component
AON6450-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, DFN5x6-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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| aon6450-vb-etched.step | 4d ago |
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AON6450-VB
VBsemi Elec · MOSFETs · DFN5x6-8
AON6450-VB from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source terminal of the N-channel MOSFET (pin 1 marked with dot); drain-source voltage rated 100 V. |
| 2 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current 60 A at TC = 25 °C. |
| 3 | S | passive | Source terminal of the N-channel MOSFET; connect in parallel with the other source pins. |
| 4 | G | input | Gate terminal; gate-source voltage limit is ±20 V with threshold of 3 V to 5 V at ID = 250 µA. |
| 5 | D | passive | Drain terminal of the N-channel MOSFET; continuous drain current 65 A at TC = 25 °C. |
| 6 | D | passive | Drain terminal of the N-channel MOSFET; pulsed drain current 180 A (t = 100 µs). |
| 7 | D | passive | Drain terminal of the N-channel MOSFET; connect in parallel with the other drain pins. |
| 8 | D | passive | Drain terminal of the N-channel MOSFET; drain-source breakdown voltage minimum 100 V. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | DFN5x6-8 |
| Category | Transistors/Thyristors |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 100 | V | 1 | |||
| Gate-source voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous drain current | ID | 65 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous drain current | ID | 60 | A | TC = 70 °C | 1 | ||
| Continuous drain current | ID | 20 | A | TA = 25 °C; notes b, c | 1 | ||
| Continuous drain current | ID | 18.5 | A | TA = 70 °C; notes b, c | 1 | ||
| Pulsed drain current | IDM | 180 | A | t = 100 μs | 1 | ||
| Continuous source-drain diode current | IS | 60 | A | TC = 25 °C | 1 | ||
| Continuous source-drain diode current | IS | 4.8 | A | TA = 25 °C; notes b, c | 1 | ||
| Single pulse avalanche current | IAS | 30 | A | L = 0.1 mH | 1 | ||
| Single pulse avalanche energy | EAS | 40 | mJ | 1 | |||
| Maximum power dissipation | PD | 80 | W | TC = 25 °C | 1 | ||
| Maximum power dissipation | PD | 50 | W | TC = 70 °C | 1 | ||
| Maximum power dissipation | PD | 5 | W | TA = 25 °C; notes b, c | 1 | ||
| Maximum power dissipation | PD | 3.2 | W | TA = 70 °C; notes b, c | 1 | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering recommendations (peak temperature) | 260 | °C | note c | 1 | |||
| Maximum junction-to-ambient | RthJA | 20 | 25 | °C/W | t ≤ 10 s; notes b, c | 1 | |
| Maximum junction-to-case (drain), steady state | RthJC | 1.6 | 2 | °C/W | Steady state | 1 | |
| Drain-source breakdown voltage | VDS | 100 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-source threshold voltage | VGS(th) | 3 | 5 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-source leakage | IGSS | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | ||
| Zero gate voltage drain current | IDSS | 1 | μA | VDS = 100 V, VGS = 0 V | 2 | ||
| Zero gate voltage drain current | IDSS | 15 | μA | VDS = 100 V, VGS = 0 V, TJ = 70 °C | 2 | ||
| On-state drain current | ID(on) | 40 | A | VDS ≥ 10 V, VGS = 10 V | 2 | ||
| Gate resistance | Rg | 0.2 | 0.76 | 1.4 | Ω | f = 1 MHz | 2 |
| Turn-on delay time | td(on) | 12 | 24 | ns | VDD = 50 V, RL = 5, ID 10 A, VGEN = 10 V, Rg = 1 | 2 | |
| Rise time | tr | 5 | 10 | ns | VDD = 50 V, RL = 5, ID 10 A, VGEN = 10 V, Rg = 1 | 2 | |
| Turn-off delay time | td(off) | 19 | 38 | ns | VDD = 50 V, RL = 5, ID 10 A, VGEN = 10 V, Rg = 1 | 2 | |
| Fall time | tf | 5 | 10 | ns | VDD = 50 V, RL = 5, ID 10 A, VGEN = 10 V, Rg = 1 | 2 | |
| Turn-on delay time | td(on) | 15 | 30 | ns | VDD = 50 V, RL = 5, ID 10 A, VGEN = 7.5 V, Rg = 1 | 2 | |
| Rise time | tr | 6 | 12 | ns | VDD = 50 V, RL = 5, ID 10 A, VGEN = 7.5 V, Rg = 1 | 2 | |
| Continuous source-drain diode current | IS | 60 | A | TC = 25 °C | 2 | ||
| Pulse diode forward current | ISM | 80 | A | 2 | |||
| Body diode voltage | VSD | 0.78 | 1.1 | V | IS = 5 A, VGS = 0 V | 2 | |
| Body diode reverse recovery time | trr | 43 | 86 | ns | IF = 10 A, di/dt = 100 A/μs, TJ = 25 °C | 2 | |
| Body diode reverse recovery charge | Qrr | 72 | 144 | nC | IF = 10 A, di/dt = 100 A/μs, TJ = 25 °C | 2 | |
| VDS temperature coefficient | VDS/TJ | 81 | mV/°C | ID = 10 mA | 2 | ||
| VGS(th) temperature coefficient | VGS(th) | -7.5 | mV/°C | ID = 250 μA | 2 | ||
| Drain-source on-state resistance | RDS(on) | 0.009 | Ω | VGS = 10 V, ID = 10 A | 2 | ||
| Drain-source on-state resistance | RDS(on) | 0.012 | Ω | VGS = 7.5 V, ID = 10 A | 2 | ||
| Forward transconductance | gfs | 46 | S | VDS = 15 V, ID = 10 A | 2 | ||
| Input capacitance | Ciss | 3970 | pF | VDS = 50 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output capacitance | Coss | 132 | pF | VDS = 50 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse transfer capacitance | Crss | 11.2 | pF | VDS = 50 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Total gate charge | Qg | 20 | nC | VDS = 50 V, VGS = 10 V, ID = 10 A | 2 | ||
| Total gate charge | Qg | 15 | nC | VDS = 50 V, VGS = 7.5 V, ID = 10 A | 2 | ||
| Gate-source charge | Qgs | 6.45 | nC | 2 | |||
| Gate-drain charge | Qgd | 3.5 | nC | 2 | |||
| Output charge | Qoss | 22 | nC | VDS = 50 V, VGS = 0 V | 2 | ||
| Reverse recovery fall time | ta | 33 | ns | 2 | |||
| Reverse recovery rise time | tb | 10 | ns | 2 |
CAD (KiCad official)
- Symbol:
AON6450-VB - Footprint:
Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm - 3D model: DFN5x6-8 (KiCad packages3D, STEP)
- 3D model files:
aon6450-vb-etched.step/aon6450-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aon6450-vb.step/aon6450-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
3f22604758100864, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).