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AP0504GH-HF-VB
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VBsemi Elec MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AP0504GH-HF-VB
VBsemi Elec · MOSFETs · TO-252
AP0504GH-HF-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET, with absolute maximum gate-source voltage of ±25 V and threshold VGS(th) of 1.2 to 2.5 V. |
| 2 | D | passive | Drain of the 40 V N-channel MOSFET, rated for 85 A continuous at TC = 25 °C and 250 A pulsed (package limit 110 A). |
| 3 | S | passive | Source of the N-channel MOSFET, with continuous source-drain body diode current rated at 110 A at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 40 | V | TA = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -25 | 25 | V | TA = 25 °C | 1 | |
| Continuous Drain Current | ID | 85 | A | TC = 25 °C, TJ = 175 °C | 1 | ||
| Continuous Drain Current | ID | 70 | A | TC = 70 °C, TJ = 175 °C | 1 | ||
| Continuous Drain Current | ID | 59 | A | TA = 25 °C, TJ = 175 °C | 1 | ||
| Continuous Drain Current | ID | 53 | A | TA = 70 °C, TJ = 175 °C | 1 | ||
| Pulsed Drain Current | IDM | 250 | A | 1 | |||
| Avalanche Current | IAS | 80 | A | L = 0.1 mH | 1 | ||
| Single Pulse Avalanche Energy | EAS | 320 | mJ | L = 0.1 mH | 1 | ||
| Continuous Source-Drain Diode Current | IS | 110 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | 2.6 | A | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 312 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 200 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 3.13 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Junction-to-Ambient Thermal Resistance | RthJA | 32 | 40 | °C/W | Steady State | 1 | |
| Junction-to-Case Thermal Resistance | RthJC | 0.33 | 0.4 | °C/W | Steady State | 1 | |
| Drain-Source Breakdown Voltage | VDS | 40 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 1.2 | 2.5 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 40 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = 40 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | 120 | A | VDS ≥ 5 V, VGS = 10 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.005 | Ω | VGS = 10 V, ID = 30 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.0065 | Ω | VGS = 4.5 V, ID = 20 A | 2 | ||
| Total Gate Charge | Qg | 80 | 120 | nC | VDS = 20 V, VGS = 10 V, ID = 20 A | 2 | |
| Gate Resistance | Rg | 0.85 | 1.3 | Ω | f = 1 MHz | 2 | |
| Turn-On Delay Time | td(on) | 20 | 30 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 11 | 17 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 77 | 115 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 10 | 15 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Turn-On Delay Time | td(on) | 102 | 155 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 62 | 95 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 180 | 270 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 60 | 90 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Continuous Source-Drain Diode Current | IS | 110 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | 200 | A | 2 | |||
| Body Diode Voltage | VSD | 0.8 | 1.2 | V | IS = 20 A | 2 | |
| Body Diode Reverse Recovery Time | trr | 50 | 75 | ns | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 70 | 105 | nC | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Input Capacitance | Ciss | 2380 | pF | VDS = 20 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 550 | pF | VDS = 20 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 250 | pF | VDS = 20 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Forward Transconductance | gfs | 180 | S | VDS = 15 V, ID = 30 A | 2 | ||
| Gate-Source Charge | Qgs | 20 | nC | VDS = 20 V, VGS = 10 V, ID = 20 A | 2 | ||
| Gate-Drain Charge | Qgd | 12 | nC | VDS = 20 V, VGS = 10 V, ID = 20 A | 2 | ||
| VDS Temperature Coefficient | ΔVDS/TJ | 41 | mV/°C | ID = 250 µA | 2 | ||
| VGS(th) Temperature Coefficient | ΔVGS(th)/TJ | -8 | mV/°C | ID = 250 µA | 2 |
CAD (KiCad official)
- Symbol:
AP0504GH-HF-VB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
ap0504gh-hf-vb-etched.step/ap0504gh-hf-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap0504gh-hf-vb.step/ap0504gh-hf-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
b3f10f7a0866c710, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AP0504GH-HF-VB
**VBsemi Elec** · MOSFETs · TO-252
AP0504GH-HF-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET, with absolute maximum gate-source voltage of ±25 V and threshold VGS(th) of 1.2 to 2.5 V. |
| 2 | D | passive | Drain of the 40 V N-channel MOSFET, rated for 85 A continuous at TC = 25 °C and 250 A pulsed (package limit 110 A). |
| 3 | S | passive | Source of the N-channel MOSFET, with continuous source-drain body diode current rated at 110 A at TC = 25 °C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 40 | V | TA = 25 °C | 1 |
| Gate-Source Voltage | VGS | -25 | | 25 | V | TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 85 | A | TC = 25 °C, TJ = 175 °C | 1 |
| Continuous Drain Current | ID | | | 70 | A | TC = 70 °C, TJ = 175 °C | 1 |
| Continuous Drain Current | ID | | | 59 | A | TA = 25 °C, TJ = 175 °C | 1 |
| Continuous Drain Current | ID | | | 53 | A | TA = 70 °C, TJ = 175 °C | 1 |
| Pulsed Drain Current | IDM | | | 250 | A | | 1 |
| Avalanche Current | IAS | | | 80 | A | L = 0.1 mH | 1 |
| Single Pulse Avalanche Energy | EAS | | | 320 | mJ | L = 0.1 mH | 1 |
| Continuous Source-Drain Diode Current | IS | | | 110 | A | TC = 25 °C | 1 |
| Continuous Source-Drain Diode Current | IS | | | 2.6 | A | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 312 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 200 | W | TC = 70 °C | 1 |
| Maximum Power Dissipation | PD | | | 3.13 | W | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 2 | W | TA = 70 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Junction-to-Ambient Thermal Resistance | RthJA | | 32 | 40 | °C/W | Steady State | 1 |
| Junction-to-Case Thermal Resistance | RthJC | | 0.33 | 0.4 | °C/W | Steady State | 1 |
| Drain-Source Breakdown Voltage | VDS | 40 | | | V | VGS = 0 V, ID = 250 µA | 2 |
| Gate-Source Threshold Voltage | VGS(th) | 1.2 | | 2.5 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 40 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 10 | µA | VDS = 40 V, VGS = 0 V, TJ = 55 °C | 2 |
| On-State Drain Current | ID(on) | 120 | | | A | VDS ≥ 5 V, VGS = 10 V | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.005 | Ω | VGS = 10 V, ID = 30 A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.0065 | Ω | VGS = 4.5 V, ID = 20 A | 2 |
| Total Gate Charge | Qg | | 80 | 120 | nC | VDS = 20 V, VGS = 10 V, ID = 20 A | 2 |
| Gate Resistance | Rg | | 0.85 | 1.3 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | | 20 | 30 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 11 | 17 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 77 | 115 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 10 | 15 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Turn-On Delay Time | td(on) | | 102 | 155 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 62 | 95 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 180 | 270 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 60 | 90 | ns | VDD = 20 V, RL = 1.0 Ω, ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Continuous Source-Drain Diode Current | IS | | | 110 | A | TC = 25 °C | 2 |
| Pulse Diode Forward Current | ISM | | | 200 | A | | 2 |
| Body Diode Voltage | VSD | | 0.8 | 1.2 | V | IS = 20 A | 2 |
| Body Diode Reverse Recovery Time | trr | | 50 | 75 | ns | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 70 | 105 | nC | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 |
| Input Capacitance | Ciss | | 2380 | | pF | VDS = 20 V, VGS = 0 V, f = 1 MHz | 2 |
| Output Capacitance | Coss | | 550 | | pF | VDS = 20 V, VGS = 0 V, f = 1 MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 250 | | pF | VDS = 20 V, VGS = 0 V, f = 1 MHz | 2 |
| Forward Transconductance | gfs | | 180 | | S | VDS = 15 V, ID = 30 A | 2 |
| Gate-Source Charge | Qgs | | 20 | | nC | VDS = 20 V, VGS = 10 V, ID = 20 A | 2 |
| Gate-Drain Charge | Qgd | | 12 | | nC | VDS = 20 V, VGS = 10 V, ID = 20 A | 2 |
| VDS Temperature Coefficient | ΔVDS/TJ | | 41 | | mV/°C | ID = 250 µA | 2 |
| VGS(th) Temperature Coefficient | ΔVGS(th)/TJ | | -8 | | mV/°C | ID = 250 µA | 2 |
## CAD (KiCad official)
- Symbol: `AP0504GH-HF-VB`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `ap0504gh-hf-vb-etched.step` / `ap0504gh-hf-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap0504gh-hf-vb.step` / `ap0504gh-hf-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/ap0504gh-hf-vb-datasheet.pdf) (8 pp, sha256 `b3f10f7a0866c710`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ap0504gh-hf-vb-datasheet.pdf)