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AON6362-HXY

HXY MOSFET · MOSFETs · DFN5X6-8L

AON6362-HXY from HXY MOSFET, in a DFN5X6-8L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the N-channel MOSFET, pin 1 marked on the package drawing; VDS rated 30V.
2 S passive Source of the N-channel MOSFET, tied with the other source pins.
3 S passive Source of the N-channel MOSFET, tied with the other source pins.
4 G input Gate of the N-channel MOSFET, with absolute maximum VGS of ±20V and threshold of 1.2V to 2.5V.
5 D passive Drain of the N-channel MOSFET, connected to the exposed drain pad; continuous ID of 60A at TC=25℃.
6 D passive Drain of the N-channel MOSFET, connected to the exposed drain pad; pulsed IDM of 160A.
7 D passive Drain of the N-channel MOSFET, connected to the exposed drain pad; VDS rated 30V.
8 D passive Drain of the N-channel MOSFET, connected to the exposed drain pad; RDS(ON) below 7mΩ at VGS=10V.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN5X6-8L
Category Transistors/Thyristors
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ 60 A VGS @ 10V 1
Continuous Drain Current ID@TC=100℃ 42 A VGS @ 10V 1
Pulsed Drain Current IDM 160 A 1
Single Pulse Avalanche Energy EAS 115.2 mJ VDD=25V,VGS=10V,L=0.1mH,IAS=48A (note 3) 1
Avalanche Current IAS 48 A 1
Total Power Dissipation PD@TC=25℃ 59 W TC=25℃ (note 4: limited by 150℃ junction temperature) 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-Ambient RθJA 62 ℃/W Note 1: surface mounted on 1 inch2 FR-4 board with 2OZ copper 1
Thermal Resistance Junction-Case RθJC 2.1 ℃/W Note 1: surface mounted on 1 inch2 FR-4 board with 2OZ copper 1
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 5.7 7 mΩ VGS=10V, ID=30A 2
Static Drain-Source On-Resistance RDS(ON) 11 13 mΩ VGS=4.5V, ID=15A 2
Gate Threshold Voltage VGS(th) 1.2 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=24V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 5 uA VDS=24V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 81 A VG=VD=0V, Force Current (notes 1,5) 2
Pulsed Source Current ISM 160 A notes 2,5 2
Diode Forward Voltage VSD 1 V VGS=0V, IS=1A, TJ=25℃ 2

CAD (KiCad official)

  • Symbol: AON6362-HXY
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN5X6-8L (KiCad packages3D, STEP)
  • 3D model files: aon6362-hxy-etched.step / aon6362-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aon6362-hxy.step / aon6362-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 8929c2b491e1e81a, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF