf-vb-etched.step / ap0603gh-hf-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap0603gh-hf-vb.step / ap0603gh-hf-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (7 pp, sha256 b12135ecc486e656, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF